Raytheon Company

Other

Michael T Borkowski

Christopher M Laighton

Michael P Martinez

Kassam K Bellahrossi

Kenneth P Walsh, Jr

Erin K Nolan

Christopher J Yafrate

Thomas Lulsdorf

Derek P Rocca

Bryan J Cavener

Thomas V Sikina

Thomas C Stoneberg

Alan J Bielunis

John W Roman

Barry Altschul

David G Laighton

A system and apparatus is provided for a modular radar system. The modular radar system can include a plurality of radar system modules that can be detachably coupled and can include a configurable number of radio-frequency (RF) transmit and receive assemblies. The RF transmit and receive assemblies can include radiating element(s) that emit electromagnetic radiation. The plurality of radar system modules can also include at least one processor coupled to control power of the electromagnetic radiation and/or at least one controller to control the RF transmit and receive assembly, the power unit and the digital receiver and exciter module, at least one digital receiver and exciter to convert RF to digital in receive mode, and digital to RF in transmit mode, and/or at least one RF beamformer to generate one or more RF beams.

Systems and methods for modular radar systems

An attenuator module having a substrate; a attenuator disposed on one surface of the substrate, the attenuator having an input terminal at one end of the attenuator and an output terminal at an opposite end of the attenuator; an electrical conductor disposed on an opposite surface of the substrate; and an electrically conductive via passing from the output terminal through the substrate to the electrical conductor disposed on the opposite surface of the substrate.

Microwave attenuator module

An attenuator module having an attenuator disposed on a top surface of a substrate, an input terminal at one end of the attenuator and an output terminal at an opposite end of the attenuator. A pair of spaced electrical conductor pads is disposed on a bottom surface of the substrate, a first one of the pads being disposed under the input terminal and a second one of the pads being disposed under the output terminal. A pair of conductive vias passes through the substrate, one conductive via connecting the input terminal to the first one of the pads and the other conductive via connecting the output terminal to the second one of the pads. The module may be used to interconnect two adjacent circuit substrates.

Radio frequency (RF) series attenuator module for bridging two RF transmission lines on adjacent circuit substrates

Plastic shopping bag holder

A microwave solid interface module having transmit and receive functionality includes a substrate supporting microwave, logic, and DC bias circuits. In one embodiment, the substrate can be formed from BeO. The module can include a BGA package that provides a connector-less interface for RF, DC, and thermal connections to a supporting module. The BGA structure provides vertical connections between the BGA solder balls and a respective DC signal layer, a microwave signal layer, and a thermally conductive core within the supporting module.

Solid interface module

A microwave transistor package is provided having a thermal and electrical conductive refractory type substrate. A ground plane plate is provided, such plate having an open-ended compartment therein, the open end of such compartment being disposed adjacent an upper surface portion of the ground plane plate. A bottom surface of such plate is disposed on an upper, inner surface region of the substrate. The thermal coefficient of expansion of the ground plane plate is substantially greater than the thermal coefficient of expansion of the substrate. An electrical insulator is disposed within the compartment, such insulator having a relatively high thermal transfer characteristic and having upper and lower conductive layers with side wall portions disposed adjacent side wall portions of the compartment. A first apertured ceramic insulating layer having conductive metallization regions disposed on the upper surface of the ceramic insulator extending from the apertured edge of the ceramic insulator to the outer edge of the ceramic insulator is provided. The lower surface of the ceramic insulator is disposed over the substrate and about peripheral portions of the inner surface region of the substrate. A second apertured ceramic insulating layer is disposed over and aligned with the first apertured ceramic insulating layer, the upper surface of the second ceramic insulating layer being metallized and bondable to a cover for such package. The package is fabricated by brazing together, in a single step, the pair of ceramic insulating layers, the electrical insulator and the substrate.

Microwave transistor package

Growing community of inventors

Bedford, NH, United States of America

Michael T Borkowski