Illinois Tool Works Inc.

Michael Surenbrock

Andreas Pahl

Dieter Bernhard Heerdt

Markus Trabelsi

Thomas Grupe

An apparatus for the intermittent application of a liquid to pasty medium onto an application surface, comprising an application valve which can be switched between an open and a closed state and is intended for dispensing the medium onto the application surface, a volumetric delivery pump for metering a volume of the medium to be passed on to the application valve, and a drive for operating the volumetric delivery pump is, inter alia, described and illustrated. The characteristic feature consists in that the apparatus has an electronic controller which, in each case cyclically, activates the drive and the application valve in dependence on each other.

Apparatus for the intermittent application of a liquid to pasty medium onto an application surface

Disclosed is an apparatus () for the application of a liquid to viscous medium () onto an application surface (), comprising a port () for providing a connection between the apparatus () and a supply of said liquid to viscous medium () upstream of the apparatus (), at least two volumetric delivery pumps () for metering volumes of said medium, said volumetric delivery pumps () being located downstream of said port (), each volumetric delivery pump () being in fluid connection with an application valve () of the apparatus (), located downstream of the volumetric delivery pump () for passing a metered volume of the medium () from the delivery pump () to said application valve (). It is characteristic that the apparatus () comprises a flow meter () in fluid connection with said volumetric delivery pumps (), which flow meter () is located upstream of said volumetric delivery pumps ().

Apparatus for the application of a liquid or viscous medium

A hot melt adhesive material dispensing system includes a communication system for transmitting information or data between the adhesive supply unit (ASU) and one or more applicator heads, wherein the number of hard wires actually interconnecting the adhesive supply unit (ASU) and the one or more hot melt adhesive material dispensing applicator heads can be reduced by the employment of signal couplers. In addition, the number of applicator heads that can be utilized in conjunction with a particular adhesive supply unit (ASU) can be increased by incorporating the temperature controller, normally disposed upon the adhesive supply unit (ASU), upon the applicator head.

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Krefeld, Germany

Michael Surenbrock