Robert Boschgmbh

Michael Stumber

Franz Laermer

Christoph Schelling

Benedikt Stein

Dick Scholten

Rolf Scheben

Ando Feyh

Fabian Purkl

Martina Daub

Ricardo Ehrenpfordt

Jochen Rupp

Thomas Buck

Tjalf Pirk

Ralf Reichenbach

Julia Cassemeyer

Christian Maeurer

Fabian Utermoehlen

Gottfried Flik

Stefan Leidich

Christian Dorrer

Martin Stelzle

Andreas Merz

Heinz Eisenschmid

Peter Rothacher

Oliver Stoll

Holger Hoefer

Stephan Rittler

Klaus Offterdinger

Theresa Lutz

Stefan Apelt

Maximilian Amberger

Carsten Raudzis

Stefan Muelders

Massimo Kubon

Sanghmitra Gupta

Meike Moschallski

Ralf Stein

Tom Collins

Seda Tacer

Irene Dahl

Alan Halil

A method for producing damper structures on a micromechanical wafer. The method includes: (A) providing an edge adhesive film and a molding wafer, which includes a first side having a molding structure; (B) applying the edge adhesive film to the first side of the molding wafer at a low atmospheric pressure; (C) joining the edge adhesive film to the first side of the molding wafer by increasing the atmospheric pressure; (D) filling the molding structures with an adhesive; (E) curing the adhesive to form damper structures; (F) bonding the damper structures to a second side of a micromechanical wafer.

Method for producing damper structures on a micromechanical wafer

A method for producing a micromechanical device having a damper structure. The method includes: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side in order to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix.

Method for producing a micromechanical device having a damper structure

A method for producing damper structures on a micromechanical wafer. The method includes: providing an at least partially UV-transparent master mold for molding damper structures; inserting and pressing a micromechanical wafer into the master mold so that micromechanical structures in the wafer are aligned in relation to the damper structures; filling the master mold with UV-curing LSR and subsequent UV irradiation; and mold release and removal of the connected structure of the micromechanical wafer with attached dampers. A method for producing a singulated MEMS chip comprising a UV-cured damper is also described.

A method for determining an injection process of an injection appliance includes injecting a fluid with the injection appliance and applying an electrical signal to at least one helical spring of the injection appliance coupled to a dosing wheel of the injection appliance. The method also comprises detecting an inductance value of the at least one helical spring. A number of windings of the at least one helical spring is dependent on a set rotation angle of the dosing wheel. The set rotation angle corresponds to a dose quantity of the fluid that is preselected for the injection process. The method moreover includes making available a determination signal representing the determined injection process, using the detected inductance value.

Method and device for determining an injection process of an injection appliance, and injection appliance for injecting fluid

Measures are provided, by which mechanical stresses within the diaphragm structure of a MEMS component may be intentionally dissipated, and which additionally enable the implementation of diaphragm elements having a large diaphragm area in comparison to the chip area. The diaphragm element is formed in the layer structure of the MEMS component. It spans an opening in the layer structure and is attached via a spring structure to the layer structure. The spring structure includes at least one first spring component, which is oriented essentially in parallel to the diaphragm element and is formed in a layer plane below the diaphragm element. Furthermore, the spring structure includes at least one second spring component, which is oriented essentially perpendicularly to the diaphragm element. The spring structure is designed in such a way that the area of the diaphragm element is greater than the area of the opening which it spans.

MEMS component including a diaphragm element which is attached via a spring structure to the component layer structure

A layer material which is particularly suitable for the realization of self-supporting structural elements having an electrode in the layer structure of a MEMS component. The self-supporting structural element is at least partially made up of a silicon carbonitride (SiCN)-based layer.

MEMS component

For a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal. For this purpose, the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and is more strongly deformed in the event of sound action than the adjoining diaphragm sections.

MEMS component including a sound-pressure-sensitive diaphragm element and piezosensitive signal detection

A MEMS microphone component including at least one sound-pressure-sensitive diaphragm element is formed in the layer structure of the MEMS component, which spans an opening in the layer structure. The diaphragm element is attached via at least one column element in the central area of the opening to the layer structure of the component. The deflections of the diaphragm element are detected with the aid of at least one piezosensitive circuit element, which is implemented in the layer structure of the diaphragm element and is situated in the area of the attachment of the diaphragm element to the column element.

MEMS component including a sound-pressure-sensitive diaphragm element

A micromechanical sound transducer system and a corresponding manufacturing method, in which the micromechanical sound transducer system includes a substrate having a front side and a back side, the substrate having a through opening extending between the back side and the front side, and a coil configuration on the front side having a coil axis, which runs essentially parallel to the front side, the coil configuration covering the through opening at least partially. Also provided is a magnet device, which is situated so as to allow for an axial magnetic flux to be generated through the coil configuration. The coil configuration has a winding device which has at least first winding sections made from at least one layer of a low-dimensional conductive material, the coil configuration being configured to inductively detect and/or generate sound.

Micromechanical sound transducer system and a corresponding manufacturing method

A method for active hybridization in microarrays includes pumping an already prepared sample through a denaturing unit with a microarray and then through a reaction region which is spatially separate from the denaturing unit. The denatured reactive sample components are hybridized in the reaction region.

Method for active hybridization in microarrays with denaturing function

A method for producing silicon microneedle arrays with drilled holes includes producing a silicon microneedle array. For each microneedle in a plurality of microneedles in the microneedle array, a laser is positioned relative to a microneedle and a drilled hole is drilled into the microneedle array by laser drilling. The drilled holes are drilled in microneedles, in flanks of the microneedles or alongside microneedles. A microneedle array includes a substrate composed of a micromechanical semiconductor material. The microneedle array has microneedles that project from the substrate and has drilled holes. The microneedles are composed of a porous micromechanical semiconductor material.

Method for producing silicon microneedle arrays with holes and microneedle array

A microneedle array applicator is configured to apply a microneedle array in cosmetic and medical applications. The microneedle array applicator has a holding apparatus configured to define detachable holding of a microneedle array comprising a planar substrate. The microneedle array applicator also has a drive mechanism for driving the microneedle array in a first direction perpendicular to the planar substrate and in a second direction parallel to the planar substrate. A method for applying a microneedle array includes the microneedle array applicator enabling safe breaking off of the microneedles, optionally laden with an active ingredient, in the skin.

Microneedle array applicator and method for applying a microneedle array

A microfluidic cell for the dielectrophoretic separation, accumulation, and/or lysis of polarizable bioparticles, including an interdigital electrode system composed of two electrode groups having interdigitated electrodes, and a micromixer having microchannels and microelevations. The interdigital electrode system and the micromixer are situated on the same side of the cell to improve the separation, accumulation, and/or lysis characteristics. Moreover, also described is a microfluidic system which includes such a microfluidic cell, and use thereof, and a method for separating, accumulating, and/or lysing polarizable bioparticles.

Microfluidic cell

A manufacturing method for a porous microneedle array includes: forming a plurality of porous microneedle arrays, each having at least one microneedle and a porous carrier zone lying beneath it on the face of a semiconductor substrate; forming an interlayer between a non-porous residual layer of the semiconductor substrate located on the back side of the semiconductor substrate and the carrier zone, which has greater porosity than the carrier zone; detaching the residual layer from the carrier zone by breaking up the interlayer; and separating the microneedle arrays into corresponding chips.

Manufacturing method for a porous microneedle array and corresponding porous microneedle array and corresponding substrate composite

An applicator for treating skin, includes a housing, in which a device for perforating an area of skin is arranged, wherein the device for perforating the skin can be brought into contact with the area of skin through an opening in the housing. At least one device for disinfecting is additionally arranged in the housing, and the device for disinfecting acts upon the area of skin through the same opening. With the applicator, a particularly secure and simple handling can be achieved.

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Korntal-Muenchingen, Germany

Michael Stumber