Zf Friedrichshafen Ag

Michael Sperber

Stefan Hain

Wilfried Lassmann

Ake Ewald

Johannes Hager

Marco Denk

ChandraGupta Hazarika

Christian Schanda

Dirk Schramm

Thomas Schupp

A control apparatus for operating an electric drive for a vehicle may include one or more of the following: a plurality of power module, which has one or more power semiconductors; an intermediate circuit capacitor, which is connected in parallel to the power module; a cooler for dissipating heat generated by the power module; an interconnect device for obtaining electrical contact to the power module, where the interconnect device has a first section and a second section at an angle to the first section, and where the first section and the second section are each perpendicular to a main plane of the power module.

Control apparatus for operating an electric drive for a vehicle having first and second power modules with a cooler therebetween and related method

A power module for operating an electric vehicle drive may include one or more of the following: a plurality of semiconductor components; an intermediate circuit capacitor connected in parallel to the semiconductor components; a heatsink for the removal of heat generated by the semiconductor components, where the heatsink is located between the semiconductor components and the intermediate circuit capacitor; and an intermediate circuit line that electrically connects the intermediate circuit capacitor to the semiconductor components. The intermediate circuit line may extend perpendicular to a direction of flow for the coolant in the heatsink on a side of the semiconductor components facing away from the heatsink.

Power module for operating an electric vehicle drive with a reduced leakage inductance

The disclosure relates to a printed circuit board having at least two current-conducting layer plies, wherein the current-conducting layer plies extend in an axial direction of the printed circuit board and are arranged in succession in a thickness direction of the printed circuit board. A component fastened by THT is arranged on one side of the printed circuit board. At least one connecting element extends through the printed circuit board through a passage opening in the thickness direction. The current-conducting layer ply is adjacent to the component fastened by THT reaches as far as the connecting element and the current-conducting layer ply that is remote from the component fastened by THT is at a distance from the connecting element.

Printed circuit board, inverter, motor vehicle and method for producing a printed circuit board

The invention relates to an electronic module for an electric drive in a vehicle, comprising an input-side electrical connection for inputting an input current generated by an energy source; an intermediate circuit with a capacitor; a semiconductor bridge circuit, connected in parallel to the intermediate circuit, wherein the bridge circuit comprises a high-side switch, and a low-side switch connected in series to the high-side switch, wherein the high-side switch is connected to the input-side electrical connection via a first current path, wherein the low-side switch is connected to the input-side electrical connection via a second current path, wherein the first current path and the second current path are the same length; and an output-side electrical connection for outputting an output current generated by the bridge circuit from the input current.

Electronic module for an electric drive of a vehicle with current paths of equal length for a highside switch and a lowside switch

A power module for operating an electric vehicle drive, comprising power switches for generating an output current based on an input current; control electronics for controlling the power switches including a first region, to which a first electric potential is applied, and a second region, to which a second electric potential is applied, wherein the second electric potential is higher than the first electric potential; a heatsink for discharging heat generated by the power switches and the control electronics; a shielding layer for electrically shielding the control electronics placed between the heatsink and the control electronics, such that the control electronics lies on the shielding layer, and the shielding layer lies on the heatsink; wherein the shielding layer is designed to connect the heatsink thermally and electrically to the first region, and thermally to the second region, and electrically insulate it therefrom.

Power module for operating an electric vehicle drive with improved thermal conduction for drive electronics

A control apparatus for operating an electric drive for a vehicle may include one or more power modules, which have one or more power semiconductors; an intermediate circuit capacitor, which is connected in parallel to the power module(s); a cooler for dissipating heat generated by the power module(s); and an interconnect device for obtaining electrical contact to the power module(s), wherein the cooler extends over at least two main planes forming an angle to one another.

Control apparatus for operating an electric drive for a vehicle and method of manufacturing such a control apparatus

A power electronics assembly comprises a heat sink, at least two half bridge modules mounted on one side of the heat sink, a circuit board mounted on the half bridge modules, and at least one capacitor mounted on the circuit boards, wherein each of the half bridge modules has a housing that has a cold side that is mounted on the heat sink, and the housing has a connection side from which numerous connection pins project for each DC connection in the half bridge module that are connected to the circuit board, and wherein conductors in the circuit board are designed to connect the half bridge modules in parallel and connect them to the at least one capacitor to form a DC link.

Power electronics assembly

A multi-layer circuit board comprising a carrier plate with an upper surface and a lower surface, and at least one electrically conductive upper inner layer located on the upper surface of the carrier plate and an electrically insulating upper intermediate layer located thereon, and an electrically conductive upper outer layer located thereon, forming the outermost layer of the upper surface. At least one electrically conductive lower inner layer is located on the lower surface of the carrier plate and an electrically insulating lower intermediate layer located thereon, and an electrically conductive lower outer layer located thereon, forming the outermost layer of the lower surface. The upper and/or lower outer layers are populated with components, and conductor paths in one of the inner layers are oriented in different directions from conductor paths in the other inner layer, and the region between the conductor paths is flooded with a voltage.

Multi-layer circuit board and electronic assembly having same

A multifunctional high current circuit board includes a high current-carrying current-conducting layer and a switching layer, which is connected to at least one heat source, wherein high current-carrying potentials are conducted into the switching layer.

Multi-functional high-current circuit board

A multi-functional high current circuit board comprises a current conduction layer having several strata for conduction of electric current, a switching layer comprising at least one power circuit breaker for switching an electric load, a control layer comprising at least one control element to control the at least one power circuit breaker, at least one shielding element for shielding the current conduction layer from the control layer and from the switching layer.

Growing community of inventors

Bayreuth, Germany

Michael Sperber