International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

Michael Sean June

Jason Aaron Matteson

Albert Vincent Makley

Jimmy Grant Foster, Sr

Mark Edward Steinke

Chunjian Ni

Troy Williams Glover

Vinod Kamath

Whitcomb Randloph Scott, Iii

Robert S Smith

Hilton T Toy

Benjamin V Fasano

Paul Andrew Wormsbecher

David L Edwards

Timothy Samuel Farrow

Lewis Sigmund Goldmann

Richard M Barina

Patrick Anthony Coico

Michael Sven Miller

John Paul Scavuzzo

Michael D French

Beth Frayne Loebach

David Lee Hager

Diane S Busch

Paul A Zucco

Pradeep Ramineni

Whitcomb Randolph Scott, Iii

Ellyn M Ingalls

Dana S Royer

Bruce Desrosiers

Scott Womble

A heat sink comprises a plurality of fins that may be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. A controller may be used to detect an elevated processor temperature and to activate a drive member to automatically adjust the orientation of fins on the heat sink. The fins may be moved and aligned with an air flow made over the heat sink. The adjustable-fin heat sink affords added flexibility in arranging a processor or other heat-generating electronic component on a circuit board. The orientation or position of the heat sink fins may also be automatically changed in response to a change in the air flow direction as manifested by a rise in the temperature of the heat sink or the heat-generating member.

Heat sink with orientable fins

A system for cooling a heat generating device comprises a heat sink and a plurality of ion emitter elements that form an electrohydrodynamic (EHD) air flow device. The heat sink has a base disposed in thermal communication with a heat generating device, such as a processor. A plurality of heat sink fins is coupled to electrical ground to form ion collectors. Ion emitter elements are disposed in a non-planar pattern along first ends of the plurality of fins so that each ion emitter element is equidistant from the first end of a nearest fin. A power supply applies an electrical potential between the plurality of ion emitter elements and the plurality of fins to induce a flow of ions that cause airflow across the heat sink. It is preferable to have at least three ion emitter elements that are equidistant from each fin of the heat sink.

Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array

Boat ventilation hatch cover

Methods, apparatus, and products are disclosed for improving the airflow exiting a blower that has one or more adjustable guide vanes that are affixed to the blower at one or more pivot points located in an outlet of the blower that include: determining a rotational speed of an impeller in the blower and adjusting a position of at least one of the adjustable guide vanes in dependence upon the rotational speed of the impeller.

Airflow from a blower with one or more adjustable guide vanes that are affixed to the blower at one or more pivot points located in an outlet of the blower

A method of modifying the airflow to the inlet of an axial fan. The method includes operating an axial fan to move air longitudinally through an air inlet opening of the axial fan, and, during operation of the axial fan, applying an electrical potential between an emitter and a collector to cause ionic air movement radially outwardly away from a central axis of the axial fan, wherein the radially outward air movement is caused upstream of the axial fan before the air reaches the air inlet opening.

Electrostatic control of air flow to the inlet opening of an axial fan

An air moving apparatus includes an axial fan and an electrostatic device. The axial fan has a rotatable shaft defining a central axis of the axial fan, a plurality of blades secured to the shaft, and an air inlet opening. The electrostatic device is disposed immediately upstream of the air inlet opening of the axial fan, and includes a collector and an emitter. In one embodiment, the electrostatic device includes a cylindrical collector coupled to ground and has a central axis aligned with the central axis of the axial fan. The electrostatic device further includes a plurality of emitter wires coupled to a terminal of a direct current source and extending lengthwise within the cylindrical collector. During operation of the axial fan, the application of an electrical potential between an emitter and a collector causes ionic air movement radially outwardly away from a central axis of the axial fan.

Airflow in a computer chassis may be enhanced or reduced to affect cooling of heat generating devices using an ionic air moving device. A plurality of ionic air moving devices enhance or reduce airflow through a plurality of fluidically parallel airflow zones of the computer chassis in an airflow direction established by a nonionic air moving device. Each ionic air moving device comprises an ion emitter electrode disposed a spaced distance from a collector electrode, wherein a controller independently controls an electrical potential between the emitter and collector electrodes of each ionic air moving device for affecting the rate of airflow through one or more of the plurality of airflow zones.

Independently operable ionic air moving devices for zonal control of air flow through a chassis

A method of operating variable pitch fans in series to cool an operating computer system. The method comprises running a first variable pitch fan with blades positioned at an operational pitch to induce airflow through the computer system and through a second variable pitch fan disposed in series with the first fan, and, simultaneously, not running the second variable pitch fan with blades positioned for minimal impedance to the airflow. In response to detecting a failure condition of the first fan, the method includes running the second fan with blades positioned at an operational pitch to induce airflow through the computer system and through the first fan, and, simultaneously, not running the first fan with blades positioned for minimal impedance to the airflow. Preferably, the method includes locking the rotor of a fan that is not running, and locking the blades of the non-running fan in a minimal impedance position.

Reduced-impedance cooling system with variable pitch blade and hot-swappable spare

A computer system and method for measuring air density in a computer chassis. The computer chassis includes a fan, an ambient air temperature sensor, and a heat-generating device with a heat sink, a heat sink temperature sensor, and a controller. The controller controls the fan speed and applies a known amount of thermal energy to the heat sink, then determines the air density from the difference in temperature between the ambient air and the heat sink. The controller may then use the air density determination to adjust the air flow rate through the computer chassis to provide a proper air flow rate for cooling.

System and method for determining air density based on temperature sensor data

Apparatus for securing or retaining a heatsink. The heatsink retention apparatus includes a heatsink module that cooperates with first and second spring loaded latches secure to a circuit board on opposing sides of a heat-generating component. The heatsink module includes a handle pivotally secured to opposing sides of the heatsink body, and bails pivotally secured to the handle. In addition, the bails extend downward to dispose a lower bail member adjacent the spring loaded latches. As the handle pivots between a first position to raise the bails and a second position to lower the bails, the bails automatically move from a locked position to an unlocked position. Each of the spring loaded latches include a hook and at least one pre-loaded spring to transfer a minimum downforce to the lower bail members when the bails are raised. Accordingly, embodiments may be operated from the top of the heatsink without the use of tools, while providing a desired downforce over a range of heatsink heights.

Top actuated, force limiting heatsink retention system

A temperature isolation duct in a computer system comprising a chassis securing a circuit board and a fan system that draws air through the chassis, and a heat-generating component is mounted on the circuit board and exposed to the air flow. The hot air duct passively directs air heated by the heat-generating component from a single hot air duct inlet in direct downstream alignment with the heat-generating component to a single hot air duct outlet. A thermal sensor is secured within, or in direct alignment with, the hot air duct near the duct outlet for sensing the temperature of air flowing through the hot air duct and generating a temperature signal. A controller is in electronic communication with the thermal sensor for receiving the temperature signal and in electronic communication with the fan system for sending a fan speed control signal.

Ducted air temperature sensor

Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain.

Controlling airflow in a computer chassis

The present invention can include an automated method controlling the fan speed of computer system cooling fans with altitude and/or fluid density data from a centralized sensor. Such a method can utilize a centralized sensor to determine the altitude/fluid density within an enclosed area. The centralized sensor can be positioned so as to be unaffected by extraneous activities within the enclosed area. The determined altitude/fluid density can be conveyed to a computer system containing one or more cooling fans. The computer system can be located within the enclosed area. Then, the computer system can determine the need for adjusting the speed of the cooling fans based on the altitude/fluid density. When the need for adjustment exists, the speed of the cooling fans can be adjusted in accordance with the altitude/fluid density.

Growing community of inventors

Raleigh, NC, United States of America

Michael Sean June