Hewlett Packard Enterprise Development LP

Michael Scott

Harvey John Lunsman

Steven J Dean

Laura A Martinson

Craig Mcgreevy

John P Franz

Greg Rusch

Robert Mascia

Scott A Ritrovato

Timothy M Bruhn

Joseph Kakkassery

Christopher Folk

Kevin D'amour

Lauren R Zambotti

Qiang (john) Zhang

David Collins

Tahir Cader

Chad Green

Donald Koenig

Evert Kroon

Erik D Olson

Giacomo Strollo

Eng Lim Goh

Jack Lundstedt

Benjamin Kufahl

Bret M Cuda

David Petersen

Mark R Fernandez

John Kichury

Robert Behringer

Mike Kubisiak

Calandra Szulgit

Robert Kepley

Edward Gunzel

Vincent So

Gustavo Prado

Bahman Aghdasi

Cooling module includes a mounting element, a force application member, a lever, and a cold plate movably coupled to the mounting element. The mounting element having engagement members, is coupled to a receptacle of an electronic device that is configured to receive a removable electronic device at the receptacle. The force application member having spring fingers, is disposed between the mounting element and the cold plate, and movable relative to the mounting element. The lever is connected to the mounting element and the force application member and shiftable between actuated and unactuated states. In the actuated state, the lever pushes the force application member along a first direction causing the engagement members to move the force application member along a second direction perpendicular to the first direction and urge the cold plate to compress the spring fingers and establish thermal contact between the cold plate and the removable electronic module.

Lever actuated cold plate

Example implementations relate to a cool fluid reservoir for managing loss of cool fluid in a coolant distribution unit (CDU). The cool fluid reservoir includes a cylinder which has an internal volume defined between an inlet and outlet, and a hollow piston that is slidably connected to the cylinder via one of the inlet or outlet to split the internal volume into a first volume portion filled with the cool fluid and a second volume portion filled with driver fluid. The first volume portion is fluidically connected to a closed fluid loop of the CDU via the hollow piston and other one of the inlet or outlet. The hollow piston is slidably driven by the driver fluid to reduce the first volume portion and inject a portion of the cool fluid from the first volume portion into the closed fluid loop based on an operating pressure of the cool fluid.

Cool fluid reservoir for a coolant distribution unit

A system chassis may comprise a frame having a width, depth, and height and a plurality of divider walls coupled to the frame and forming a plurality of receptacles each configured to receive an electronics tray containing an electronic assembly. Each of the plurality of divider walls comprises a metal sheet having a front edge, a back edge, and two lateral edges, the two lateral edges attached to two lateral walls of the frame. The front edge of the metal sheet has a concave shape such that a distance between the front edge and the back edge of the metal sheet continuously decreases while moving laterally from one lateral edge to a center of the front edge and continuously increases while moving laterally from the center to the opposite lateral edge.

System chassis with divider walls having a concave edge

Example implementations relate to a pressure regulator assembly for a closed fluid loop of a CDU. The pressure regulator assembly has a cylinder having an internal volume, and first and second hollow pistons slidably connected to the cylinder to split the internal volume into a first volume portion having cooling fluid, a second volume portion having driver fluid, and a third volume portion having compressible matter. The first volume portion is fluidically connected to the closed fluid loop. The first hollow piston is reciprocated by the compressible matter to maintain operating pressure of the cooling fluid in the closed fluid loop. The second hollow piston is driven by the driver fluid in response to predefined pressure drop of the cooling fluid during predefined time period, to inject additional cooling fluid from the first volume portion into the closed fluid loop to restore pressure level of cooling fluid to operating pressure.

Pressure regulator assembly for a coolant distribution unit

A screw-latching assembly is provided. The assembly includes a screw with a head, a tip, and a body between the head and tip. The body includes a threaded portion adjacent to the tip and an unthreaded portion adjacent to the head, and the unthreaded portion includes a built-in collar with an outer diameter larger than that of the body. The assembly includes a supporting bracket supporting and partially encompassing a first portion of the screw. The supporting bracket includes a base and multiple sidewalls, with a first sidewall comprising a first opening to allow a second portion of the screw to extend out of the supporting bracket and a second sidewall comprising a second opening to allow access to the head by a torquing tool. The assembly includes a spring surrounding at least a portion of the body, with the spring positioned between the built-in collar and the first sidewall.

Compact screw-latching assembly with overdrive protection

Example implementations relate to a host electronic device configured for establishing a thermal contact between a heat generating component of a removable electronic device, and a cooling component of the host electronic device, when the removable electronic device is detachably connected to the host electronic device. The host electronic device includes a support structure, the cooling component, a driver, and an actuator. The cooling component is movably connected to the support structure. The driver is also movably connected to the support structure. The actuator is movably connected to the support structure and the driver. The actuator, upon contact by the removable device, causes a movement of the cooling component via the driver for establishing the thermal contact between the cooling component and the heat generating component.

Host electronic device having a movable cooling component for removable electronic device

Example implementations relate to a host electronic device and a method of establishing a thermal contact with a removable electronic device by a cooling component of the host electronic device. The host electronic device includes a housing, the cooling component, and a plurality of flexible arms. The cooling component is movably coupled to the housing. The plurality of flexible arms extend towards an internal cavity of the housing to hold the cooling component in a first position (retracted position). Further, the plurality of flexible arms are displaceable from the internal cavity by a movement of the removable electronic device into the host electronic device, to allow the cooling component to drop down to a second position (extended position) for establishing the thermal contact with a heat generating component of the removable electronic device.

Example containers are provided to retain and cool electronic devices in environments where power and/or coolant (e.g., airflow) is limited or finite. In examples, a container can include a housing and a conduit system. The housing can include a plurality of sides including a front side and a back side, and can be structured to retain at least a first computing device. In addition, the housing can provide for a first and second inlet opening and a first and second outlet opening on the back side of the container. The conduit system can be provided within the housing to guide the airflow received from each of the first and second outlet openings through an interior volume of the container to cause the airflow to exit from each of the first and second outlet openings. Further, the conduit system can include a plurality of structures that combine to guide at least a portion of the airflow received through the first and second inlet openings through a top region of the interior volume as the airflow is moved from the back side of the container to the front side of the container. Further still, the conduit system can guide at least a portion of the warmed airflow to a bottom region of the interior volume as the warmed airflow is moved from the front side to the back side of the container.

Cooling container

A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.

Power supply dry disconnect liquid cooling

Male and female fittings are configured to mate to form a valved connector system. Some embodiments of the female fitting include movable poppet configured to sealingly engage a flared projection within the female fitting. Some embodiments of the male fitting include a male mating aperture, and a movable plug configured to sealingly engage the male mating aperture. When the female fitting is mated with a male fitting, the male fitting forces the poppet to disengage from the flared projection, and the flared projection forces the plug to recede into the male fitting, to open a fluid path through the valved connector system.

Valved connector

Example implementations relate to pumps with pre-charged fluid. In some examples, a pump may comprise a first valve connected to an inlet of the pump by a first clip, a second valve connected to an outlet of the pump by a second clip, and a compression release mechanism to relieve compression forces generated on a fluid included in the pump in response to the pump being connected to a manifold, where the pump is pre-charged with the fluid.

Pumps with pre-charged fluid

An example electrical and liquid coolant midplane includes an electrical midplane having a ring bus bar assembly, a liquid coolant manifold, and a heat transfer device. The ring bus bar assembly is to receive power from power supply units of the computing system and provide the power to computing components installed in the computing system. The liquid coolant manifold includes four segments connected together as a rectangular ring, the liquid coolant manifold including first liquid connectors facing in a first direction and second liquid connectors facing in a second direction opposite the first direction. The heat transfer device is in contact with the ring bus bar assembly and one of the segments of the liquid coolant manifold, to thermally couple the ring bus bar assembly with the manifold to provide liquid cooling to the ring bus bar assembly.

Electrical and liquid cooling midplane

Example implementations relate to a chassis cooling device. In some examples, a chassis cooling device may include a manifold within the chassis to distribute a cooling resource among a cooling loop and a heat exchanger; a first plurality of pumps, coupled to a cooling loop return portion of the manifold, arranged in parallel in the chassis to pump the cooling resource; and a second plurality of pumps, coupled to a cooling loop supply portion of the manifold, arranged in parallel in the chassis to pump the cooling resource, wherein the second plurality of pumps are arranged in series with the first plurality of pumps.

Chassis cooling

A cooling apparatus includes a plurality of containers and a plurality of connectors. Each connector connects adjacent containers of the plurality of containers. The cooling apparatus is installable in a computing device such that each electronic component to be cooled in the computing device is interposed between adjacent containers. Each container may include a body, an inlet, and an outlet. The body may include first and second ends and may define a chamber through which a coolant is to flow. The body may be expandable responsive to pressure from the coolant and deformable responsive to contacting one of the electronic components so as to conform to a profile of the electronic component. The inlet may be disposed at the first end of the body through which the coolant enters the chamber. The outlet may be disposed at the second end of the body through which the coolant exits the chamber.

Cooling apparatus for electronic components

Systems and methods are provided for a gasket that allows for a single cooling cold plate to touch one or more devices. These devices may have precise but varying thermal interfaces and mounting pressure requirements; and height and co-planarity tolerances that need to be accommodated. The gasket may be sandwiched in between a top stiffener plate and a floating cold plate along an outer perimeter of the gasket; and a rigid, cold plate base and a bottom stiffener plate along an inner perimeter of the gasket. The resulting seal allows coolant to flow between the rigid and floating cold plates as these plates move (i.e., float) with respect to one another. Thus, the gasket aids in a cooling apparatus achieve an optimum thermal interface with each of the one or more devices simultaneously, while accounting for the individual tolerance variations across each device.

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Chippewa Falls, WI, United States of America

Michael Scott