Morgan Research Corporation

US Government As Represented by the Secretary of the Army

Michael Scott Kranz

Marty Ray Williams

Larry Christopher Heaton

Calvin Wayne Long

Michael Ray Whitley

Philip John Reiner

Sherrie Burgett Holt

Arthur Anthony Jenkins

Robert Faye Elliott

Robert Faye Elliot

Jeffery Lee Williams

Arthur A Jenkins

The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.

MEMS sensor suite on a chip

The present invention provides the capability of ascertaining, through a quick and simple measurement, locations on a structure that may have experienced damage that could result in reduced structure lifetime, strength, or reliability. The sensing element is a connectorized section of polarization maintaining ('PM') optical fiber, where a length of PM fiber represents a fully distributed sensor array. Stress-induced changes to the sensor are measured through white-light Polarimetric interferometry. The output of the measurement is a data array representing the stress concentration magnitude at an array of locations along the length of the sensor. In an application, the knowledge of the optical fiber position on the structure, coupled with the measurement of stress locations along the fiber length, allows the user to determine locations on the structure with large stress concentrations. These locations may signify structural damage. This knowledge would allow the user to employ a more sophisticated system, albeit a larger and slower one, to fully characterize and evaluate that area of potential damage and take appropriate action.

Embeddable polarimetric fiber optic sensor and method for monitoring of structures

The Miniature Fourier Transform Spectrophotometer provides the capability, in a miniaturized device, of determining the light absorption/transmission spectra of a collected sample of gas or liquid though Fourier Transform spectroscopy techniques. The device takes an optical input from an optical fiber, manipulates that light through miniature optical components, and launches it into a miniaturized Michelson interferometer with a scanning mirror that acquires the interferogram of the optical input. The interferogram can be processed to retrieve the spectrum of the input light. A novel multi-stepped micro-mirror operates as the optical path length modulator in the miniaturized interferometer. A unique monolithic beamsplitter/mirror combination provides for accurate alignment of the components and greatly simplifies product integration. The device is designed to cover various optical spectra of interest. During operation, the precision and accuracy of the microfabricated components in the device allow operation and resolution even at extremely low wavelengths. In addition, the miniaturized nature of the device allows it to be used in new and extremely space-constrained applications.

Miniature Fourier transform spectrophotometer

Miniature fourier transform spectrophotometer

A gyroscope and temperature sensor are formed on a single chip using SOI-MEMS technology. The temperature sensor has an array of resistors to accurately detect the temperature of the gyroscope in temperatures and conditions that can range from extreme heat to extreme cold. The positioning of the gyroscope and temperature sensor on the same chip allow for extremely accurate real-time feedback of the gyroscope's temperature for utilization by a control system.

Integrated gyroscope and temperature sensor

The Resettable Latching MEMS Shock Sensor provides the capability of recording external shock extremes without consuming electrical power. The device incorporates a shock sensitive suspended proof mass, spring-loaded contacts, latches, and actuators for device reset. The device can be designed, hardwired, or programmed to trigger at various shock levels. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the device consumes no quiescent power. The device can be configured to close a circuit, switch an interrupt signal, or switch some other electrical trigger signal between devices at the time of a shock extreme being reached, or it can be configured to latch and be polled at some time after the shock limit has occurred.

Resettable latching MEMS shock sensor apparatus and method

A SOI-MEMS gyroscope has a three fold symmetrical construction such that is symmetrical in the x direction, the y direction and diagonally. The gyroscope is suspended above a silicon substrate by lateral flexures that are located at the corners of the proof mass and by central flexures that are positioned at the center regions of the proof mass. The proof mass, lateral flexures, and central flexures are formed of a silicon composition with the flexures supporting the proof mass such that the proof mass will not touch the underlying base silicon substrate even when subjected to extreme G forces. Comb finger actuators apply an electrostatic force to the proof mass in the x direction; and, when experiencing an external rotational rate around the z-axis, the Coriolis force acts along the y direction and the resulting deflection is sensed by a pair of comb-finger capacitors connected as a differential capacitive voltage divider.

SOI-MEMS gyroscope having three-fold symmetry

The Resettable Latching MEMS Temperature Sensor provides the capability of recording external temperature extremes without consuming electrical power. The device incorporates a thermal bimorph, contacts, latches, and actuators for device reset. The device can be designed, hardwired, or programmed to trigger at various temperature levels. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the device consumes no quiescent power. The device can be configured to close a circuit, switch an interrupt signal, or switch some other electrical trigger signal between devices at the time of a temperature extreme being reached, or it can be configured to latch and be polled at some time after the temperature limit has occurred.

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Madison, AL, United States of America

Michael Scott Kranz