Heraeus Deutschland Gmbh & Co Kg

Heraeus Materials Technology Gmbh & Co. Kg

Michael Schäfer

Wolfgang Schmitt

Susanne Klaudia Duch

Jens Nachreiner

Thomas Krebs

Andreas Hinrich

Jian Zeng

Ulrich Hausch

Frank Osterwald

Lars Paulsen

Frank Krüger

Martin Becker

Jacek Rudzki

Holger Ulrich

Andreas Steffen Klein

Michael Benedikt

Anton-Zoran Miric

Martin Bleifuss

David Benning

Christian Bachmann

Anton Miric

Alexander Brand

Frank Schefuss

Ulrisch Hausch

Elisa Krill

Ulrich Holger

Martin Bleifuß

Elisa Wieseler

Ferdinand Bartels

Albert Heilmann

Andreas Klein

One aspect relates to an apparatus including a first frame, a further frame, a first element, a second element, and a third element. The first frame frames the further frame, the further frame frames the first element, and electrically insulates the first element and the first frame from each other. The first element is electrically conductive, the second element is electrically conductive, and the third element provides an electrically conductive connection between the first element and the second element, and has a porosity in the range of 0.001 to 0.4.

Electrical feedthrough with a sintered electrical connection

A method for producing a stable sandwich arrangement of two components with solder situated therebetween, comprising the steps:

Method for producing a stable sandwich arrangement of two components with solder situated therebetween

The invention relates to a metal paste, containing (A) 75 to 90% by weight of copper and/or silver particles that are provided with a coating containing at least one organic compound, (B) 5 to 20% by weight of an organic solvent, and (C) 2 to 20% by weight of at least one type of metal particles different from the particles of (A) and having an average particle size (d50) in the range of 0.2 to 10 &#x3bc;m. The metal particles of component (C) are selected from the group consisting of molybdenum particles and nickel core-silver shell particles with a silver content of 10 to 90% by weight.

Metal paste and use thereof for joining components

A method for the production of a silver sintering agent in the form of a layer-shaped silver sintering body having silver oxide surfaces and the use thereof are provided.

Method for producing a silver sintering agent having silver oxide surfaces and use of said agent in methods for joining components by pressure sintering

One aspect relates to a method for manufacturing a substrate assembly for attachment to an electronic component A substrate is provided with a first side and a second side. A contact material layer is applied to the first side of the substrate. A pre-fixing agent is applied at least to sections of a side of the contact material layer facing away from the substrate.

Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component

A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the earlier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.

Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use

A mixture contains metal oxide particles that are coated with an organic compound. The organic compound is represented by Formula I:R&#x2014;COR&#x2003;&#x2003;(I), wherein Ris an aliphatic residue having 8 to 32 carbon atoms, wherein Ris either &#x2014;OM or comprises the moiety &#x2014;X&#x2014;R, wherein X is selected from the group consisting of O, S, N&#x2014;R, wherein Ris a hydrogen atom or an aliphatic residue, wherein Ris a hydrogen atom or an aliphatic residue, and wherein M is a cation. The mixture may be used to connect components and/or to produce a module. A method for producing the mixture is also provided.

Sinter paste with coated silver oxide on noble and non-noble surfaces that are difficult to sinter

A sintering method allows components to be joined to each other in a stable way at a processing temperature of less than 200&#xb0; C., producing stable contact points having low porosity and high electrical and thermal conductivity. The method includes (a) providing a sandwich arrangement having at least a first component, a second component, and a metal paste located between the first and second components, and (b) sintering the sandwich arrangement. The metal paste includes (A) 75-90 wt. % of at least one metal present in the form of particles having an organic compound-containing coating, (B) 0-12wt % of at least one metal precursor, (C) 6-20wt % of at least one solvent, and (D) 0.1-15 wt % of at least one sintering agent selected from (i) salts of C-Corganic acids, (ii) esters of C-Corganic acids, and (iii) carbonyl complexes.

Metal paste with co-precursors

A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200&#xb0; C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.

Metal paste with oxidizing agents

A method is provided for connecting at least two components, in which a sintering preform is used. This preform includes a carrier having a surface that has at least one structuring element containing hardened paste, wherein the hardened paste contains: (a) metal particles having a coating that contains at least one organic compound; and (b) at least one sintering aid selected from the group consisting of (b1) organic peroxides, (b2) inorganic peroxides, (b3) inorganic acids, (b4) salts of organic acids, wherein the organic acids have 1-4 carbon atoms, (b5) esters of organic acids, wherein the organic acids have 1-4 carbon atoms, and (b6) carbonyl complexes. The surface of the carrier having the hardened paste is not reactive to the constituents of the paste.

Contacting means and method for contacting electrical components

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Künzell, Germany

Michael Schäfer