Osram Opto Semiconductors Gmbh

Osram Oled Gmbh

Osram Gmbh

Michael Schumann

Dominik Scholz

Dominik Schulten

Ion Stoll

Thomas Hoefer

Frank Singer

Christian Leirer

Stefan Lange

David J O'Brien

Britta Goeoetz

David Racz

Frank Krüger

Martin Haushalter

Frank Möllmer

Werner Kuhlmann

Ludwig Plötz

Eckhard Ditzel

Ludwig Ploetz

Dirk Sossenheimer

Andreas Steffen Klein

Klaus Flock

Moritz Laubscher

Klaus Hohn

Christine Rüth

Stefan Strüwing

Klaus HÖHN

In an embodiment, the semiconductor device is surface mountable and comprises a light emitting semiconductor chip which comprises electrical contact pads. An opaque base body laterally surrounds the semiconductor chip. An electrical fanning layer contains electrical conductor tracks. Electrical connection pads are used for external electrical contacting of the semiconductor device. The contact pads and the connection pads are located on different sides of the fanning layer. The contact pads are electrically connected to the associated connection pads by means of the fanning layer. The connection pads are expanded relative to the contact pads.

Surface mountable optoelectronic semiconductor device and method for manufacturing a surface mountable optoelectronic semiconductor devices

An optical distance measuring device and a method for operating an optical distance measuring device are disclosed. In an embodiment an optical distance measuring device includes a pixelated radiation source with at least two pixels, a radiation detector configured to detect electromagnetic radiation emitted by the radiation source and reflected in measuring regions and a control unit configured to operate the radiation source and to receive electrical signals from the radiation detector, wherein the pixelated radiation source is configured to illuminate different measuring regions with electromagnetic radiation with pairwise different properties.

Optical distance measuring apparatus and method for operating an optical distance measuring apparatus

An optoelectronic semiconductor chip may include an active region configured to emit electromagnetic radiation during operation of said optoelectronic semiconductor chip. The optoelectronic semiconductor chip comprises conversion elements arranged to convert the wavelength of the electromagnetic radiation emitted by the active region during operation, and at least one barrier at least partially impermeable to the electromagnetic radiation emitted by the active region. The barrier is disposed in a lateral direction between the conversion elements, the lateral direction being parallel to the main extension plane of the semiconductor body, and the barrier extending transversely to the lateral direction. The active region has at least two emission regions which can be driven separately from each other, and each of the conversion elements is disposed in a radiation direction of the electromagnetic radiation emitted from one of the emission regions. A method for manufacturing an optoelectronic semiconductor chip is also disclosed.

Optoelectronic semiconductor chip and method of manufacturing an optoelectronic semiconductor chip

An assembly is disclosed. In an embodiment an assembly includes a light source configured to illuminate a field of view, a control circuit configured to operate the light source and a camera configured to record a scene in the field of view, wherein the light source comprises at least one semiconductor component having at least one semiconductor chip, wherein the semiconductor chip has an semiconductor layer sequence with an active region, wherein the semiconductor chip comprises the plurality of pixels, wherein the plurality of pixels are configured to generate radiation of the light source, wherein the control circuit has a memory configured to store operational data of the light source, wherein the control circuit is configured to operate the pixels on basis of the operational data, and wherein the arrangement is configured to perform an adaptation of at least a part of the operational data in the memory during operation of the arrangement.

Assembly for lighting and recording a scene

In one embodiment, the optoelectronic semiconductor device comprises a carrier having electrical connection surfaces on a carrier upper side. At least four semiconductor chips are configured to emit light of different colors from each other. The semiconductor chips are mounted close to each other on the connection surfaces so that a distance between adjacent semiconductor chips is at most 100 &#x3bc;m in a top view on the carrier upper side.

Optoelectronic semiconductor device and flashlight

A method of operating a lighting device with a light-emitting component, in which the light-emitting component includes a plurality of pixels configured to illuminate a plurality of zones in a field of view, the light-emitting component includes a processing device including characterization data of the light-emitting component, and the pixels of the light-emitting component are operated as a function of the characterization data, wherein to determine characterization data prior to intended operation of the lighting device an intensity and/or a color location of the emitted light of a pixel or of each pixel is measured as a function of an operating current.

Method of operating a lighting device

The invention relates to an arrangement for generating mixed light, which comprises three semiconductor chips, emitting in the blue spectral range, of three devices. Arranged in the light paths of the individual semiconductor chips are different conversion elements which are configured to convert primary radiation into secondary radiation. The total radiation (S1, S2, S3) exiting the respective devices () has a corresponding chromaticity coordinate on the black body curve of the CIE color diagram 1931 or lies within a color quadrilateral of the CIE color diagram.

Arrangement and method for generating mixed light

A coding method for data compression of a power spectra of an optoelectronic component and a decoding method are disclosed. In an embodiment, a coding method includes providing a power spectrum, sampling the power spectrum at particular sampling wavelengths in order to provide a discrete source spectrum, indexing the discrete source spectrum in order to provide a source graph having discrete source values, producing an image graph having discrete image values by transforming the source graph from a source range into an image range with a discrete frequency transform, performing compression of the image graph, and digitizing the compressed image graph in order to produce compressed spectral data.

Coding method for data compression of power spectra of an optoelectronic component and decoding method

A laminate and method for producing the laminate are provided for contacting at least one electronic component. An insulating layer is laminated between first and second metal layers electrically contacted to each other in at least one contact region. At least one recess in the contact region is generated with at least one embossing and/or bulging in the first metal layer. The distance between the two metal layers is reduced, such that dimensions of the embossing/bulging are sufficient for taking up the electronic component, which is inserted and connected into the embossing/bulging in a conductive manner therein. The electronic component is taken up in the embossing/bulging entirely with respect to its circumference and at least partly with respect to the height (H) of the electronic component. The laminate may be used as a circuit board, sensor, LED lamp, mobile phone component, control, or regulator.

Chip-integrated through-plating of multi-layer substrates

Composition for producing a filter material for radiation includes a silicone and at least one dye dispersed in the silicone, wherein the composition has a relative transmission of less than 20% for radiation of the wavelength of 400 nm to 700 nm, and has a relative transmission of greater than 50% for radiation of the wavelength of 850 nm to 1025 nm.

Composition for producing a filter material for radiation, method for producing a composition for a filter material, material for filtering radiation, and an optoelectronic device comprising the material

A lighting module includes an optoelectronic semiconductor chip and a converter element for wavelength conversion. The optoelectronic semiconductor chip emits electromagnetic radiation including a dominant wavelength of 430 nm to 450 nm. The converter element includes a first phosphor and a second phosphor. The first phosphor is a garnet phosphor. The first phosphor emits electromagnetic radiation including a wavelength from the blue-green spectral range. The second phosphor is a nitrido-silicate phosphor. The second phosphor emits electromagnetic radiation including a wavelength from the orange-red spectral range.

Lighting modules, lighting apparatus and electronic devices

A surface-mountable device () is specified, having a mounting side (), a top side () lying opposite the mounting side (), an electrically insulating carrier plate (), an electrical component () and a housing (). The carrier plate () terminates the device () toward the mounting side (). Furthermore, the carrier plate () has a fixing side () lying opposite the mounting side (). For the purpose of making electrical contact with the component (), the carrier plate () has conductor tracks () arranged on the fixing side (), contact areas () arranged on the mounting side (), and openings (), wherein in each case a contact area () is electrically conductively connected to a conductor track () by an opening (). The component () is enclosed by the housing (), wherein at least one opening () is arranged below the component (). The housing () and the carrier plate () are arranged flush with one another in a plan view of the carrier plate (). Furthermore, the housing () terminates the device () toward the top side ().

Surface mountable device

The invention is directed to a tilt sensor comprising at least one body movable along a predefined path and an optoelectronic unit for determining the position of said body, said tilt sensor being surface-mountable. The invention is further directed to a tilt sensor assembly.

Growing community of inventors

Neu-Ulm, Germany

Michael Schumann