Continental Teves, Ag and Company Ohg

Continental Teves Ag & Ohg

Michael Schulmeister

Jakob Schillinger

Dietmar Huber

Stefan Günthner

Lothar Biebricher

Thomas Fischer

Manfred Goll

Svenja Raukopf

Martin Haverkamp

Klaus Rink

Heinrich Acker

Henrik Antoni

Wolfgang Jöckel

Jens Habig

Marco Benner

Gabriel Goron

Jonas Herzfeld

Waldemar Baumung

Philipp Schröder

Stefan GÜNTHNER

Philipp SCHRÖDER

A method for determining the position of a mobile radio station by a vehicle, the method being based on a plurality of radio measurements. The invention further relates to a vehicle for carrying out such a method.

Method for determining the position of a mobile radio station by means of a vehicle, and vehicle

A sensor for sensing a physical transmitter field dependent on a physical quantity to be measured, including: a sensor circuit for sensing the transmitter field and for outputting a sensor signal dependent on the transmitter field a circuit carrier having a first region in which at least a part of the sensor circuit is supported and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged, and a noise resistance element, which is arranged between the first region and the second region and which is designed to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface.

Structure-borne noise decoupling on sensors working with transmitter fields

A sensor arrangement having: a housing, a movement sensor, the movement sensor, being mounted on a bearing element connected to the housing; a position sensor; and a position transducer, the position sensor and the position transducer being arranged relative to each other in such a way that the movement of the movement sensor can be measured. The bearing element protrudes from the housing, or the position sensor and the position transducer are eccentric relative to the bearing element.

Sensor arrangement having a modular structure including sensor mounted on bearing element configured to project from housing

A method for producing an electronic device, the method including: encasing an electronic assembly with a first casing material; holding the first electronic assembly encased by the first casing material over a holding element such that the holding element is spaced apart from the electronic assembly above the first casing material, and encasing the assembly retained on the holding element with a second casing material.

Sensor production by holding the intermediate injection-molded part

A sensor including a system-in-package module, wherein electrical contacts can be contact-connected by way of a mating connector. An associated method and an associated sensor arrangement are also disclosed.

Sensor having system-in-package module, method for producing the same, and sensor arrangement

A sensor element for a motor vehicle, includes a sensor circuit for detecting a physical variable, a first housing, in which the sensor circuit is arranged, a second housing, in which the first housing is arranged, a thermoplastic, which at least partially encloses the first housing and fixes the first housing in the second housing in a positioning position, at least two positioning recesses for receiving positioning pins being formed in the first housing in order to fix the first housing in the positioning position while the first housing is being enveloped by the thermoplastic.

Sensor element for a motor vehicle

A sensor for detecting a physical variable, including: &#x2014;a sensor element for outputting an electrical signal dependent on the physical variable, &#x2014;a substrate carrying the sensor element, &#x2014;a printed circuit board, conducting the electrical signal, on the substrate, and &#x2014;an embedding compound, in which the sensor element is completely embedded and the printed circuit board is at least partly embedded, &#x2014;wherein at least one compensation element is embodied in the embedding compound, by which compensation element a mechanical stress caused by an element of the sensor at least partly embedded in the embedding compound is counteracted.

Sensor with symmetrically embedded sensor elements

A component for a sensor having a sensor element and having an output interface for the outputting of an electrical signal, which is dependent on a physical variable, from the sensor element to the output interface, including&#x2014;a circuit with at least one first signal path for receiving the electrical signal from the sensor element and for conducting the electrical signal to the output interface, and a second signal path, which differs from the first signal path, for conducting the electrical signal to the output interface, &#x2014;wherein an activity of the first signal path or of the second signal path is dependent on a position of the component in the sensor.

Adapter with embedded filter components for sensors

A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: &#x2014;arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and &#x2014;encapsulating the electronic component with the encapsulation material.

Growing community of inventors

Groß-Zimmern, Germany

Michael Schulmeister