Siemens Aktiengesellschaft

Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Michael Schreyer

Helmut Markert

Klaus Kretzschmar

Wolfgang Von Gentzkow

Peter Gröppel

Peter Donner

Dieter Heinl

Heinrich Kapitza

Armin Datz

Peter Braun

Dirk Salz

Alfred Baalmann

Klaus M&uuml;ller

Jörg Ihde

Gu/ Nter Mennig

Oliver Eitel

Gerhard Piecha

In a process for the production of a flame-resistant, pourable, latently reactive, phenolically curable epoxy resin molding material for the encapsulating of electronic components, a latently reactive prepolymer epoxy resin mixture in powder form which is free of isocyanate groups is produced at reaction temperatures up to 200&deg; C. from a thermally polymerizable, filler-containing reaction resin mixture of polyepoxy resin consisting of a mixture of bi-functional and multi-functional epoxy resins and polyisocyanate resin having a molar ratio of the epoxy groups to the isocyanate groups of >1:1 with a substituted imidazole as reaction accelerator in a concentration of 0.5 to 2.5% by weight, relative to polyepoxy resin, and the prepolymer epoxy resin mixture is mixed with a powdered filler-containing phenolic resin mixture in a molar ratio of the epoxy groups to the phenolic hydroxyl groups of 1:0.4 to 1:1.1.

Blending epoxy resin-polyisocyanate-filler mixture and phenolic resin-filler mixture for molding

Mixture of epoxy resin, epoxide group-containing P compound, P-modified epoxy resin and polyamine

Epoxy resin moulding compounds having halogen-free flame retardation

Oxazolidinone structures-containing prepolymeric epoxy mixture

Oxazolidinone structures-containing prepolymeric epoxy resin mixture

Growing community of inventors

Weisendorf, Germany

Michael Schreyer