Applied Materials, Inc.

Leybold Durferrit Gmbh

Michael Schaefer

Otto W Stenzel

Alfred Henn

Juergen Henrich

Hans-Johann Kemmer

Daniel Bethge

Edgar Haberkorn

A process chamberfor PECVD (Plasma Enhanced Chemical Vapor Deposition) coating of a substrate includes an electrode, which is integrated in a contact frame, which is firmly connected to the recipient. A movable carrier in the process chamber carries at least one substrate. The carrier is transported by means of a driven roller positioner into the process chamber or out of the process chamber along a transport route defined by the movement. As soon as the carrier inside the recipient has reached a certain position, the lower roller positioner is uncoupled from carrier by lowering by means of a lifting device. In this regard, the carrier detaches itself from the upper roller positioner. Then, the carrier is accepted by a transfer device (not shown) and brought from the transport position laterally into a treatment position in contact with the contact frame. In this way, reliable contact is produced between the electrode and a counter-electrode provided in carrier. At the same time, other carriers, in so far as the contact frame is removed laterally far enough from the transport route, during the coating of the carrier, can be moved past this.

Process chamber, inline coating installation and method for treating a substrate

A furnace chamber contains a chassis to which a closure plate for said chamber is removably fixed. A tilting frame is borne by said chassis in a pair of coaxial tilting bearings, one of which incorporates a rotary lead through for power lines and cooling lines to an induction coil surrounding a crucible on the tilting frame. The chassis includes a pair of rails which are movable horizontally on wheels mounted to the floor of the furnace chamber.

Induction furnace for melting and casting substances in a nonreactive

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Altenstadt, Germany

Michael Schaefer