Ersa Gmbh

Michael Schaefer

Rainer Kurtz

The invention relates to a soldering system and a method for wave soldering, having at least one flux nozzle and a device for monitoring a state of a spray jet of the flux nozzle.

Soldering system with monitoring unit

Method for operating a soldering device and soldering device, wherein a graphic representation of at least part of the soldering device is captured, wherein an instantaneous operating state of the soldering device is determined by means of automated processing of the graphic representation dependent on information about the soldering device from the graphic representation, characterized in that the information about the soldering device is determined dependent on a reference representation of at least part of the soldering device, wherein the reference representation is captured as a graphic representation or wherein the reference representation is read as a graphic representation from a memory, and in that the reference representation characterizes a degree of oxidation of solder () when the solder () flows out over at least part of a surface () of a soldering nozzle ().

Method for operating a soldering device, soldering device

A soldering module for a soldering system for selective wave soldering, having at least one first and one second solder pot, wherein the solder pots are displaceable along an x-axis by means of an x-axis drive, along a y-axis by means of a y-axis drive, and along a z-axis by means of a z-axis drive, wherein the axes are all arranged orthogonally in relation to each other; wherein two y-axis drives and two moving devices are provided on which the solder pots are displaceable along the y-axis by means of the y-axis drives; wherein a first moving device is associated with the first solder pot, and wherein a second moving device which is different from the first moving device is associated with the second solder pot.

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Kuelsheim, Germany

Michael Schaefer