Raytheon Company

Santa Barbara Research Center

Delphi Technologies, Inc.

He Holdings, Inc.

Michael S Ray

Michael D Jack

Adam M Kennedy

Richard H Wyles

William A Radford

George R Chapman

Jan Grinberg

Ronald Melvin Taylor

Franklin A Dolezal

Jerry A Wilson

Christopher L Fletcher

William J Hamilton, Jr

Dennis C Nohns

Armando Guerrero

Eli E Gordon

Alan W Hoffman

Ronald W Berry

Devin T Walsh

James M Myrosznyk

Bonnie A Baumgratz

James A Negro

Eric Kurt Moore

Todd Lovell

Jason J Braun

Jessica K Wyles

John Varesi

Harold Fetterman

Daniel F Murphy

David J Broadhead

Richard E Bornfreund

A deployment system for deploying a store from an aircraft includes a lock member that selectively engages the store to the deployment system, an ejector that selectively ejects the store from the deployment system, and a deployment system controller communicatively coupled to the lock member and to the ejector, the system controller communicatively coupled to the aircraft to receive commands from the aircraft, wherein upon receipt of a master arm command from the aircraft the system controller maintains the lock member in an engaged state relative to the store, and wherein upon receipt of a fire command from the aircraft the system controller disengages the lock member from the store and activates the ejector to eject the store from the deployment system.

Aircraft store deployment system with improved safety of arming and releasing stores

A multi-channel, selectable identity tagging (MCSIT) data translator includes a word monitor port and a channel identifier (ID) tagger. The word monitor port is configured to receive a word generated by a specified one of a plurality of controllable components. The word includes no identifying information for the specified controllable component. The word monitor port is also configured to generate a channel ID corresponding to the specified controllable component and a word type corresponding to the word. The channel ID tagger is configured to determine whether to tag the word with the channel ID based on the word type and, based on the determination, to generate a processed word.

Multi-channel, selectable identity tagging data translator and method

An integrated audiovisual threat warning system configured to detect a threat, estimate a relative location of origin of the threat with respect to a host platform with which the system is associated, and to warn an occupant of the host platform of the threat. The system includes an audio processor configured to receive a warning tone, geo-spatial coordinate data from the host platform, and the estimated relative location of origin of the threat, and to process the warning tone based on the geo-spatial coordinate data and the direction information to generate a directional audio warning signal. The system also includes a plurality of speakers configured to audibly project the directional audio warning signal to audibly identify the estimated relative location of origin of the threat, and a display control unit configured to display the estimated relative location of origin of the threat overlaid on a map.

Integrated 3D audiovisual threat cueing system

A dual band imager includes a radiation absorbing layer for absorbing light of a first wavelength coupled to a readout circuit (ROIC), and at least one radiation detector for detecting light of a second wavelength coupled to the ROIC via a corresponding opening extending through the radiation absorbing layer.

Dual band imager with visible or SWIR detectors combined with uncooled LWIR detectors

A vehicle vision system displays a vehicle pathway image that includes a reticle for visually identifying the in-path portion of the image. A reticle array is disposed between a video camera chip and a lens, and includes a conical or frustro-conical region of substantially un-attenuated light transmissivity surrounded by a region of perceptibly attenuated light transmissivity, such that in-path portions of the displayed image are substantially unchanged and out-of-path portions of the displayed image are perceptibly attenuated. The reticle array may also include a number of reduced transmissivity lines traversing its conical or frustro-conical region to produce a series of receding stadia lines in the in-path portion of the displayed image, enabling the driver to reliably discern the range of displayed objects.

Vehicle pathway vision system having in-path delineation reticle

A microbolometer unit cell ( ) includes a substantially planar upper-level incident radiation absorption and detection structure ( ), a substantially planar middle-level radiation reflection structure ( ) spaced apart from the upper-level incident radiation absorption and detection structure for defining an optical resonant cavity ( ) there between, and a substantially planar lower-level thermal isolation leg structure ( ) spaced apart from the middle-level radiation reflection structure and electrically coupled to the upper-level incident radiation absorption and detection structure and to an underlying readout circuit. The lower-level thermal isolation leg structure is electrically coupled to the upper-level incident radiation absorption and detection structure through a leg ( ) that passes through an aperture ( ) within the middle-level radiation reflection structure, the leg also functioning as a structural support member. The lower-level thermal isolation leg structure is electrically coupled to the readout circuit through another leg ( ) that terminates on an electrical contact ( ) disposed on an underlying readout integrated circuit ( ), and the middle-level radiation reflection structure is supported by an extension of the leg ( A).

Advanced high speed, multi-level uncooled bolometer and method for fabricating same

A focal plane array (FPA) of infrared (IR) radiation detectors ( ), such as an array of microbolometers, includes an active area ( A) containing a plurality of IR radiation detectors, a readout integrated circuit (ROIC) ( ) that is mechanically and electrically coupled to the active area and, disposed on the ROIC, a plurality of heater elements ( A) that are located and operated so as to provide a substantially uniform thermal distribution across at least the active area. The FPA further includes a plurality of temperature sensors ( B), individual ones of which are spatially associated with one of the heater elements for sensing the temperature in the vicinity of the associated heater element for providing closed loop operation of the associated heater element. In one embodiment pairs of the heater elements and associated temperature sensors are distributed in a substantially uniform manner across at least a top or a bottom surface of the ROIC, while in another embodiment pairs of the heater elements and associated temperature sensors, or only the heater elements, are distributed in accordance with a predetermined thermal profile of the FPA. The plurality of heater elements may each be composed of a silicon resistance, and the plurality of temperature sensors may each be each composed of a silicon temperature sensor.

Method and apparatus providing focal plane array active thermal control elements

A monolithic microelectronic array structure includes a microelectronic integrated circuit array having a first plurality of microelectronic integrated circuit elements each deposited on a front side of a substrate. The substrates are physically discontinuous so that each substrate comprises a substrate island which is physically separated from the other substrate islands. The monolithic microelectronic array structure optionally includes a first plurality of input/output elements with a respective input/output element associated with and directly connected to each of the microelectronic integrated circuit elements, and a second plurality of electrically conductive interconnects extending between the microelectronic integrated circuit elements of adjacent substrate islands. The monolithic microelectronic array structure may be planar, or it may be curved.

Monolithic microelectronic array structure having substrate islands and its fabrication

A radiation sensor. The inventive sensor has a two-level detector structure formed on a substrate in which a thermal detector element is suspended over the substrate as a microbridge structure. A receiver of electromagnetic radiation is provided on the same side of the substrate in a manner that efficiently couples the radiation field to the thermal detector element. The thermal detector element has a sandwich structure including a heater metal layer, a dielectric layer, and a thin film thermo-resistive material. The thermal detector element is suspended out of physical contact with the receiver. In one embodiment, the receiver is an antenna having a crossed bowtie configuration that efficiently couples the radiation field to the detector element. The inventive radiation sensors are especially useful for mm-wave and microwave sensing applications. The sensor can be used individually or in linear or two-dimensional arrays thereof. The invention also is directed to a method of fabricating such a radiation sensor.

Architecture and method of coupling electromagnetic energy to thermal detectors

Disclosed is a method for fabricating an array of electromagnetic radiation responsive photodiodes, and an array fabricated in accordance with the method. The method includes steps of (a) providing a transparent substrate (12); (b) growing on the substrate an electrically conductive buffer layer (14), an n-type radiation absorbing layer (16), and a p-type cap layer (18) forming a p-n junction; and (c) etching first trenches through the cap layer, the radiation absorbing layer, and partially through the buffer layer for forming initial mesa structures each having a top surface, a base, and sloping sidewalls that terminate in the buffer layer. The method further (d) forms a passivating layer (22) on the sloping side walls; (e) forms an electrical contact (24) that surrounds the bases of the initial mesa structures and that makes an ohmic contact with a surrounding portion of the buffer layer; and (f) etches a plurality of second trenches through exposed portions of the buffer layer and into the substrate. The second trenches delineate a plurality of larger mesa structures each of which supports one of the initial mesa structures. A common layer of metalization (30) is applied to exposed surfaces of the second trenches and is coupled to each of the electrical contacts. Each of the larger mesa structures has sloping side walls disposed at an angle for supporting internal reflection of radiation that is incident on the substrate, thereby concentrating the incident radiation into the radiation absorbing layer.

Method for fabricating a self-focusing detector pixel and an array

A microbolometer detector element (10) for a focal plane array is provided including an optically absorptive material structure (12) characterized by an electrical resistivity that varies as a function of its temperature coupled in spaced relation to a thermal isolation structure (20). The thermal isolation structure (20) is coupled in spaced relation to a sensor (34) connected to the optically absorptive material structure (12) for sensing the absorptive structure's (12) electrical resistivity. The thermal isolation structure (20) facilitates very high fill factors even when the pixel size is shrunk below the baseline fifty micron size. The thickness of the optically absorptive material structure (12) and the thermal isolation structure (20) can be independently controlled since the thermal isolation structure (20) is disposed in spaced relation under the absorptive material structure (12). The thermal isolation structure (20) can be made several times longer than prior art designs to increase the thermal isolation of the optically absorptive material structure (12) and to increase pixel responsivity. The thermal isolation structure (20) may include a planar member (26) for reflecting incident optical radiation not absorbed by the absorptive material (12) back to the absorptive material (12). In a preferred embodiment of the present invention, the absorptive structure (12) is a polycrystalline semiconductive layer supported above the thermal isolation structure (20) by downwardly projecting leg members (18). The thermal isolation structure (20) also includes downwardly projecting leg members (28) for supporting it in spaced relation above a silicon substrate surface (30) overlying an integrated readout circuit (34).

Advanced small pixel high fill factor uncooled focal plane array

An imaging device (10) has a plurality of unit cells that contribute to forming an image of a scene. The imaging device includes a layer of semiconductor material (16), for example silicon, that has low noise photogate charge-mode readout circuitry (20, 21, 26, 28) (e.g., CCD or CMOS readout circuitry and structures) that is disposed upon a first surface (18) of the layer. A second, opposing surface of the layer is a radiation admitting surface of the layer. The layer has a bandgap selected for absorbing electromagnetic radiation having wavelengths shorter than about one micrometer and for generating charge carriers from the absorbed radiation. The generated charge carriers are collected by the photogate charge-mode readout circuitry. A thermal sensing element (22) is disposed above and is thermally isolated from the first surface of the layer. The thermal sensing element may be, by example, one of a bolometer element, a pyroelectric element, or a thermopile element. A layer (12) of narrower bandgap semiconductor material can also be employed with this invention, wherein the layer of narrower bandgap semiconductor material (such as InGaAs or HgCdTe) is atomically bonded to the second surface along a heterojunction interface that is continuous or apertured across the second surface. The bonded layer is used to absorb NIR and visible light.

Integrated IR, visible and NIR sensor and methods of fabricating same

A microelectronic device includes a substrate device and a dark mirror coating overlying one side of the substrate device. The dark mirror coating has a via therethrough to the substrate device. The dark mirror coating has a plurality of alternating layers of dielectrics and metals. Each metallic layer has an electrically nonconducting region adjacent to the vias, preferably formed by anodizing the metallic layers after deposition.

Microelectronic device having dark mirror coating with vias therethrough

An infrared (IR) microlens array has a plurality of microlenses (12) aligned with respective IR detector array pixels (6) to focus incoming IR radiation onto the pixels (6) to improve the efficiency of IR detection, and a gas molecule getter grating (14) inside a vacuum-sealed Dewar assembly that houses the detector array (4) increases the surface area of the getter (15) to improve the efficiency of removing residual gas molecules from the Dewar assembly.

Integrated infrared microlens and gas molecule getter grating in a

An array of dual-band HgCdTe radiation detectors (10) wherein individual detectors include a first layer (14) having a first type of electrical conductivity and a bandgap selected for absorbing radiation within a first spectral band. The radiation detectors also each include a second layer (16) overlying the first layer. The second layer has a second type of electrical conductivity that is opposite the first type of electrical conductivity. Each radiation detector further includes a third layer (18) overlying the second layer, the third layer having the first type of electrical conductivity and a bandgap selected for absorbing radiation within a second spectral band. The first and second spectral bands are selected from SWIR, MWIR, LWIR, and VLWIR. The first, second and third layers are contained within at least one mesa structure (10a, 10b) that supports on a top surface thereof a first electrical contact (24) to the first layer and a second electrical contact (28) to the third layer. The at least one mesa structure further supports on a sidewall region (10b') thereof an electrical contact (30) to the second layer. The sidewall electrical contact is coupled to an electrically conductive bus that is conductively coupled in common to mesa structure sidewall electrical contacts of the plurality of radiation detectors. As a result, each radiation detector site is simplified in construction, and may be reduced in area over a site wherein a separate (third) contact, such as an indium bump, is required to contact the second layer.

Growing community of inventors

Carmel, IN, United States of America

Michael S Ray