International Business Machines Corporation

Globalfoundries Inc.

Michael S Gray

Robert F Walker

Jason D Hibbeler

Xin Yuan

Matthew Thomas Guzowski

David S Wolpert

Kevin W McCullen

Xiaoping Tang

Robert J Allen

Gustavo Enrique Tellez

Erwin Behnen

Albert Manhee Chu

Daniel Nelson Maynard

Leon Jacob Sigal

Robert Mahlon Averill, Iii

Evon C Greanias

Frank L Stein

Robert L Donaldson

Timothy A Schell

Faye D Baker

Mervyn Y Tan

Mitchell R DeHond

Veit Gernhoefer

Dureseti Chidambarrao

Lars W Liebmann

Fook-Luen Heng

Steven Paul Ostrander

Joachim Keinert

Christopher J Gonzalez

Tuhin Sinha

Atsushi Ogino

Alexander Ivrii

Stephen Larry Runyon

Rani Narayan

Henry A Bonges, Iii

Guy F Verrier

Mervyn Yee-Min Tan

Karl David Schubert

Uwe Fassnacht

Xiaoyun K Wu

Michael Gester

Stephen I Runyon

Bruce C Wheeler

Aspects of the invention include systems and methods configured to provide hierarchical circuit designs that makes use of a color decomposition of library cells having boundary-aware color selection. A non-limiting example computer-implemented method includes placing a plurality of shapes within a hierarchical level of a chip design. The plurality of shapes can include a top boundary shape, a bottom boundary shape, one or more center boundary shapes, and one or more internal shapes. A hierarchical hand-off region is constructed by pinning the top boundary shape to a first mask, pinning the bottom boundary shape to a second mask, and pinning the one or more center boundary shapes to a same mask. The same mask is selected from one of the first mask and the second mask.

Hierarchical color decomposition of library cells with boundary-aware color selection

Aspects of the invention include a computer-implemented method of chip design. The computer-implemented method of chip design include establishing an architecture with alternating rows of differently colored chip-level shapes. Cells are constrained to be rectangular with restricted widths. Constraint-observing parent and child cells are generated and respectively include boundaries with alternating rows of differently colored cell-level shapes for disposition in the architecture. The parent cell is positioned in the architecture such that the cell-level shapes thereof exhibit row and color alignment with the chip-level shapes. Child cells exhibiting uni-axial or multi-axial reflectivity are instantiated in the parent cell. A color solution is instantiated for each child cell in the parent cell such that cell-level shapes of the child cells exhibit row and color alignment with the cell-level shapes of the parent cell.

Hierarchical color decomposition of process layers with shape and orientation requirements

A structure including a plurality of dielectric regions is described. The structure can include a rivet cell. The rivet cell can include a set of stacked vias. The rivet cell can extend through a stress hotspot of the structure. A length of the rivet cell can thread through at least one dielectric region among the plurality of dielectric regions. The rivet cell can be among a number of rivet cells inserted in the stress hotspot. The stress hotspot can be among a plurality of stress hotspots across the structure. A length of the rivet cell can be based on a model of a relationship between the length of the rivet cell and an energy release rate of the structure. The rivet cell can thread through an interface between a first dielectric region and a second dielectric region having different dielectric constants.

Stacked via rivets in chip hotspots

Methods, systems and computer program products for avoiding Boolean DRC failures during cell placement are provided. Aspects include generating a semiconductor layout by filling a plurality of rows within a macro block with cells including functional cells and fill cells. Aspects also include modifying the semiconductor layout by removing one or more fill cells from the macro block to create a gap. Aspects also include examining a set of cells that border edges of the gap to identify one or more predicted rule violations. Based on the identified one or more predicted rule violations, aspects also include modifying the semiconductor layout to change a shape of the gap to avoid the one or more predicted rule violations.

Fill techniques for avoiding Boolean DRC failures during cell placement

Methods, systems and computer program products for providing fin-based fill cell optimization are provided. Aspects include receiving a semiconductor layout comprising at least a first logic cell, a second logic cell, and a fill cell. A left boundary of the fill cell is adjacent to the first logic cell and a right boundary of the fill cell is adjacent to the second logic cell. Aspects also include determining a number of active left fins, right fins, and active fill cell fins associated with FinFET structures of the first logic cell, second logic cell and fill cell, respectively. Aspects also include comparing the number of active fins to a set of fin rules. Responsive to determining that the semiconductor layout violates the set of fin rules, aspects include modifying the semiconductor layout to change the number of active fill cell fins to satisfy the set of fin rules.

Fin-based fill cell optimization

Aspects include techniques for selective boundary overlay insertion for hierarchical circuit design. A method may include determining, by a processing device, a block type of a child block. The method may further include electively inserting, by the processing device, at least one of an instantiated boundary overlay and a merged boundary overlay into the hierarchical circuit design based on the block type of the child block. The instantiated boundary overlay enables a parent block to pass a testing at an out-of-context level, and the merged boundary overlay enables the parent block to continue to pass the testing when the child block is inserted into the parent block associated with the child block.

Selective boundary overlay insertion for hierarchical circuit design

Methods of the present disclosure can include: using a computing device to perform actions including: applying a design rule check (DRC) on a proposed integrated circuit (IC) layout, wherein the DRC applies a set of restrictive design rules (RDRs) in response to the proposed IC layout being a contact area (CA) layout; computing a conflict graph for the proposed IC layout in response to one of the IC layout being a metal layer layout and the set of RDRs being satisfied; determining whether the IC layout is one of non-colorable, indeterminate, partially colorable, and fully colorable; and partially coloring the IC layout and identifying non-colorable nodes in response to the IC layout being indeterminate or partially colorable.

Reducing color conflicts in triple patterning lithography

Solutions for optimizing an integrated circuit layout for implementation in an integrated circuit are disclosed. In one embodiment, a computer-implemented method is disclosed including: obtaining a plurality of hierarchical constraints in mathematical form, the plurality of hierarchical constraints defining a first integrated circuit layout; partitioning the plurality of hierarchical constraints into groups according to one or more partitioning rules; determining whether a boundary condition exists between two of the groups, and distributing a slack or a gap between the two of the groups in the case that the boundary condition exists; creating a plurality of integer linear programming problems associated with each of the groups; determining a solution for each of the plurality of integer linear programming problems; and integrating each solution together to form a second integrated circuit layout.

Parallel solving of layout optimization

A mechanism is provided for post timing layout modification for performance. The mechanism selectively applies layout modification based on timing analysis at the path level. The mechanism applies stress only to transistors that are in a setup critical path without applying stress to transistors in hold critical paths. The mechanism may use a method to apply stress to improve performance of a transistor in a setup critical path, as long as the stress does not also improve performance of a neighboring transistor in a hold critical path. In some instances, the mechanism may apply stress to improve performance of a transistor in a setup critical path while simultaneously degrading performance of a transistor in a hold critical path.

Post timing layout modification for performance

An approach that obtains a feasible integer solution in a hierarchical circuit layout optimization is described. In one embodiment, a hierarchical circuit layout and ground rule files are received as input. Constraints in the hierarchical circuit layout are represented as an original integer linear programming problem. A relaxed linear programming problem is derived from the original integer linear programming problem by relaxing integer constraints and using relaxation variables on infeasible constraints. The relaxed linear programming problem is solved to obtain a linear programming solution. Variables are then clustered, and at least one variable from each cluster is rounded to an integer value according to the linear programming solution. Next, it is determined whether all the variables are rounded to integer values. Unrounded variables are iterated back through the deriving of the integer linear programming problem, solving of the relaxed linear programming problem, and rounding of a subset of variables. A modified hierarchical circuit layout is generated in response to a determination that all the variables are rounded to integer values.

Methods to obtain a feasible integer solution in a hierarchical circuit layout optimization

A computer-implemented method for handling a plurality of constraints in layout optimization for an integrated circuit (IC) layout is disclosed. In one embodiment, the method includes building a graph representing the plurality of constraints; marking two-dimensional constraints in the plurality of constraints; generating two-dimensional clusters including groups of the two-dimensional constraints; handling at least one of the two-dimensional clusters, the handling including finding a solution for the two-dimensional constraints in the at least one two-dimensional cluster; repeating the handling for any unprocessed two-dimensional clusters until all of the two-dimensional clusters are handled; and adopting the solution for each of the two-dimensional clusters to solve at least a portion of the plurality of constraints including the two-dimensional clusters.

Handling two-dimensional constraints in integrated circuit layout

An adaptive weighting method for layout optimization differentiates different priorities by assigning the weight of a higher priority (p) to be multiple of the weight of a lower priority (p) where W(p)=m% W(p. To avoid numerical imprecision, this method keeps the total cost in the objective function within a trustable range by scaling the initial weights in the objectives, while maintaining relativity, to produce the scaled weights.

Adaptive weighting method for layout optimization with multiple priorities

A method of layout optimization containing parameterized cells includes reading a physical design containing parameterized cells, creating a new version for each of usage of a given parameterized cell. The method optimizes physical design shapes of each new version of the parameterized cell by assigning variables to parameters of the parameterized cell according to a desired objective. Then, the method updates the parameters of each new version of the parameterized cell and replaces each new version of the parameterized cell with an instance of the parameterized cell having updated parameters. The method can optionally adjust physical design shapes based on constraints related to the parameters.

Layout optimization using parameterized cells

Optimizing an integrated circuit design to improve manufacturing yield using manufacturing data and algorithms to identify areas with high probability of failures, i.e. critical areas. The process further changes the layout of the circuit design to reduce critical area thereby reducing the probability of a fault occurring during manufacturing. Methods of identifying critical area include common run, geometry mapping, and Voronoi diagrams. Optimization includes but is not limited to incremental movement and adjustment of shape dimensions until optimization objectives are achieved and critical area is reduced.

IC layout optimization to improve yield

An approach that obtains a feasible integer solution in a hierarchical circuit layout optimization is described. In one embodiment, a hierarchical circuit layout and ground rule files are received as input. Constraints in the hierarchical circuit layout are represented as an original integer linear programming problem. A relaxed linear programming problem is derived from the original integer linear programming problem by relaxing integer constraints and using relaxation variables on infeasible constraints. The relaxed linear programming problem is solved to obtain a linear programming solution. A subset of variables from the relaxed linear programming problem is rounded to integer values according to the linear programming solution. Next, it is determined whether all the variables are rounded to integer values. Unrounded variables are iterated back through the deriving of the integer linear programming problem, solving of the relaxed linear programming problem, and rounding of a subset of variables. A modified hierarchical circuit layout is generated in response to a determination that all the variables are rounded to integer values.

Obtaining a feasible integer solution in a hierarchical circuit layout optimization

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Fairfax, VT, United States of America

Michael S Gray