Applied Materials, Inc.

Eastman-kodak Company

Varian Semiconductor Equipment Associates, Inc.

Michael Rohrer

Tuan Anh Nguyen

William Tyler Weaver

Jason M Schaller

Robert Brent Vopat

Gregory John Freeman

Eric D Hermanson

Robert J Mitchell

James D Strassner

D Jeffrey Lischer

Steven M Anella

Dawei Sun

James Paul Buonodono

Jeffrey Charles Blahnik

Paul N Winberg

Mark A White

Bradley M Pomerleau

Angela Cheng

A system and method of heating a workpiece to a desired temperature is disclosed. This system and method consider the physical limitations of the temperature device, such as time lag, temperature offset, and calibration, in creating a hybrid approach that heats the workpiece more efficiently. First, the workpiece is heated using open loop control to heat the workpiece to a threshold temperature. After the threshold temperature is reach, a closed loop maintenance mode is utilized. In certain embodiments, an open loop maintenance mode is employed between the open loop warmup mode and the closed loop maintenance mode. Additionally, a method of calibrating a pyrometer using a contact thermocouple is also disclosed.

Hybrid control system for workpiece heating

Embodiments described herein relate to a precision dynamic leveling mechanism for repeatedly positioning the pedestal within a process. The precision dynamic leveling mechanism includes bearing assemblies. Bearing assemblies having inner races forced against a pedestal assembly carrier and outer races forced against a guide adaptor provide nominal clearance between the inner races and outer races to allow the inner races and the outer races to slide on each other with minimal or no radial motion.

Precision dynamic leveling mechanism with long motion capability

A method and apparatus for of improving processing results in a processing chamber by orienting a substrate support relative to a surface within the processing chamber. The method comprising orienting a supporting surface of a substrate support in a first orientation relative to an output surface of a showerhead, where the first orientation of the supporting surface relative to the output surface is not coplanar, and depositing a first layer of material on a substrate disposed on the supporting surface that is oriented in the first orientation.

Dynamic leveling process heater lift

An ion implantation apparatus including an enclosure defining a process chamber, a carriage slidably mounted on a shaft within the process chamber and coupled to a drive mechanism adapted to selectively move the carriage along the shaft. A platen assembly can be coupled to the carriage, and a linkage conduit can extend between a side wall of the enclosure and the carriage. The linkage conduit can include a plurality of pivotably interconnected linkage members that define a contiguous internal volume that is sealed from the process chamber. The contiguous volume can be held at a desired vacuum pressure separate from the vacuum environment of the process chamber.

Linkage conduit for vacuum chamber applications

A method and system for environmental control in film processing is disclosed. In general, photographic film is coated with a processing solution, such as a developer solution, and is then developed within a controlled air environment. In the preferred embodiments, the temperature and humidity within the air environment is strictly controlled, which allows the development process to be more accurately and consistently controlled. This also allows fewer processing chemicals to be used and reduces harmful effluents caused by photographic film processing.

Method and system for environmental control during film processing

Growing community of inventors

Cedar Park, TX, United States of America

Michael Rohrer