Cirrus Logic Inc.

Michael Robinson

Aleksey Sergeyevich Khenkin

David Patten

Ross Crawford Morgan

Justin Richardson

Itisha Tyagi

This application relates to methods and apparatus for voltage monitoring of switching drivers. A modulator is configured to receive a modulator input signal and to controlling switching of an output stage of the switching driver to generate a first drive signal. A voltage monitor is configured to receive a first digital signal tapped from the modulator and to generate an indication of output voltage of the first drive signal from the first digital signal by controllably applying an adjustment from the first digital signal to compensate for inaccuracy between the first digital signal and the output voltage. The adjustment is based on monitored operation of the modulator. In some cases the monitored operation may be clipping of the switching driver. In some cases the monitored operation may be a signal generated by the modulator that include a contribution from a feedback signal of output voltage.

Voltage monitoring of switching drivers

An integrated circuit (IC), comprising: a first transducer driver for driving a first transducer; a second transducer driver for driving a second transducer; and boost circuitry comprising first and second boost nodes, the boost converter configurable to boost a supply voltage received at one or more input pins of the IC to provide first and second boosted voltages to respective first and second transducer drivers via respective first and second boost nodes.

Integrated circuits for driving transducers

A packaged semiconductor die may include a package terminal array comprising a plurality of terminals, wherein a spacing between the plurality of terminals of the ball grid array is less than 0.5 mm. First and second high-voltage circuits of the die may output a differential signal to a first and second terminal that may exceed 15 volts, in which the first high-voltage circuit and the second high-voltage circuit are positioned symmetrically around an axis and in which the first terminal and the second terminal are located at an edge of the package terminal array. A low-voltage circuit may be coupled to a third terminal and positioned between the first high-voltage circuit and the second high-voltage circuit, wherein the low-voltage circuit comprises circuitry organized in columns aligned along an axis and having a width defined by a fraction of the terminal spacing pitch.

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Edinburgh, United Kingdom

Michael Robinson