International Business Machines Corporation

Lenovo (Singapore) Pte. Ltd.

Michael Robert Rasmussen

Eric Vance Kline

Paul N Krystek

Stephen M Zins

Arvind Kumar Sinha

Eric Alan Eckberg

Maurice Francis Holahan

Michael Lee Graham

Mark Ward Hansen

Gregory Jay Geilow

Nathan Carl Mandelko

Lavern Richard Markham

An apparatus for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.

Dual magnetically coupled rotor heat exchanger

A method, programmed medium and system are disclosed which provide increased secure tracking of materials and products through the use of a unique coding scheme. The coding scheme contains a unique security code identifier issued by a sole certification agency, and includes a non-coded scheme for public information, and a coded scheme for private information regarding the sourcing and development of materials and products. The disclosure provides for full tracking of a product throughout the supply chain by only certified participants. The disclosed system allows for increased secure tracking of materials and products, and allows for access to greater amounts of information at various stages of manufacture and/or assembly regarding a given material or product.

Product tracking system

In association with a liquid flow through a heat exchanger situated to remove heat from electronic devices, a coolant flow control apparatus is provided. The coolant flow control apparatus comprises a first input channel for carrying liquid coolant to a first input of the heat exchanger; a flow control device positioned along a flow path that includes the first input channel, the flow control device, in response to a temperature of coolant proximate to the flow control device, is operable to enable or to prevent coolant flow along the first input channel into the heat exchanger; a second input channel for continuously carrying liquid coolant to a second input of the heat exchanger, during both times when the flow control device is enabling and is preventing the coolant flow along the first input channel into the heat exchanger; and an output channel for carrying coolant away from the heat exchanger.

Automatic in situ coolant flow control in LFT heat exchanger

A method and system for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.

Duplex flexible heat exchanger

An embodiment of the invention is directed to coolant flow control apparatus, in association with a liquid flow through heat exchanger situated to cool one or more electronic or other device. The apparatus comprises a first input channel for carrying liquid coolant to a first input of the heat exchanger, and further comprises a flow control device positioned along a flow path that includes the first input channel. The flow control device is provided with a gating element supported for selected movement across the flow path, in order to selectively vary the amount of coolant moving through the flow path. The apparatus further include an actuator located in the flow control device that comprises a metal component which is directly tied to the gating element, wherein the metal component changes its shape in response to specified changes in coolant temperature, and a given change in the shape of the metal component acts to selectively move the gating element with respect to the flow path.

An embodiment is directed to an IC mounting assembly that comprises an IC device having a first planar surface, wherein multiple electrically conductive first terminals are located at the first surface. The assembly further comprises an IC device mounting platform having a second planar surface in closely spaced relationship with the first surface, wherein multiple electrically conductive second terminals are located at the second surface, each second terminal corresponding to one of the first terminals. A solder element extends between each first terminal and its corresponding second terminal, and a constraining element is fixably joined to the second surface, wherein the constraining element has a CTE which is selectively less than the CTE of the mounting platform at the second surface. The constraining element is provided with a number of holes or apertures, and each hole is traversed by a solder element that extends between a first terminal and its corresponding second terminal.

Use of a local constraint to enhance attachment of an IC device to a mounting platform

A thermal flow material-free thermally conductive interface between a mounted integrated circuit device and a heat sink that comprises a mounted integrated circuit device, a heat sink vertically disposed over the device, a vertically compressible thermally conductive member unattachably disposed between the device and the heat sink, and an unattached frame member horizontally enclosing the compressible member.

Flux-free detachable thermal interface between an integrated circuit device and a heat sink

A protective cover for a dual inline memory module (DIMM) circuit card includes a pair of cover members for substantially containing the DIMM circuit card. The cover members are secured to opposite sides of the DIMM circuit card. The pair of cover members defines a socket-receiving channel between respective printed-circuit-board (PCB) mating faces of the cover members. The cover members includes a plurality of positioning features engaging the DIMM circuit card for positioning a portion of the DIMM circuit card within the socket-receiving channel.

Protective cover for DIMM circuit card

This device is advantageous for connecting an electronic circuit card to a test system to inspect the assembled electronic circuit card without damage to the mating connector thereon. A toggle actuated pressing member supports an electrical connector and a flex cable which, in turn, is connected to an electronic device. The pressing member or slide member may be moved toward a mating electrical connector attached to an electronic circuit card, aligned with the connector on the slide member, and forced into a connected condition therewith. The controlled action of the slide block and the connector supported thereon effect connection of the connectors without creating stresses that may damage the electronic circuit card or the connector thereon. A connector supported by the slide block is disconnected by moving the slide block away from the electronic circuit card and, by permitting spring-biased foot blocks to hold the electronic circuit card against movement until after disengagement occurs.

Growing community of inventors

Mazeppa, MN, United States of America

Michael Robert Rasmussen