Te Connectivity Solutions Gmbh

General Electric Company

Te Connectivity Corporation

Tyco Electronics (shanghai) Co., Ltd.

Te Connectivity Services Gmbh

Michael Ritchie

Kenneth Jermstad

Marcus Updyke

Anthony Ball

Roberto Francisco-Yi Lu

Lei Zhou

Sonny O Osunkwo

Du Wen

Michael Pedrick

Andrew Hutchinson

Shu Wang

Philip Amante

A bubble measurement system includes a bubble detector including a vessel having a flow path configured to receive a flow of fluid includes air bubbles from a bubble generator. The bubble measurement system includes an imaging system having an imaging device for imaging the fluid and air bubbles in the flow path of the vessel of the bubble detector. The imaging system has an imaging controller coupled to the imaging device and receiving images from the imaging device. The imaging controller processes the images to measure bubble size of each air bubble passing through the bubble detector.

Bubble measurement system and method

A substrate for a tamper sensor includes a plurality of walls and a tab. The walls define a protective volume with an open side. The walls have a plurality of open edges adjacent the open side and a plurality of interior edges different from the open edges. The tab extends from one of the interior edges of one of the walls and is disposed within the protective volume.

Substrate for a tamper sensor

A tamper sensor assembly that includes a substrate with a protective bulk section including tamper circuitry and a hardware section configured to receive hardware circuitry and extending from the protective bulk section; the hardware circuitry electrically connected to the tamper circuitry to alter operation of the hardware circuitry responsive to modification of the tamper circuitry. The substrate additionally includes an attachment section extending from the hardware section. The tamper sensor assembly also includes a first fold in the substrate to position a first portion of the hardware section to extend along the protective bulk section, and a second fold in the substrate to position a second portion of the hardware section to extend along the first portion of the hardware section.

Tamper sensor assembly

A tamper sensor that includes a substrate and a conductive layer placed on the substrate. The tamper sensor also includes an insulation layer that is stacked on the conductive layer to form a layered tamper circuit. In addition, the substrate of the tamper sensor is the only substrate of the tamper sensor.

Tamper sensor

A submersible device sealing system includes a submersible device, a cable having wires connected to the submersible device, and a sheath about the wires. There is a sleeve about the cable sheath, and a crimp about the sleeve. An encapsulant is disposed about the crimp, the wires, and the submersible device to prevent fluid ingress to the wires connected to the submersible device. The encapsulant is made of material separable from the cable sheath but the crimp is made of a material bondable to the encapsulant to seal the submersible device with respect to the fluid.

Submersible device sealing system and method

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Hampton, VA, United States of America

Michael Ritchie