Micron Technology Incorporated

Michael Richard Spica

Patrick T Caraher

David G Springberg

Gary D Hamor

João Elmiro Da Rocha Chaves

Donald Shepard

A method performed by automated test equipment (ATE) includes power cycling a solid state drive (SSD) device under test by the ATE, wherein the SSD device includes a memory controller integrated circuit (IC) attached to a printed circuit board (PCB) having a PCB interface; communicating one or more signals between the ATE and the memory controller IC using the PCB interface in a normal system mode; sending a command to cause the memory controller IC to place the PCB interface in a boundary scan mode; remapping a portion of pins of the PCB interface to a boundary scan interface; and communicating one or more boundary scan signals between the ATE and the memory controller IC using the remapped portion of pins of the PCB interface in the boundary scan mode.

System access boundary scan via system sideband signal connections

A detection is made by a processing device allocated to a memory device test board of a distributed test platform that a memory sub-system has engaged with a memory device test resource of the memory device test board. A test is identified to be performed for a memory device of the memory sub-system. The test includes first instructions to be executed by a memory sub-system controller of the memory sub-system in performance of the test and second instructions to be executed by the processing device in performance of the test. The second instructions are to cause one or more test condition components of the memory device test resource to generate one or more test conditions to be applied to the memory device while the memory sub-system executes the first instructions. Responsive to a transmission of the first instructions to the memory sub-system controller, the second instructions are executed.

Intelligent memory device test rack

A system comprises a testing mode register, a set of pins, and a test access port controller. The test access port controller initiates a first testing mode by configuring the set of pins according to a first pin protocol. The test access port controller configures a first pin to receive first test pattern data based on a first convention and configures a second pin to output first test result data based on the first test pattern data. Based on detecting a register command stored in the testing mode register, the test access port controller initiates a second testing mode by configuring the set of pins according to a second pin protocol. The test access port controller configures the first pin to receive a second test pattern data generated based on a second convention and configures the second pin to output a second test result data based on the second test pattern data.

Test access port architecture to facilitate multiple testing modes

A system receives event information associated with an event that corresponds to a temperature of a memory sub-system including memory devices encased in respective packages. The system determines whether the event information associated with the event satisfies a threshold condition. Responsive to determining that the event information associated with the event satisfies the threshold condition, the system causes a thermoelectric component (TEC) that is coupled to an external surface of each of the respective packages of the memory devices of the memory sub-system to transfer thermal energy between the TEC and the memory devices via thermal conduction.

Using a thermoelectric component to improve memory sub-system performance

A memory sub-system comprises a power management component comprising a plurality of regulators configured to supply respective operating voltages for components of the memory sub-system. The power management component is configured to adjust a regulator voltage level provided to a particular component until an operation state change of the particular component is detected. The power management voltage level is further configured to determine a value of the regulator voltage level at which the operation state change of the particular component is detected.

Power management component for memory sub-system voltage regulation

A system includes a memory device and a processing device coupled to the memory device. The processing device is configured to switch an operating mode of the memory device between a test mode and a non-test mode. The system further includes a test mode access component that is configured to access the memory device while the memory device is in the test mode to perform a test mode operation.

Memory device test mode access

Data traffic comprising data packets communicated between a memory sub-system and a host system is monitored by a processing device at the memory sub-system. Data packets are classified according to packet type. Log data comprising a frequency and latency information associated with each packet type is generated. The log data is stored in a memory component of the memory sub-system.

Data logging sub-system for memory sub-system controller

Command execution data is received. The command execution data comprises a block address corresponding to an functional component, a register identifier corresponding to a design for testability (DFT) register of the functional component, and command data. The command execution data is converted to a serial command. The serial command is committed to the DFT register of the functional component. A response to the serial command is received. The response is generated by the functional component based on the serial command. The response is converted to command response data and is provided to a testing sub-system.

Dedicated design for testability paths for memory sub-system controller

A system comprises a memory sub-system controller mounted to a printed circuit board (PCB) and an in-circuit test (ICT) device. The memory sub-system controller has test points on the PCB comprising stimulus points and observation points. The ICT device connects to the test points of the controller. The ICT device converts automated test pattern generation (ATPG) input test vectors to test signals. A first set of pin drivers of the ICT device applies the test signals to the stimulus points of the controller and a second set of pin drivers of the ICT device read output signals output at the observation points of the controller. A comparator of the ICT device compares the output signals with output test vectors. The comparator provides test result data comprising a result of the comparison.

Controller structural testing with automated test vectors

First event information that is associated with an event that corresponds to a temperature of a memory sub-system is received. Whether the first event information associated with the event that corresponds to the temperature of the memory sub-system satisfies a first threshold condition is determined. Responsive to determining that the first event information associated with the event that corresponds to the temperature of the memory sub-system satisfies the first threshold condition, a thermoelectric component (TEC) is caused to change from an inactive state to an active state by decreasing a temperature at a bottom surface of the TEC that is coupled to the memory sub-system as a temperature at a top surface of the TEC increases.

A test rack includes two or more memory device test boards where each memory device test boards includes two or more memory device test resources. Each of the two or more memory device test boards includes a separate processing device allocated to the memory device test resources of a corresponding memory device test boards. A processing device of a test board detects that a first memory sub-system has engaged with a first memory device test resource of the corresponding memory device test board. The processing device identifies a first test to be performed for a first memory device of the first memory sub-system, where the first test includes one or more first test instructions to be executed in performance of the first test. The processing device causes the one or more first test instructions to be transmitted to the first memory sub-system, where the first test is performed by the one or more first test instructions executing at the first memory sub-system.

Growing community of inventors

Eagle, ID, United States of America

Michael Richard Spica