National Semiconductor Corporation

Flowline, Inc.

Hughes Aircraft Company

Bae Systems Information and Electronic Systems Integration Inc.

W. R. Grace Co.-Conn.

Michael Richard Ehlert

William Jeffrey Schaefer

Alan L Kovacs

Larry Elvert Carter

Michael Joseph Rafferty

John W Lau

Jack H Enloe

Thomas O Perkins, Iii

Candice L Brittain

Ronald H Schmidt

Blair E Coburn

Peter M Wallace

Helen Congleton

An ultrasonic level sensor includes: a housing; an ultrasonic transducer having a face surface for emitting an ultrasonic signal; a reflector with a flat surface positioned at an angle with respect to the face surface of the ultrasonic transducer for reflecting and directing the ultrasonic signal to a surface of a material in a container; and a scattering structure to reflect unwanted scattered ultrasonic signals away from the surface of the liquid, wherein the ultrasonic signal is reflected from the surface of the material and from the flat surface of the reflector and received by the ultrasonic transducer.

Ultrasonic level sensor with sound trap

Ultrasonic level sensor with reflectors

A system is provided for the integration of microwave components in a low temperature co-fired ceramic, the system includes a low temperature co-fired ceramic body having a top surface, into which is disposed a plurality of cavities; a plurality of microwave devices, each device being disposed within a cavity such that the cavities provide radio isolation to the devices; and a coaxial connection disposed within the body configured to connect the devices to external components the coaxial components comprising vias disposed within the co-fired ceramic body.

Low temperature co-fired ceramic (LTCC) transmit/receive (T/R) assembly utilizing ball grid array (BGA) technology

A ceramic circuit structure comprising a plurality of ceramic layers and at least one electronic component embedded within the plurality of ceramic layers. Within a first one of the ceramic layers is a via that passes through the ceramic layer. A contact pad is formed on a surface of the ceramic layer. A barrier cap is formed between the via and the contact pad. A dielectric ring covers a peripheral portion of the contact pad and an adjacent portion of the dielectric material layer surface immediately surrounding the contact pad, such that any solder that is applied to the contact does not contact the peripheral portion of the contact pad or the ceramic material.

Materials and structure for a high reliability BGA connection between LTCC and PB boards

Materials and structure for a high reliability bga connection between LTCC and PB boards

Hermetic package designs for HDMI substrates are discussed. The designs for a hermetically sealed, perimeter-leaded package may have the following features:

Ceramic electronic package design

An integrated circuit package includes a rectangular base, and a continuous sidewall which extends upwardly from the periphery of the base. Microelectronic circuit components are mounted on the base in a cavity defined within the sidewall. A domed lid includes a resilient central domed portion which arches above the cavity. A peripheral edge portion of the lid extends downwardly into the cavity by a small distance, adjacent to the inner surface of the sidewall. A lip extends outwardly from the edge portion and is sealingly welded at its periphery to the upper surface of the sidewall. The joint between the lip and edge portion is resilient and acts as a hinge, such that when a force or pressure is applied to the domed portion, the edge portion rotates about the hinge into abutment with the inner surface of the sidewall. This transfers a major component of the applied force to the sidewall, and resists deflection of the domed portion into the cavity.

Domed lid for integrated circuit package

Growing community of inventors

Irvine, CA, United States of America

Michael Richard Ehlert