Texas Instruments Corporation

Michael Richard Douglass

Simon Joshua Jacobs

David Mehrl

Walter Marvin Duncan

Richard O Gale

Andrew B Sontheimer

Mark Henry Strumpell

Judith C Frederic

A process for protecting a MEMS device used in a UV illuminated application from damage due to a photochemical activation between the UV flux and package gas constituents, formed from the out-gassing of various lubricants and passivants put in the device package to prevent sticking of the MEMS device's moving parts. This process coats the exposed surfaces of the MEMS device and package's optical window surfaces with a metal-halide film to eliminate this photochemical activation and therefore significantly extend the reliability and lifetime of the MEMS device.

MEMS device with controlled gas space chemistry

System and method for reducing failures due to hinge memory in a microdisplay display system. A preferred embodiment includes setting the state of each micromirror in a digital micromirror device based on an image being displayed, recording a usage history for the micromirrors, and providing a sequence of states to each micromirror when the display system is in an inactive mode. The sequence of states provided to a micromirror is based on the micromirror's usage history. The operation of the micromirrors while a display system containing the digital micromirror device is not in active use can help to reverse or eliminate hinge memory, thereby extending the lifetime of the digital micromirror device.

System and method for hinge memory mitigation

A method and system of reducing the permanent accumulated deformation of a deflectable member of a micromechanical device through thermal stabilization. The accumulated deformation is due to the repeated bending or twisting of a flexible component of the micromechanical deice typically the repetitive deformation of a flexible hinge connecting a rigid member to substrate. After the device is fabricated, passivated (,), and packaged (,), the packaged device is baked (,) at a temperature of at least 120&deg; C. A 150&deg; C. bake for 12 to 16 hours is preferred. Lower temperatures required longer baking periods.

Reduced deformation of micromechanical devices through thermal stabilization

Growing community of inventors

Plano, TX, United States of America

Michael Richard Douglass