Hauser Chemical Research, Inc.

Michael Renbarger

Ray L Hauser

Bolin Zheng

Mark A Lange

Processes and techniques are described for concurrent electroplating of yttrium, barium and copper from aqueous solution onto a desired substrate (e.g., nickel, nichrome or silver). Compounds of these elements are dissolved in aqueous solution with a complexing agent meeting defined criteria and then are placed in a plating cell in which the cathode is the substrate on which the elements are to be deposited. After the elements have been deposited, they are oxidized to provide the desired perovskite structure. The process may be continuous or non-continuous.

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Littleton, CO, United States of America

Michael Renbarger