Harris Corporation

Michael Raymond Weatherspoon

Louis Joseph Rendek, Jr

Lawrence Wayne Shacklette

John E Rogers

Casey Philip Rodriguez

David B Nicol

David M Smith

Robert Patrick Maloney

Joshua P Bruckmeyer

Travis L Kerby

Arthur Wilson

Michael Ray Lange

Andrew Craig King

Gary M Singer

Glenroy Weimar

Embodiments of switches () include first and second electrical conductors () suspended within an electrically-conductive housing (), and a contact element () having an electrically-conductive portion () that establishes electrical contact between the first and second electrical conductors () when the contact element () is in a closed position. The electrically-conductive portion () is electrically isolated from a ground plane () of the switch () by adjacent electrically-insulative portions () of the contact element ().

Switches for use in microelectromechanical and other systems, and processes for making same

A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.

Method for making electrical structure with air dielectric and related electrical structures

An electronic package includes a semiconductor die, conductive pillars extending outwardly from the semiconductor die, and a liquid crystal polymer (LCP) body surrounding the semiconductor die and having openings therein receiving respective ones of the conductive pillars. A first interconnect layer is on the LCP body and contacts the openings. Conductive bodies are in the openings to connect the conductive pillars to the first interconnect layer.

Embedded electronic packaging and associated methods

Embodiments of switches () include electrically-conductive housings (), and electrical conductors () suspended within and electrically isolated from the housings (). Another electrical conductor () is configured to move between a first position at which the electrical conductor () is electrically isolated from the electrical conductors () within the housings (), and a second position at which the electrical conductor () is in electrical contact with the electrical conductors () within the housings (). The switches () further include an actuator () comprising an electrically-conductive base () and an electrically-conductive arm () having a first end restrained by the base (). The electrical conductor () is supported by the arm (), and the arm () is operative to deflect and thereby move the electrical conductor () between its first and second positions.

A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.

Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices

A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a cover layer on the substrate and the electrically conductive pattern, and forming openings in the cover layer and being aligned with the electrically conductive pattern. The method also includes positioning an IC on the cover layer so that bond pads of the IC are aligned with the openings, and heating under pressure the cover layer to both mechanically secure and electrically interconnect the IC.

Method for making electronic device with cover layer with openings and related devices

A method for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions.

Method to make a multilayer circuit board with intermetallic compound and related circuit boards

Miniaturized devices such as MEMS switches () have encapsulating enclosures (). The enclosure () and the remainder of the switch () are fabricated on a concurrent basis by depositing layers of an electrically-conductive material, such as copper, on a substrate ().

Processes for fabricating MEMS switches and other miniaturized devices having encapsulating enclosures

Digital data system disposed on a substrate includes a digital data device and at least one digital data interconnect disposed on the substrate. The digital data interconnect is comprised of a plurality of material layers stacked to form a three-dimensional structure. The material layers form a conductive shield, a plurality of straps which are periodically spaced along an interior length of the shield, and a core which includes one or more conductors. The conductors extends along the length of the tubular form parallel to the opposing walls and are suspended on the straps, separated from the conductive shield by an air gap. First and second conductors of the core can facilitate a differential signaling mode.

Digital data device interconnects

Systems () and methods () for providing a compliant micro-coaxial interconnect with an integrated circuit or other electronic device. The methods comprise: forming a well () in a first substrate () having a first Coefficient of Thermal Expansion ('CTE'); forming at least one three-dimensional micro-coaxial interconnect () on the first substrate so as to have a cantilevered end portion () disposed over the well; and using a first coupler () to electrically couple the cantilevered end portion to a second substrate () having a second CTE different from the first CTE. The cantilevered end portion has an angled joint () so that at least one of a pushing force and a pulling force applied thereby to the first coupler is minimized when mismatching movements of the first and second substrates occur.

Compliant high speed interconnects

A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.

Growing community of inventors

West Melbourne, FL, United States of America

Michael Raymond Weatherspoon