Delphi Technologies, Inc.

Delco Electronics Corporation

Michael Ray Witty

David W Ihms

Darrel Eugene Peugh

Wayne Anthony Sozansky

James M Rosson

Susan Acheson Mack

Joel D Hunt

Michael D Gibson

Robin L Sellers

Michael Patrick Meehan

The present invention relates to a method and apparatus for mounting electrical components to electric circuit boards. Specifically, the present invention relates to a method for mounting electrical components having near-zero standoff height to electrical printed circuit boards.

Process for attaching components with near-zero standoff to printed circuit boards

A process and combination of materials for underfilling a surface-mount IC device (12), such as a flip chip, for the purpose of increasing the thermal cycle fatigue life of the terminals (14) that attach the device (12) to a thin-laminate organic circuit board (10), such as a printed wiring board (PWB) or printed circuit board (PCB). The process parameters and materials, including the underfill (20), masking (22) and cleaning materials used, exhibit a synergistic effect that increases thermal cycle fatigue resistance to a level at which a flip chip processed in accordance with this invention is capable of reliably withstanding at least 1000 one-hour cycles between -40.degree. C. and 150.degree. C. The materials and the manner in which the device (12) and circuit board (10) are prepared for application of the materials are critical to eliminating tendencies for inconsistent reliability in underfilled SM devices.

Process for producing flip chip circuit board assembly exhibiting

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Yorktown, IN, United States of America

Michael Ray Witty