Mems Optical, Inc.

Morgan Research Corporation

Michael Ray Whitley

Michael Scott Kranz

Marty Ray Williams

Philip John Reiner

John Harchanko

David Renick Brown

Robert Faye Elliott

Zhili Hao

Jay A Hammer

Robert Faye Elliot

Mark Fowler

The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.

MEMS sensor suite on a chip

A MEMS based thermoacoustic cryo-cooler for thermal management of cryogenic electronic devices. The cryogenic cooling system can be integrated directly into a cryogenic electronic device. A vertical comb-drive provides an acoustic source through a driving plate to a resonant tube. By exciting a standing wave within the resonant tube, a temperature difference develops across a stack in the tube, thereby enabling heat exchange between heat exchangers. A tapered resonant tube improves the efficiency of the cooling system, compared with a simple cylinder configuration, leading to reduced harmonics and strong standing waves.

Miniature thermoacoustic cooler

Multi-levels are etched into silicon. The levels are etched through a combination of crosslinking photoresist, multiple photoresist patterning and development, wet etching and/or dry-etching. RIE, DRIE, and other etch techniques can be used during different steps. The multilevel structure may thereby be produced at commercially acceptable production rates allowing the method of the present application to be used in volume production of multilevel structures.

Method of making multilevel MEMS structures

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Madison, AL, United States of America

Michael Ray Whitley