Kemet Electronics Corporation

The Penn State Research Foundation

Medical University of South Carolina

Michael Randall

Azizuddin Tajuddin

Daniel E Barber

Pascal I Pinceloup

John D Prymak

Garry L Renner

James J Beeson

Ian Burn

Clive A Randall

Abhijit Gurav

Susan Trolier McKinstry

Corey Antoniades

Xilin Xu

Thomas Poole

Daniel J Skamser

John E McConnell

Chris Wayne

Hajime Nagata

Jay Moskowitz

Aiying Wang

Allen Hill

Peter Par Blais

Randal J Vaughan

Song Won Ko

Aiyang Wang

James J Baeson

Aziz Tajuddin

A dispenser device is generally provided for removable attachment to a flexible enclosure. In one embodiment, the dispenser device comprises a dispenser body which defines a cavity therein and a plurality of barrier sheets within the cavity defined by the dispenser body. The dispenser body is configured to be removably attached over a contact point or surface of the flexible enclosure (e.g., a curtain or the like).

Touch point area disposable contamination barrier dispensing device

A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.

Method of attaching an electronic device to an MLCC having a curved surface

The invention relates to a family of devices to be used for sanitizing switches. The device is placed around the periphery of the switch and contains a means for exposing the switch touch surfaces to UV light source local to the switch in order to maximize the exposure of the switch to the UV light source. Because the light is localized and directed toward the switch contact surfaces, the device may be used continuously while humans or animals are present without detrimental exposure to the UV light, ensuring a sanitary switch contact surface so as to reduce or prevent infection or disease resulting from transference of contamination from one person to another via contact transference with said switch surface.

Switch sanitizing device

The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO3 multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO3 dielectric layers and LaNiO3 internal electrodes are prepared, enabling dielectric layer thicknesses of 1 &#x3bc;&#x3bc;m or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.

Microcontact printed thin film capacitors

A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.

Electronic passive device

The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiOmultilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiOdielectric layers and LaNiOinternal electrodes are prepared, enabling dielectric layer thicknesses of 1 &#x3bc;m or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.

Metal solutions such as copper and nickel suitable for chemical solution deposition (CSD) are disclosed, and their manufacture into low resistivity thin metal films is disclosed. The films may be thermal processed at relatively low temperatures and may be co-fired with ultra low fire high K ceramic dielectrics.

Thin metal film conductors and their manufacture

A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.

A dielectric ceramic composition in a multilayer ceramic capacitor with a composition of formula:{[(CaO)(SrO)][(ZrO)(TiO)]}AE

C0G multi-layered ceramic capacitor

A capacitor array with a multiplicity of capacitors with terminations of alternating polarity wherein the terminations are arranged in M columns and N rows. A circuit is provided with terminations in a grid of L columns and K rows wherein the terminations are of alternating polarity with the proviso that a first terminal with L={acute over (&#x3b1;)}M has the same polarity as a second terminal with L={acute over (&#x3b1;)}M+1 wherein {acute over (&#x3b1;)} is an integer.

Interposer decoupling array having reduced electrical shorts

A low inductance multi-layer capacitor. The capacitor includes interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate includes two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.

Low inductance capacitor

A low inductance multi-layer capacitor. The capacitor comprises interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate comprises two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.

Growing community of inventors

Simpsonville, SC, United States of America

Michael Randall