Asm America, Inc.

Michael R Stamp

Frederick J AmRhein

Joseph C Pottebaum

Brian J Ebert

Arnold J Dale

Mark R Hawkins

Tony J Keeton

A vaporization chamber for a substrate processing system includes a main body, a cover member and a transition member. The main body is made of aluminum and defines a first inner surface, which defines, at least in part, a cavity. The cover member is also made of aluminum. The cover member defines a second inner surface, which also defines, at least in part, the cavity. The cover member includes a carrier gas cover inlet, a liquid source cover inlet, a source cover outlet which extends from a first outer surface through the cover member to the second inner surface. The transition member is made of stainless steel and has a transition outer surface and a transition inner surface. The transition inner surface is aluminum cladded. The cover member including a carrier gas cover inlet, a liquid source cover inlet, a source cover outlet which extend from a first outer surface through the cover member to second inner surface. The transition inner surface and the cover outer surface are welded together.

Bubbler for substrate processing

A vaporization chamber for a substrate processing system includes a main body, a cover member and a transition member. The main body is made of aluminum and defines a first inner surface, which defines, at least in part, a cavity. The cover member is also made of aluminum. The cover member defines a second inner surface, which also defines, at least in part, the cavity. The cover member includes a carrier gas cover inlet, a liquid source cover inlet, a source cover outlet which extends from a first outer surface through the cover member to the second inner surface. The transition member is made of stainless steel and has a transition outer surface and a transition inner surface. The transition inner surface is aluminum cladded. The cover member includes a carrier gas cover inlet, a liquid source cover inlet, a source cover outlet which extend from a first outer surface through the cover member to second inner surface. The transition inner surface and the cover outer surface are welded together.

One or more of three different measures are taken to preheat a wafer before it is loaded into direct contact with a wafer holder, in order to provide optimal throughput while reducing the risk of thermal shock to the wafer. The first measure is to move the wafer holder to a raised position prior to inserting the wafer into the reaction chamber and holding the wafer above the wafer holder. The second measure is to provide an increased flow rate of a heat-conductive gas (such as Hpurge gas) through the chamber prior to inserting the wafer therein. The third measure is to provide a power bias to radiative heat elements (e.g., heat lamps) above the reaction chamber.

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Chandler, AZ, United States of America

Michael R Stamp