Micron Technology Incorporated

Illinois Tool Works Inc.

Michael R Slaughter

David J Corisis

Leland R Nevill

Daniel Cram

Tracy V Reynolds

Jerrold L King

Darin L Peterson

Keith P McCall

Christie Dyan Larson

Valoris L Forsyth

John Caldwell

Mark A Tverdy

John E Vannortwick

Christopher E Casey

Michael R Forbis

Justin L Lawrence

James R Stoor

Jamie J Wanke

The disclosure relates to trays for the handling and shipping of computer chips, or similar microelectronic devices. The tray include a series of channels, each extending along a width of the tray. The channels include such devices as pins and clips for securing a thermoformed tape. The thermoformed tape includes pockets for storing the various computer chips, or similar microelectronic devices.

Devices and method for handling microelectronics assemblies

Pusher assemblies for use in microelectronic device testing systems and methods for using such pusher assemblies are disclosed herein. One particular embodiment of such a pusher assembly comprises a plate having a first side and a second side opposite the first side. An engagement assembly is removably coupled to the second side of the plate and positioned to contact a microfeature device being tested. The pusher assembly can include an urging member proximate the first side of the plate and configured to move the engagement assembly toward the device being tested. The pusher assembly can also include a heat transfer unit carried by the first side of the plate. In several embodiments, the pusher assembly can further include a plurality of pins carried by the engagement assembly such that the pins extend through the plate and engage the urging member to restrict axial movement of the urging member toward the device being tested.

Pusher assemblies for use in microfeature device testing, systems with pusher assemblies, and methods for using such pusher assemblies

Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a test socket includes a support surface and a plurality of apertures in the support surface corresponding to at least some of the interconnect elements of the microfeature device. The individual apertures extend through the test socket and are sized to receive a portion of one of the interconnect elements so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket. In one aspect of this embodiment, the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the apertures receive only a portion of the corresponding interconnect element.

Test sockets, test systems, and methods for testing microfeature devices

Devices and methods for holding a tray stack having a plurality of trays configured to carry and store microelectronic devices. Several devices in accordance with the present invention are particularly applicable to carrying a stack of JEDEC trays that have been loaded with a plurality of microelectronic devices. In one embodiment, the device is a tray retainer including a guide structure configured to allow the tray stack to move in a direction of a load/unload path, and to restrict lateral movement of the tray stack with respect to the load/unload path. The guide structure can have a first end, a second end, and an opening at least proximate to the second end. The guide structure, for example, can have first and second channel sections extending in the direction of the load/unload path. The second channel section can also face the first channel section. The tray retainer can also include a cross-member and a moveable retaining element. The cross-member can extend transverse to the load/unload path at least partially across a first region of the guide structure between the first and second channel sections. The cross-member can be spaced apart from the opening toward the first end of the guide structure. The moveable retaining element is positioned at a second region of the guide structure spaced apart from the cross-member. The retaining element can move between a storage position in which it obstructs the load/unload path and a load/unload position in which it does not obstruct the load/unload path.

Methods and apparatus for retaining a tray stack having a plurality of trays for carrying microelectronic devices

Methods and apparatus for retaining a tray stack having a plurality of trays for carrying microelectric devices

An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semicircle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.

Integrated circuit package alignment feature

An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semi-circle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.

Integrated circuit package including lead frame with electrically isolated alignment feature

Growing community of inventors

Boise, ID, United States of America

Michael R Slaughter