Apple Inc.

Michael R Monson

Lidu Huang

Colleen F Mischke

Nagarajan Kalyanasundaram

Anuranjini Pragada

Peng Chen

Pierre P Souloumiac

Alaa Al-okaily

Derek J Iredale

An electronic module includes an operational subunit, having upper, lower and lateral surfaces, and including one or more electronic components, which are adjacent to the lower surface of the operational subunit and generate heat when the module is in operation. A heat sink is disposed in proximity to the lower surface of the operational subunit. A heat spreader, including a continuous sheet of a heat-conducting material, is folded to wrap around the operational subunit so that a lower side of the sheet is interposed between the lower surface of the operational subunit and the heat sink and a lateral side of the sheet extends around at least one of the lateral surfaces of the operational subunit.

Efficient heat removal from electronic modules

Growing community of inventors

San Jose, CA, United States of America

Michael R Monson