W. L. Gore & Associates, Inc.

3m Innovative Properties Company

Supercomputer Systems Limited Partnership

Michael R Leaf

Gary Timothy Boyd

Nicholas A Johnson

Tri Dinh Pham

Haiyan Zhang

Steven H Kong

David B Noddin

Qingbing Wang

Joseph T Aronson

Robin E Gorrell

Donald G Hutchins

Randy E Haslow

William George Petefish

Jimmy Leong

Boydd Piper

Deepak N Swamy

Kevin L Stumpe

Optical diffusing films are made by microreplication from a structured surface tool. The tool is made using a 2-part electroplating process, wherein a first electroplating procedure forms a first metal layer with a first major surface, and a second electroplating procedure forms a second metal layer on the first metal layer, the second metal layer having a second major surface with a smaller average roughness than that of the first major surface. The second major surface can function as the structured surface of the tool. A replica of this surface can then be made in a major surface of an optical film to provide light diffusing properties. The structured surface and/or its constituent structures can be characterized in terms of various parameters such as optical haze, optical clarity, Fourier power spectra of the topography along orthogonal in-plane directions, ridge length per unit area, equivalent circular diameter (ECD), and/or aspect ratio.

Optical diffusing films and methods of making same

A method of forming a via in a laminated substrate by forming ablated material by laser drilling a via in a laminated substrate. The ablated material is deposited on a sidewall of the via. An ultrasonic treatment is applied to the drilled substrate thereby removing ablated material redeposited on sidewalls of the via.

Method for using ultrasonic treatment in combination with UV-lasers to

The invention relates to a method for cleaning vias in electronic component substrates prior to metallization thereof.

Method for preparing vias for subsequent metallization

The present invention relates to a process for metallizing features of an electronic component, where the metallized features, conductive pads, conductive traces, are coated and encapsulated with at least one metal layer and the features on the front side and the back side of the component have different thicknesses

Method for selectively plating an organic substrate

A method and apparatus for manufacturing large area multilayer interconnects for electronic substrates and circuit boards uses high density area array interconnections that are created by solid state diffusion. Two or more pretested subsections are electrically and mechanically joined together to simultaneously form a multilayer substrate without employing a flow-type connection where the conductive interconnect material is entirely in a liquid phase at some point during the joining process. Each substrate is comprised of a planar dielectric substrate having a plurality of conductive layers. On at least one surface of the substrate a conductive pad lay is formed having a plurality of interconnect pads. The interconnect pads are positioned at a uniform height above the surface of the dielectric substrate and include a base metal layer, a top metal layer with at least one of the conductive pad layers have a donor metal disposed on top of the top metal layer. When the conductive pad layers of two or more subsections are aligned and stacked together, the interconnect pads can be mechanically and electrically joined together using solid state diffusion to join the donor metal layer and the top metal layer to form an area array interconnection without bonding the surrounding dielectric substrate.

Multilayer interconnect system for an area array interconnection using

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Eau Claire, WI, United States of America

Michael R Leaf