Flipchip International LLC

Proteum Energy, LLC

Motorola Corporation

Motorola Mobility LLC

Michael R Johnson

Kenneth Andrew Dean

Scott V Johnson

Anthony Paul Curtis

Guy F Burgess

David Leigh Grottenthaler

Charles Robert Rapier

Dean C Hoaglan

Robert Terry Kennon

Yuan Lu

Jason S Steill

Adam Smith

Jay K Neutzler

Steven K Eddy

Ted Tessier

Kenneth Losch

Jason C Heikenfeld

Emmett Howard

A volume of natural gas including a volume of methane and a volume of other alkanes may be cleaned of the other alkanes using a steam reformer system to create synthesis gas.

Method and system for converting associated gas

An interconnect structure comprises a solder including nickel (Ni) in a range of 0.01 to 0.20 percent by weight. The interconnect structure further includes an intermetallic compound (IMC) layer in contact with the solder. The IMC layer comprises a compound of copper and nickel.

Wafer-level interconnect for high mechanical reliability applications

A decorative housing () for a mobile device () includes a first faceted cell () having a first angled electro-optic element () disposed therein. A second faceted cell () is adjacent the first cell () and has second angled electro-optic elements (). A liquid () is in fluid communication with each faceted cell () and moveable to a first position () in response to a first electric field () applied to one of the first and second electro-optic elements () and moveable to a second position () in response to a second electric field () applied to the other of the first and second electro-optic elements (). An electronic modulator () is coupled to the first electro-optic element () and the second electro-optic element () to electronically modulate between the first electric field () and the second electric field ().

Method and apparatus for providing a decorative surface

An interconnect structure comprises a solder including nickel (Ni) and tin (Sn), with the nickel in a range of 0.01 to 0.20 percent by weight. The interconnect structure further includes an intermetallic compound (IMC) layer in contact with the solder. The (IMC) layer comprises a compound of copper and nickel.

An apparatus for focusing electrons being emitted from a field emission device comprises a cathode metal layer () formed over a first portion of a substrate () to partially define a sidewall () for a trench () in a second portion of the substrate. A ballast layer () is formed over the second portion, the cathode metal layer (), and the sidewall (). A first dielectric layer () is formed over the ballast layer () in the first portion and a gate extraction metal layer () is formed thereover. At least one emitter () is formed above the substrate and in the trench () having the sidewall () defined by the first dielectric layer () and the cathode metal layer (). The ballast layer () extends along the sidewall and conductively contacts the cathode metal layer and the at least one emitter and provides a force that counteracts the sidewise pull of the gate extraction metal layer ().

Field emission display with electron trajectory field shaping

Growing community of inventors

Tempe, AZ, United States of America

Michael R Johnson