Texas Instruments Corporation

Michael R Head

Lawrence D Dyer

Douglas W Romm

Jerry B Medders

Tom G Gullett

Larry W Nye

Robert M Montgomery

Dempsey McGregor

The invention is directed to a manifold 10 that is used in conjunction with a die attach cure station for providing a 'quick cure' of the die mount adhesive, and for forcing contaminants away from the semiconductor die 33 surface. The manifold has an air put port 21 directly above the semiconductor die. Forced air is directed through the port. At each side of the forced port are vacuum ports 20,22 through which a vacuum is applied to draw air and heated die attach contaminants from the die surface. Air is also drawn from below and around the die mounting area to provide a stream of air that is drawn into the vacuum ports.

Quick cure exhaust manifold

An apparatus stacks semiconductor wafers and spacers and clamps them in an axial alignment for mounting in a semiconductor wafer edge polishing machine. After edge polishing, the apparatus separates the wafers and spacers and delivers them respectively into separate cassettes for further processing or recycling.

Semiconductor wafer stacking apparatus and method

Growing community of inventors

Calbert, OK, United States of America

Michael R Head