Advanced Micro Devices Corporation

Other

Globalfoundries Inc.

Advance Micro Devices, Inc.

Semicaps Pte Ltd

Advanced Mircor Devices, Inc.

Michael R Bruce

Rama Rao Goruganthu

Rosalinda M Ring

Brennan V Davis

Jeffrey David Birdsley

Victoria Jean Bruce

Daniel L Stone

Glen P Gilfeather

David Harry Eppes

Miguel Santana, Jr

Robert Powell

Thomas Chu

Charles F Hawkins

Srikar V Chunduri

Liang Kai Wang

Paiboon Tangyunyong

Jiann Min Chin

Richard Jacob Wilcox

Gregory A Dabney

Richard W Johnson

Larry Ross

Greg Dabney

Shawn M McBride

Edward I Cole

Choon Meng Chua

Lian Ser Koh

Soon Huat Tan

Arnold Y Louie

Ronald M Potok

Jason Mulig

Antonio Torres Garcia

Edward I Cole, Jr

Curtis Lynch

Edward Jr I Cole

Paiboon Tangyungong

Palaniappan Muthupalaniappan

Jacob Phang

Hoo-Yin Ng

David Bethke

The present invention is an unmanned aerial vehicle (UAV) monitoring system, comprising a UAV that monitors a surface of a water body while hovering over water body. UAV comprises an image sensor that captures a field-of-view (FOV) when one or more events are identified from a surface of water body and a first transceiver that transmits an encoded captured FOV. UAV monitoring system further comprises a base unit located at an elevated point in a water vehicle and configured to dock UAV. Base unit comprises a second transceiver that receives encoded FOV from first transceiver, a decoder that decodes received encoded FOV, a graphics processing unit that generates a three-dimensional rendering and virtual graphic animation based on decoded FOV, and a ground control unit that communicates generated three-dimensional rendering and virtual graphic animation to one or more display devices coupled to base unit.

Unmanned aerial monitoring vehicle

A method, system, and computer program product for precision probe positioning and testing of an integrated circuit. Methods, systems, and a computer program product implement techniques for determining a particular area of interest for precision probe positioning and testing where the particular area of interest comprises an area less than an entire area of the integrated circuit. Once the particular area of interest for testing has been determined, then a laser probe is steered or otherwise directed to illuminate a plurality of pixels within the area of interest so as to generate reflected signals corresponding to the illuminated pixels. Techniques are provided for measuring the reflected signals to determine information about the IC within the area of interest. CAD data or user data can be used to determine XY addressable pixel locations within the area of interest.

Precision probe positioning for at-speed integrated circuit testing using through silicon in-circuit logic analysis

A method, system, and computer program product for integrated circuit wafer and die testing. The method commences by selecting areas of interest accessible from a backside of an integrated circuit where the areas of interest correspond to electronic devices (e.g., gates or transistors or vias or pads). Then, using a small-beam light source such as a laser, illuminating the areas of interest and collecting the reflected signal returned from illuminated areas of interest. A processor analyses the reflected signal to determine logic states and timing information of the electronic devices and compares the determined logic states and timing information to a pre-determined logic pattern to identify one or more errors as observed from the actual electronic devices. Specific points within an area of interest are determined from CAD layout data, and the pre-determined logic patterns can be retrieved from CAD simulation data.

At-speed integrated circuit testing using through silicon in-circuit logic analysis

The present invention concerns a computer-implemented method and system that aides in reducing the amount of regret experienced when deciding between and amongst geographic areas having a suitable workforce. More specifically, the present invention includes a user selecting critical factors relating to worker demographics that define geographic areas. Data is returned to the user's computer as a virtual table and is a mixture of critical or informational factors qualifying all areas returning data. Each area is ranked according to the value of lowest returned index number, which gives the user a quick assessment of problematic critical factors for each area. Area utilities are created and give the user the ability to simultaneously compare all remaining areas to one another so that they may select at least one area amongst many with the smallest chance for a bad surprise. This reduces the regret of a user having to select one area over another having a suitable workforce for their business needs.

Method and system for informed decision making to locate a workforce

Various semiconductor devices and methods of testing such devices are disclosed. In one aspect, a method of manufacturing is provided that includes forming a bore from a backside of a semiconductor chip through a buried insulating layer and to a semiconductor device layer of the semiconductor chip. A conductor structure is formed in the bore to establish an electrically conductive pathway between the semiconductor device layer and the conductor structure. The conductor structure may provide a diagnostic pathway.

Semiconductor chip with backside conductor structure

A silicon photon detector device and methodology are provided for detecting incident photons in a partially depleted floating body SOI field-effect transistor () which traps charges created by visible and mid infrared light in a floating body region () when the silicon photon detector is configured in a detect mode, and then measures or reads the resulting enhanced drain current with a current detector in a read mode.

Silicon photon detector

Lithography using solid immersion lenses is disclosed. In one aspect, an apparatus is provided that includes a resist film that has a first side and a second and opposite side. One or more solid immersion lenses are positioned over the first side of the resist film. In another aspect, a method of manufacturing is provided that includes forming a resist film and exposing the resist film with radiation transmitted through one or more solid immersion lenses.

Solid immersion lens lithography

Various devices for mounting circuit devices and methods of making the same are provided. In aspect, a device is provided that includes a member for holding an integrated circuit. The member contains a first plurality of carbon nanotubes to enhance the thermal conductivity thereof. At least one conductor member projects from the member. In another aspect, a method of fabricating an interface for an electronic component is provided that includes forming a member containing a first plurality of carbon nanotubes and forming at least one conductor on the member.

Thermally conductive integrated circuit mounting structures

Analysis of a semiconductor die having silicon-on-insulator (SOI) structure is enhanced by accessing the circuitry within the die from the back side without necessarily breaching or needing to breach the thin insulator layer of the SOI structure. According to an example embodiment of the present invention, a portion of substrate is removed from the back side of a semiconductor die having a SOI structure and a backside opposite circuitry in a circuit side. An exposed region is formed where the substrate has been removed. A detectable response from the exposed region is induced, for example, by an electron beam, as a function of a portion of the active circuitry within the die.

Electrical probing of SOI circuits

A light reflected from a semiconductor die is used for enhanced control of substrate removal from the die. According to an example embodiment of the present invention, light reflected from a semiconductor die as it is undergoing substrate removal is used to detect the progress of the substrate removal process, and the removal process is controlled therefrom. In different embodiments, the reflected light is used to detect the removal of a portion of a layer of material in the die and to detect the removal of an entire layer of material.

Semiconductor die analysis as a function of optical reflections from the die

Defect analysis of a semiconductor die is enhanced in a manner that makes possible the viewing of spatial manifestations of the defect from virtually any angle. According to an example embodiment of the present invention, substrate is removed from a semiconductor die while simultaneously obtaining images of the portions of the die from which substrate is being removed. The images are taken at various points in the substrate removal process, recorded and combined together to form a three-dimensional image of selected portions of the die. The image is then used to view the selected portions, and the nature of one or more defects therein are analyzed.

Three-dimensional tomography

According to an example embodiment of the present invention a semiconductor die having a resistive electrical connection is analyzed. Heat is directed to the die as the die is undergoing a state-changing operation to cause a failure due to suspect circuitry. The die is monitored, and a circuit path that electrically changes in response to the heat is detected and used to detect that a particular portion therein of the circuit is resistive. In this manner, the detection and localization of a semiconductor die defect that includes a resistive portion of a circuit path is enhanced.

Resistivity analysis

The invention is directed to a system and method for analyzing an integrated circuit having silicon on insulator (SOI) structure. According to one example embodiment of the present invention, an optical beam arrangement is adapted to direct a modulated beam at a selected portion of the integrated circuit. The beam is sufficiently modulated to inhibit optical beam intrusion on the structure and operation of the integrated circuit. A reflected optical waveform response is obtained from the SOI selected portion. The inhibition of optical beam intrusion enhances the ability to analyze integrated circuits using an optical beam, making possible the use of analysis methods that otherwise would be difficult or even impossible to use.

Optical analysis of integrated circuits

Growing community of inventors

Austin, TX, United States of America

Michael R Bruce