Osram Oled Gmbh

Osram Opto Semiconductors Gmbh

Michael Popp

Marc Philippens

Richard Baisl

Christoph Kefes

Nina Riegel

Benjamin Krummacher

Tilman Schlenker

Andrew Ingle

Arndt Jaeger

Johannes Rosenberger

Günter Schmid

Markus Heinrich Klein

Karsten Heuser

Erwin Lang

Simon Schicktanz

Michael Fehrer

Ralf D Krause

Arvid Hunze

Philipp Schwamb

Stefan Seidel

Evelyn Trummer-Sailer

Egbert Hoefling

Egbert Höfling

Dieter Musa

Doreen Heppner

Fryderyk Kozlowski

Stefan Dechand

Günter Gieres

Benjamin Claus Krummacher

Markus Klein

A method is specified for production of an insulator layer. This method comprises the following process steps: A) providing a precursor comprising a mixture of a first, a second and a third component where&#x2014;the first component comprises a compound of the general  

Process for producing an insulator layer, process for producing an organic optoelectronic component comprising an insulator layer and organic optoelectronic component comprising an insulator layer

An optoelectronic component is provided with a carrier; a zinc oxide layer arranged on the carrier and having the first and second regions, wherein the first region is a first electrode structure which is doped with aluminum so that the first region is transparent and electrically conductive; an organic optically functional layer structure arranged at least partially over the first electrode structure; and a second electrode structure arranged at least partially over the organic optically functional layer structure. The first and second electrode structures electrically contact the organic optically functional layer structure. The zinc oxide layer has a lower doping in the second region than the first electrode structure. The zinc oxide layer is configured in the second region as a varistor layer structure, which is arranged between the first and second electrode structures and contacts the two electrode structures. The varistor layer structure adjoins the optically transparent first region.

Optoelectronic component and method for producing an optoelectronic component

An optoelectronic component may include a carrier, a first electrode over the carrier, an organically functional layer structure over the first electrode, a second electrode over the organically functional layer structure, and an encapsulation layer structure over the second electrode, the encapsulation layer structure encapsulating the organically functional layer structure and including a first layer structure facing toward the second electrode and a second layer structure facing away from the second electrode, the first layer structure alternately including first layers having a first expansion coefficient and second layers having a second expansion coefficient, which is not equal to the first expansion coefficient, and the second layer structure alternately including third layers having a third expansion coefficient and fourth layers having a fourth expansion coefficient, which is not equal to the third expansion coefficient.

Optoelectronic component with multilayer encapsulant CTE matched to electrode

An organic optoelectronic component includes an organic light-emitting element and an organic protective diode element. The organic light-emitting element includes an organic functional layer stack having at least one organic light-emitting layer between two electrodes. The organic protective diode element includes an organic functional layer stack having an organic pn-junction between two electrodes and is arranged on a shared substrate in laterally adjacent area regions with the organic light-emitting element.

Organic optoelectronic component

The invention relates to an organic optoelectronic component comprising a substrate () on which a first electrode (), then an organic functional layer stack () having at least one organic optoelectronic layer, and then a second electrode () are successively arranged. A thin film encapsulation () is arranged over the second electrode () and in addition to the second electrode (), at least one first intermediate layer () having a hardness which is different from the layer which is directly adjacent thereto is arranged between the organic functional layer stack () and the thin-film encapsulation ().

A method for producing an optoelectronic component may include forming an optoelectronic layer structure having a first adhesion layer, which comprises a first metallic material, above a carrier, providing a covering body with a second adhesion layer, which comprises a second metallic material, applying a first alloy to one of the two adhesion layers, the melting point of the first alloy being so low that the first alloy is liquid, coupling the covering body to the optoelectronic layer structure in such a way that both adhesion layers are in direct contact with the liquid first alloy, and reacting at least part of the liquid first alloy chemically with the metallic materials, as a result of which at least one second alloy is formed, which has a higher melting point than the first alloy, wherein the second alloy solidifies and fixedly connects the covering body to the optoelectronic layer structure.

Optoelectronic component and method for producing same

In various embodiments, an optoelectronic component is provided. The optoelectronic component may include a first electrode having a first electrically conductive substance, a second electrode having a second electrically conductive substance, and at least one active substance. The active substance is formed within a current path of the first electrode and/or the second electrode, and the active substance is set up to convert the first electrically conductive substance and/or the second electrically conductive substance to an electrically nonconductive substance or region.

Optoelectronic component, method for operating an optoelectronic component, and method for producing an optoelectronic component

Various embodiments may relate to an optoelectronic component, including an optoelectronic structure, which is designed to provide a first electromagnetic radiation, and a measuring structure, which is designed to measure electromagnetic radiation, wherein the measuring structure has an optically active structure and at least one electro-optical structure. The optically active structure is optically coupled to the optoelectronic structure. The optically active structure is designed to absorb an electromagnetic radiation in such a way that the optically active structure produces a measured signal from the absorbed electromagnetic radiation. The absorbed electromagnetic radiation at least partially includes the first electromagnetic radiation and/or at least one second electromagnetic radiation of an external radiation source. The electro-optical structure is designed in such a way that the electro-optical structure has an adjustable transmittance, such that the fraction of the second electromagnetic radiation incident on the optically active structure can be adjusted.

Optoelectronic component with adjustable light emission and method for producing the same

A method is specified for operating an organic optoelectronic component, which has at least one organic light-emitting element having an organic functional layer stack with at least one organic light-emitting layer between two electrodes and at least one organic light-emitting element having an organic light-detecting layer. These elements are arranged on a common substrate in laterally adjacent area regions. The at least one organic light-detecting element detects ambient light, which is incident onto the organic optoelectronic component. The intensity of the light emitted by the at least one organic light-emitting element is regulated depending on a signal of the at least one organic light-detecting element with a characteristic signal form.

Method for operating an organic optoelectronic component

An organic optoelectronic component and a method for operating the organic optoelectronic component are disclosed. In an embodiment the organic optoelectronic component includes at least one organic light emitting element including an organic functional layer stack having at least one organic light emitting layer between two electrodes and at least one organic light detecting element including at least one organic light detecting layer, wherein the at least one organic light detecting element and the at least one organic light emitting element are laterally arranged on a common substrate.

Organic optoelectronic component and method for operating the organic optoelectronic component

An organic optoelectronic component and a method for operating an organic optoelectronic component are disclosed. In an embodiment an organic optoelectronic component includes an organic light emitting element including an organic functional layer stack having an organic light emitting layer between two electrodes and an organic light detecting element including a first organic light detecting element including a first organic light detecting layer, and a second organic light detecting element including a second organic light detecting layer, wherein the organic light emitting element and the organic light detecting element are arranged laterally adjacent on a common substrate, wherein the first organic light detecting element is configured to detect ambient light, wherein the second organic light detecting layer of the second organic light detecting element is arranged between two non-transparent layers, the non-transparent layers shade the second organic light detecting layer of the second organic light detecting element from ambient light.

Organic optoelectronic component with a light emitting element and a light detecting element and method for operating such an organic optoelectronic component

An organic optoelectronic component and a method for operating the organic optoelectronic component are disclosed. In an embodiment an organic optoelectronic component includes at least one organic light emitting element, at least one first organic light detecting element including at least one first organic light detecting layer, and at least one second organic light detecting element including at least one second organic light detecting layer, wherein the at least one organic light emitting element, the at least one first organic light detecting element and the at least one second light detecting element are arranged laterally on a common substrate, wherein the at least one first organic light detecting element is configured to detect ambient light, and wherein the at least one second organic light detecting layer of the at least one second organic light detecting element is arranged between two non-transparent layers.

Various embodiments may relate to a method for producing an organic optoelectronic component, including forming a first layer on or over a substrate, the substrate including at least one contact pad of the organic optoelectronic component, at least one electrode of the organic optoelectronic component being electrically connected to the at least one contact pad, forming a second layer on or over the first layer, and removing at least the second layer in at least one region of the substrate with the first layer and the contact pad. The adhesion of the substance or of the substance mixture of the first layer on the interface with the substrate is less than the adhesion of the substance or of the substance mixture of the second layer on the interface with the substrate.

Method for producing an optoelectronic component and method for patterning an organic, optoelectronic component

Various embodiments may relate to an optoelectronic component device, including a first optically active structure, which is configured to provide an electromagnetic radiation, a measuring structure, which is configured to determine the luminance distribution of the electromagnetic radiation, wherein the measuring structure is configured to determine the luminance distribution in the first optically active structure, and wherein the measurement structure has a plurality of second optically active structures, wherein the plurality of second optically active structures are configured as optoelectric components and/or optoelectronic components, which receive the provided electromagnetic radiation.

Optoelectronic component device, method for producing an optoelectronic component device and method for operating an optoelectronic component device

An organic electronic device and a method of making an organic electronic device are provided. An embodiment of an electronic device includes a substrate, an active layer disposed on the substrate and a thin-layer encapsulation disposed on the active layer. The device further includes a first adhesive layer disposed on the thin-layer encapsulation, wherein the first adhesive layer comprises a getter material and a covering layer disposed on the first adhesive layer.

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Freising, Germany

Michael Popp