At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Michael Polic

Jonathan Silvano De Sousa

Bernhard Reitmaier

Gerhard Maringer

A heat pipe () for cooling an electronic device, especially a component carrier (), that comprises a central section () with a cavity () filled with a heat transfer fluid (). In longitudinal direction () of the heat pipe () directly connected with the central section () are a first end section () on a first end of the central section and a second end section () on the opposite second end of the central section, wherein the first end section and the second end section each comprise a landing structure () with a surface length (SL, SL, SL) and a surface width (SW, SW, SW) and wherein each landing structure is thermoconductively coupled with the central section of the heat pipe. A component carrier comprising at least one heat pipe for cooling it, and a method for producing the component carrier are also provided.

Growing community of inventors

Leoben, Austria

Michael Polic