Heraeus Noblelight Gmbh

Heraeus Noblelight America LLC

Michael Peil

Harald Maiweg

Florin Oswald

Susanne Schadt

Marcus Helmling

Darrin Leonhardt

Bernd Willer

David A Sprankle

Marcus Krauel

Johanna Heck

Jörg Diettrich

A method is provided for production of a module, including the steps of: providing a substrate () having a first surface () in the form of a translucent carrier; providing an open casting mold (), wherein the formation of at least one optical element () is provided in the casting mold (); covering the surface () with a polymeric casting compound () in the open casting mold, while forming the optical element from the casting compound (); and curing the casting compound in the casting mold, wherein the translucent carrier and the casting compound () together form an optical system ().

Method for producing an optical module having a polymer optical system

A device for applying radiation to a target is provided. The device includes a radiation emitter to emit electromagnetic radiation having a peak emission wavelength in the range from 10 nm-1 mm, and a first reflector that extends in a length direction with a concave cross section. The first reflector defines a cavity area having a perimeter, and includes an inward facing reflective border for at least 50% of the perimeter of the cavity area. Radiation is provided to the cavity area with an intensity distribution I and a maximum intensity I. The cavity area includes a focal area defined by all points at which a normalized intensity I/Iis greater than 0.2. A width of the focal area is 0.0001-0.5 times a width of the cavity area.

Device including a radiation emitter for applying radiation to a target, and related methods

An optical module is provided, including a substrate () of a defined shape, the substrate having two surfaces () opposite from each other and an edge (). A layer () covers at least one of the surfaces () of the substrate (). The layer () includes a transparent polymeric material and has at least one optical element () which scatters rays of light originating from the substrate and passing through the optical element (). A design feature for at least one of mounting and aligning () the optical module is provided in a mounting region of the layer and is the same material and the same part as the layer ().

Optical module with design feature for mounting

A lamp is provided having at least one module that includes a plurality of LEDs distributed over a module surface. The plurality of LEDs are arranged in a row of a plurality of rows in a longitudinal direction of the at least one module. Each of the plurality of rows are arranged next to each other in a transverse direction of the at least one module that is perpendicular to the longitudinal direction. The lamp includes an optical system for bundling the light emitted by the plurality of LEDs. The optical system includes at least one cylinder lens that extends in the longitudinal direction. The light of at least some of the plurality of LEDs from a first row of the plurality of rows is bundled into a line on a target surface by the at least one cylinder lens.

Luminaire with LEDs and cylindrical lens

The invention relates to an optoelectronic module, more particularly to an optoelectronic chip-on-board module. The optoelectronic module comprises a substrate, wherein the substrate has a planar design. Furthermore, the optoelectronic module comprises a plurality of optoelectronic components that are arranged on the substrate. Furthermore, the optoelectronic module comprises a lens system having a plurality of lenses. The lens system comprises at least two lenses with different directivities.

Optoelectronic module comprising a lens system

The invention relates to an optoelectronic module (), more particularly to an optoelectronic chip-on-board module (). The optoelectronic module () comprises a substrate (), wherein the substrate () has a planar design. Furthermore, the optoelectronic module () comprises a plurality of optoelectronic components () that are arranged on the substrate (). The optoelectronic module () further comprises at least one optical system () applied onto the substrate (), more particularly a microoptical system having a plurality of microoptical elements. The optical system () comprises at least one primary optical system () that is adjacent to the optoelectronic components () and at least one secondary optical system ().

Optoelectronic module with improved optical system

A device and method are provided for controlling the temperature, in particular for cooling, of an LED lamp or LED modules of an LED lamp, e.g., for curing a light-cured pipe. The device includes: a fluid supply line and multiple heat exchangers connected to the supply line; multiple LEDs coupled to each heat exchanger with respect to heat transfer; and a fluid return line. The fluid supply and return lines are connected to each other in a fluid-tight manner by various combinations of L-pieces and T-pieces in or at the ends of the fluid supply and the return lines, so that the fluid flows from the LEDs in a spatially separated way and the fluid supply and return lines have at least two parallel fluid connections to each other, the heat exchangers being arranged in the fluid connections or constituting the fluid connections.

Cooling device for cylindrical, coupleable LED modules

A lamp is provided including a first module and at least one second module, each having a plurality of LEDs distributed over a module surface. The modules are arranged on at least one cooling element for dissipation of lost heat. A reflector deflects light emitted by one of the modules into an exit opening of the lamp. An optical system located between at least some of the LEDs and the exit opening bundles the light of the LEDs into a defined structure on a target surface.

Lighting unit with reflector

A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement. The optoelectronic chip-on-board module is coated with a transparent, UV-resistant, and temperature-resistant coating made of silicone by the following steps: (a) casting a liquid silicone into a mold open towards the top and having outer dimensions corresponding to or exceeding outer dimensions of the substrate; (b) inserting the substrate into the mold, wherein the optoelectronic component(s) are immersed completely into the silicone and a surface of the substrate contacts the silicone completely or the substrate immerses into the silicone at least partially with full surface contact; (c) curing and cross-linking the silicone with the optoelectronic component(s) and the substrate; and (d) removing the substrate from the mold with the coating of cured silicone.

Optoelectronic chip-on-board module

A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.

A lighting device is provided for the uniform illumination of curved, uneven, or polyhedral surfaces. The lighting device has a plurality of flat chip-on-board LED modules, which are arranged adjacent to each other at least in pairs. Each chip-on-board LED module has a plurality of light-emitting LEDs. The lighting device is characterized by at least one pair of the adjacent chip-on-board LED modules being arranged at an angle greater than 0&#xb0; with respect to the surface normals of the modules.

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Otzberg, Germany

Michael Peil