Texas Instruments Corporation

Taiwan Semiconductor Manufacturing Comp. Ltd.

Michael Patrick Clinton

Theodore Warren Houston

Scott Robert Summerfelt

Steven Craig Bartling

Hugh Pryor McAdams

Vinod J Menezes

Lakshmikantha V Holla

Hugh Thomas Mair

Hung-Jen Liao

Cheng Hung Lee

Jonathan Tsung-Yung Chang

Chiting Cheng

Bryan David Sheffield

Donald George Mikan, Jr

Uming U Ko

Robert L Pitts

David J Toops

Keerthinarayan P Heragu

Marty Tsai

Rajinder Singh

Donald Mikan

Systems, devices, and methods are provided for enabling turbo mode for static random access memory (SRAM) devices. A cell circuit is coupled between a bit line pair and configured to perform read or write operations of a memory device. A sense amplifier circuit is coupled between the bit line pair and configured to sense a voltage differential between the bit line pair. A tracking circuit includes a tracking bit line (DBL) and is configured to monitor operation of the cell circuit and send a sense amplifier enable signal to the sense amplifier at a predetermined frequency rate based on a voltage level of the DBL. A turbo circuit is coupled to a turbo signal and configured to modify the voltage of the tracking bit line enabling sending of the sense amplifier enable signal at a rate faster than the predetermined frequency rate.

Turbo mode SRAM for high performance

A memory device includes an array of memory cells that has a first sub array and a second sub array. A plurality of bit lines are connected to the memory cells, and an IO block is situated between the first sub array and the second sub array. The bit lines extend from the first and second memory sub arrays of the memory device directly to the IO block. The IO block further includes data input and output terminals configured to receive data to be written to the array of memory cells and output data read from the array of memory cells via the plurality of bit lines.

SRAM memory having subarrays with common IO block

A dual rail memory operable at a first voltage and a second voltage, the dual rail memory includes: a memory array operates at the first voltage; a word line driver circuit configured to drive a word line of the memory array to the first voltage; a data path configured to transmit an input data signal or an output data signal; and a control circuit configured to generate control signals to the memory array, the word line driver circuit and the data path; wherein the data path and the control circuit are configured to operate at both the first and second voltages. Associated memory macro and method are also disclosed.

Dual rail memory, memory macro and associated hybrid power supply method

A memory circuit includes at least one bit cell that receives a word line, complementary bit lines and an array supply voltage and a word line suppression circuit. The word line suppression circuit includes two PFETs with their drains connected to the word line and their sources connected to the array supply voltage and an NFET with its source connected to ground and its drain connected to the word line. The NFET is inactivated before the PFETs are activated. One of the PFETs is activated before the other PFET is activated so as to control the slew rate of the word line and improve the static noise margin of the at least one bit cell.

Read assist for an SRAM using a word line suppression circuit

A memory circuit includes a bit cell that receives a word line, complementary bit lines and an array supply voltage; a word line driver coupled to the word line, the word line driver receiving the array supply voltage; and a word line suppression circuit coupled to the word line. The word line suppression circuit includes a diode and a first switch coupled in series and a second switch. The switches are responsive to a control signal. The word line suppression circuit limits a word line voltage to a value lower than the array supply voltage such that the static noise margin (SNM) of the bit cell is increased.

Read assist circuit for an SRAM, including a word line suppression circuit

A two-bit read-only-memory (ROM) cell and method of sensing its data state. Each ROM cell in an array includes a single n-channel metal-oxide-semiconductor (MOS) transistor with a source biased to a reference voltage, and its drain connected by a contact or via to one or none of first, second, and third bit lines associated with its column in the array. Each row in the array is associated with a word line serving as the transistor gates for the cells in that row. In response to a column address, a column select circuit selects one pair of the three bit lines to be applied to a sense line in wired-NOR fashion for sensing.

High-performance scalable read-only-memory cell

A computer program for generating a layout for a ferroelectric random access memory (FRAM) that is embodied on a non-transitory storage medium and executable by a processor is provided. FRAM specifications are received, and an FRAM floorplan and design rules are retrieved from the non-transitory storage medium. The layout for the FRAM based on the FRAM specifications and design rules is then assembled.

FRAM compiler and layout

A memory circuit includes a bit cell that receives a word line, complementary bit lines and an array supply voltage; a word line driver coupled to the word line, the word line driver receiving one of the array supply voltage and a periphery supply voltage; and a word line suppression circuit coupled to the word line. The word line suppression circuit includes a diode and a switch coupled in series. The switch is responsive to the array supply voltage. The word line suppression circuit limits a word line voltage to a value lower than the array supply voltage such that the static noise margin (SNM) of the bit cell is increased.

Read assist circuit for an SRAM

An FRAM device can comprise a sense amplifier, at least a first bitcell, a first control line, and a second control line. The first bitcell can have a bit line that connects to the sense amplifier via a first isolator and a complimentary bit line that connects to the sense amplifier via a second isolator that is different from the first isolator. The first control line can connect to and control the aforementioned first isolator. And the second control line can connect to and control the second isolator such that the second isolator is independently controlled with respect to the first isolator to facilitate testing the device.

Method and apparatus pertaining to a ferroelectric random access memory

An FRAM device can comprise a sense amplifier and at least a first bitcell. The first bitcell can have a bit line and a complimentary bit line that connects to the sense amplifier. A first precharge circuit responds to a first control signal during a test mode of operation to precharge the bit line with respect to a first voltage while a second precharge circuit responds to a second control signal (that is different from the first control signal) during the test mode of operation to precharge the complimentary bit line with respect to a test voltage that is different than the first voltage (such as, but not limited to, a test voltage of choice such as a voltage that is greater than ground but less than the first voltage).

A ferroelectric memory device includes a shunt switch configured to short both sides of the ferroelectric capacitor of the ferroelectric memory device. The shunt switch is configured therefore to remove excess charge from around the ferroelectric capacitor prior to or after reading data from the ferroelectric capacitor. By one approach, the shunt switch is connected to operate in reaction to signals from the same line that controls accessing the ferroelectric capacitor. So configured, the high performance cycle time of the ferroelectric memory device is reduced by eliminating delays used to otherwise drain excess charge from around the ferroelectric capacitor, for example by applying a precharge voltage. The shunt switch also improves reliability of the ferroelectric memory device by ensuring that excess charge does not affect the reading of the ferroelectric capacitor during a read cycle.

Ferroelectric memory with shunt device

A self-timed sense amplifier read buffer pulls down a pre-charged high global bit line, which then feeds data into a tri state write back buffer that is connected directly to the bit line. The bit line provides charge to a ferroelectric capacitor to write a logical 'one' or 'zero' while by-passing an isolator switch disposed between the sense amplifier and the ferroelectric capacitor. Because the sense amplifier uses grounded bit line sensing, the read buffer will not start pulling down the global bit line until after the sense amplifier signal amplification, which makes the timing of the control signal for this read buffer non-critical. The write-back buffer enable timing is also self-timed off of the sense amplifier. Therefore, the read data write-back to a ferroelectric memory cell is locally controlled and begins quickly after reading data from the ferroelectric memory cell, thereby allowing a quick cycle time.

Ferroelectric memory write-back

A memory array has a memory cell that comprises a storage element storing a logical state at a reduced voltage during at least one functional operation and a write access circuit configured to connect the storage element to at least a first write bit line in response to a write signal on the write word line for writing the logical state to the memory cell. The memory cell further comprises a read access circuit including an input node connected to the storage element and an output node connected to a read bit line of the memory array. The read access circuit is enabled and configured to read the logic state of the storage element in response to a read signal on the read word line. The reduced voltage is reduced relative to an operating voltage of at least one peripheral circuit associated with reading and/or writing of the memory cell.

Growing community of inventors

Allen, TX, United States of America

Michael Patrick Clinton