Rohm & Haas Electronic Materials LLC

Learonal, Inc.

Shipley Company LLC

Rohm and Haas Elcetronic Materials LLC

Michael P Toben

Neil D Brown

James L Martin

Nathaniel E Brese

Edit Szocs

Felix J Schwager

Robert K Barr

Yu Luo

Fred I Nobel

Martin William Bayes

Mark Lefebvre

Corey O'Connor

Leon Barstad

Wan Zhang-Beglinger

John E McCaskie

Thomas Gaethke

David J Esterl

Robert A Schetty

Elie H Najjar

Donald W Thomson

Margit Clauss

André Egli

Angelo B Chirafisi

Craig Robinson

Stephane Menard

Yasuo Ohta

Jonas Guebey

Yasushi Takizawa

Adolphe Foyet

James E Rychwalski

Keith J Whitlaw

George A Federman

Haruki Enomoto

Jeffrey N Crosby

Jan Fransaer

Robert A Schetty, Iii

Miriana Kanzler

Colleen A Doyle

Daniel C Marcktell

Linda Stappers

Leon R Barstad

Robert A Iii Schetty

Electroplating methods provide substantially uniform deposits of copper on the edges and walls of through-holes of printed circuit boards. The electroplating methods provide copper deposits which have high throwing power.

Method of electroplating uniform copper layers

Monocrystalline semiconductor substrates are textured with alkaline solutions to form pyramid structures on their surfaces to reduce incident light reflectance and improve light absorption of the wafers. The alkaline baths include hydantoin compounds and derivatives thereof in combination with alkoxylated glycols to inhibit the formation of flat areas between pyramid structures to improve the light absorption.

Texturing of monocrystalline semiconductor substrates to reduce incident light reflectance

Electrochemically deposited indium composites are disclosed. The indium composites include indium metal or an alloy of indium with one or more ceramic materials. The indium composites have high bulk thermal conductivities. Articles containing the indium composites also are disclosed.

Electrochemically deposited indium composites

Indium compositions including hydrogen suppressor compounds and methods of electrochemically depositing indium metal from the compositions onto substrates are disclosed. Articles made with the indium compositions are also disclosed.

Indium compositions

A thin indium metal layer is electroplated onto silver to prevent silver tarnishing. The indium and silver composite has high electrical conductivity.

Method of preventing silver tarnishing

A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.

High temperature resistant silver coated substrates

Methods are disclosed for replenishing tin and its alloying metals in an aqueous electrolytic plating bath using an acidic solution containing stannous oxide. During electroplating of tin or tin alloys the stannous ions and alloying metal ions are depleted. To maintain continuous and efficient electroplating processes predetermined amounts of the plating bath containing tin and its alloying metals are bailed out. The bail out is then mixed with a predetermined amount of acidic solution containing stannous oxide and any alloying metals. The mixture is then retuned to the plating bath to return the stannous ions and alloying metal ions to their steady state concentrations.

Method for replenishing tin and its alloying metals in electrolyte solutions

Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, a flavone compound and a dihydroxy bis-sulfide. The electrolyte compositions are free of lead and cyanide. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.

Lead-free tin alloy electroplating compositions and methods

A method for plating tin or a tin alloy on a substrate such that whiskers are prevented form forming or the number of whickers is reduced in number as well as size.

Tin plating method

An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described.

Electroplating composite substrates

Disclosed are compositions suitable for electroless gold plating including one or more water soluble gold compounds, one or more gold complexing agents, one or more organic stabilizer compounds, and one or more carboxylic acid uniformity enhancers. Methods of plating and methods of manufacturing electronic devices using these compositions are also provided.

Plating composition

The present invention provides methods for the use of copper electroplating compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Electrolytic copper plating method

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Smithtown, NY, United States of America

Michael P Toben