Intel Corporation

Kulicke & Soffa Holdings, Inc.

Other

Intel-ge Care Innovations LLC

Michael P Skinner

Sven Albers

Georg Seidemann

Teodora Ossiander

Bok Eng Cheah

Hans-Joachim Barth

Harald Gossner

Kooi Chi Ooi

Shanggar Periaman

Jackson Chung Peng Kong

Yen Hsiang Chew

Peter Baumgartner

David J Chazan

Jan I Strandberg

Ted T Chen

Achintya K Bhowmik

John D Porter

Jiun Hann Sir

Reinhard Mahnkopf

Yong She

Jiamiao Tang

Wolfgang Molzer

Junfeng Zhao

Bidhan P Chaudhuri

Christian Mueller

Gabel Chong

James L Lykins

Chan H Yoo

Mahmood Toofan

Ridza Effendi Abd Razak

Todd S Kaplan

Martha O Neustadt

Stephanie Simmons

Kheng Tat Mar

A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.

Flexible packaging architecture

Embodiments of flow diversion devices (FDDs) are disclosed herein. An FDD may include a body formed of a body material and a plurality of thermally deformable fins arranged along the body. Individual fins of the plurality of fins may include first and second materials having different coefficients of thermal expansion (CTEs). Other embodiments may be disclosed and/or claimed.

Flow diversion devices

Embodiments of the present disclosure are directed towards an integrated circuit (IC) package. In embodiments, an integrated circuit (IC) package may include a flexible substrate. The flexible substrate may have a plurality of dies coupled therewith. The IC package may include a first encapsulation material, having a first rigidity, disposed on the flexible substrate to at least partially encapsulate each die of the plurality dies. The IC package may further include a second encapsulation material, having a second rigidity, disposed on the flexible substrate. In embodiments, the second rigidity and the first rigidity are different from one another. Other embodiments may be described and/or claimed.

Flexible system-in-package solutions for wearable devices

Embodiments of the present disclosure are directed toward integrated circuit (IC) packaging techniques and configurations for small form-factor or wearable devices. In one embodiment, an apparatus may include a substrate having a first side and a second side disposed opposite to the first side and a sidewall disposed between the first side and the second side, the sidewall defining a perimeter of the substrate, and a plurality of through-substrate vias (TSVs) disposed between the first side and the second side of the substrate, and a first dielectric layer disposed on the first side and including electrical routing features to route electrical signals of one or more dies in a plane of the first dielectric layer. Other embodiments may be described and/or claimed.

Integrated circuit packaging techniques and configurations for small form-factor or wearable devices

Embodiments of the present disclosure are directed to integrated circuit (IC) package assemblies with magnetic contacts, as well as corresponding fabrication methods and systems incorporating such magnetic contacts. A first IC substrate may have a first magnet coupled with a first electrical routing feature. A second IC substrate may have a second magnet coupled with a second electrical routing feature. The magnets may be embedded in the IC substrates and/or electrical routing features. The magnets may generate a magnetic field that extends across a gap between the first and second electrical routing features. Electrically conductive magnetic particles may be applied to one or both of the IC substrates to form a magnetic interconnect structure that extends across the gap. In some embodiments, magnetic contacts may be demagnetized by heating the magnets to a corresponding partial demagnetization temperature (PDT) or Curie temperature. Other embodiments may be described and/or claimed.

Magnetic contacts

Embodiments of a flexibly-wrapped integrated circuit die device and a method for mounting a flexibly-wrapped integrated circuit die to a substrate are disclosed. In some embodiments, the flexibly-wrapped integrated circuit die device includes a substrate and a flexible integrated circuit die coupled to the substrate in a substantially vertical orientation with reference to a surface of the substrate.

Flexibly-wrapped integrated circuit die

An apparatus comprises a first integrated circuit (IC) die that includes a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, a second IC die including a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, wherein the second IC die is arranged adjacent to the first IC die, and includes an electrically conductive bond in contact with at least one of the top surface or the side surface of the multi-surface contact pad of the first IC die and the top surface of the multi-surface contact pad of the second IC die.

Die edge side connection

A tactile display may comprise an array of pins that may be raised in height relative to one another to represent contours of objects in a graphic image or picture when touched. Various physical attributes may be given to individual pins to represent color or brightness. For example, pins may be heated or cooled to represent cool or warm colors in the original image. Pins may also be vibrated or otherwise enhanced to represent color or brightness information in the original image.

Tactile display to allow sight impaired to feel visual information including color

An apparatus, system, and method for an excimer laser having lasing gas and electron emitters emitting electrons upon the application of an emitting voltage is described herein.

Excimer laser with electron emitters

Optical waveguides with power monitoring or optical detection capabilities are disclosed. The waveguide includes a lower cladding, a core disposed on the lower cladding, an upper cladding disposed on the core and a trench extending transversely through a distal end of the lower cladding, core and upper cladding. The trench includes a distal wall that provides a reflective surface disposed at an angle relative to the end of the core of greater than 90&#xb0;. A detector is disposed above the trench for receiving a reflected light beam off of the reflective surface. Various methods of manufacturing these devices are also disclosed.

Waveguides with optical monitoring

A dielectric layer in a wiring substrate having a sloped sidewall. A photomask used to pattern the dielectric layer includes optical proximity features. The size and spacing of the optical proximity features are generally less than the resolution limit of the exposure tool used and do not print out on the layer. The optical proximity features provide a transition region between fully exposed material and un-exposed material, which results in a sloped sidewall of the photo-sensitive material after development. The sloped sidewall provides a more reliable thin film metal layer to contact through vias, and may be used to conserve wiring board area by allowing smaller via spacing.

Wiring substrate features having controlled sidewall profiles

A liquid chemical formulation suitable for making a thin solid polycarbonate film contains polycarbonate material and a liquid typically capable of dissolving the polycarbonate material to a concentration of at least 1%. The polycarbonate material may consist of homopolycarbonate or/and copolycarbonate. Examples of the liquid include pyridine, a ring-substituted pyridine derivative, pyrrole, a ring-substituted pyrrole derivative, pyrrolidine, a pyrrolidine derativive, chlorobenzene, and cyclohexanone. A liquid film ( A) of the formulation is formed over a substructure ( ) and processed to remove the liquid. The resultant solid polycarbonate film can later serve as a track layer through which charged particles ( ) are passed to form charged-particle tracks ( ). Apertures ( ) are created through the track layer by a process that entails etching along the tracks. The aperture-containing polycarbonate track layer is typically used in fabricating a gated electron-emitting device.

Polycarbonate-containing liquid chemical formulation and methods for making and using polycarbonate film

Low-impedance high density deposited-on-laminate (DONL) structures having reduced stress features reducing metallization present on the laminate printed circuit board. In this manner, reduced is the force per unit area exerted on the dielectric material disposed adjacent to the laminate material that is typically present during thermal cycling of the structure.

Growing community of inventors

San Jose, CA, United States of America

Michael P Skinner