Motorola Corporation

Michael P Norman

Lawrence R Gardner

Paige M Holm

Franky So

Thomas B Harvey, Iii

Xiaodong T Zhu

Chengping Wei

Paul D Asetta

Michael S Lebby

Karen E Jachimowicz

Warren L Williamson

George W Rhyne

Cheng-Ping Wei

Matthew Kim

Rajiv Bajaj

James J Wang

Robert W Griffith, Jr

An array of OEDs is arranged in rows and columns with a plurality of row buses and a plurality of column buses. Each of the OEDs has a first terminal coupled to an associated row bus and a second terminal coupled to an associated column bus. A switching circuit is connected to a shadow canceling row bus of the plurality of row buses. The switching circuit is constructed to receive a shadow canceling signal on a terminal thereof and to connect the shadow canceling row bus to a pull down potential in response to the shadow canceling signal, whereby all of the OEDs in the array, other than those associated with the shadow canceling row bus, are coupled to the pull down potential and discharged.

Array of leds with active pull down shadow canceling circuitry

A precharge driver for light emitting devices with an associated capacitance, the precharge driver including a driver coupled to a light emitting device so as to supply a substantially square wave of current to the light emitting device and a precharge circuit coupled to the driver so as to activate the driver to supply a pulse of current to the associated capacitance of the light emitting device to rapidly charge the associated capacitance at an initial portion of the square wave of current, whereby a resultant substantially square wave of current is applied to the light emitting device.

Pre-charge driver for light emitting devices and method

Drive apparatus for an array of organic LEDs including first switches connectable between a current source or a rest potential, second switches connectable to a power source, an array of LEDs with each LED having a first contact connected to one of the first switches and a second contact connected to one of the second switches, and control apparatus connecting selected switches of the first switches to the current source while retaining all remaining switches of the first switches connected to the rest potential, and periodically connecting selected switches of the second switches, one at a time, to the power source to generate a desired image on the array.

Organic light emitting diode array drive apparatus

An interactive electronic game system (10) composed of at least one control unit (12) for receiving, monitoring, compiling and transmitting game data and information and several personal display units (14) for controlling game play and displaying game data and information. The personal display units (14) and the control unit (12) being in constant omni-directional communication. The personal display units (14) of the system having an aperture (100) formed therein, and capable of receiving and displaying game data and information in a direct view image and/or a virtual image.

Electronic game system

A smart driver in combination with an LED including a column driver coupled to one terminal of the light emitting device and a row driver coupled to another terminal of the light emitting device to form an addressed circuit. A controllable power supply having terminals coupled to the column and row drivers and a control terminal connected to control power applied between the terminals in response to a control signal supplied thereto. A control circuit coupling the addressed circuit to the control terminal and supplying a unique control signal thereto, whereby a unique amount of power is applied to the addressed circuit.

Smart driver for an array of LEDs

A method of fabricating an integrated multicolor organic LED array including providing a negative layer and patterning a plurality of different color LED organic layers, one at a time, on the negative layer to form a plurality of different color LEDs in a plurality of areas of a selected array. A first color LED organic layer is patterned on the negative layer in first areas and to define additional areas for additional LEDs laterally separated from the first color LEDs and a final color LED organic layer is deposited in final areas and on previously patterned layers to form a plurality of final color LEDs. Transparent positive contacts are then formed on the final color LED layer in the first and final areas so as to form positive contacts to the first and the final color LEDs.

Method of fabricating an integrated multicolor organic led array

A full color light emitting diode display (310) utilizes semiconductor light emitting diodes (313) to produce red light and organic light emitting diodes (312) to produce blue light. Green light is produced by either semiconductor light emitting diodes (313) or by organic light emitting diodes (331). An array of semiconductor light emitting diodes is formed on a semiconductor substrate (322) and an array of organic light emitting diodes is also formed on semiconductor substrate (322) adjacent to the array of semiconductor light emitting diodes. The array of organic light emitting diodes cooperates with the array of semiconductor light emitting diodes to form an array of multi-wavelength pixels of the full color light emitting diode display (310).

Full color light emitting diode display

A full color light emitting diode display (310) utilizes semiconductor light emitting diodes (313) to produce red light and either organic or semiconductor light emitting diodes (312) to produce blue light. Green light is produced by either semiconductor light emitting diodes (313) or by organic light emitting diodes (343). An array of semiconductor light emitting diodes is formed on a semiconductor substrate (322) and an array of organic or semiconductor light emitting diodes is formed on an optically transparent substrate (311). The optically transparent and semiconductor substrates are attached together to form the multi-wavelength light emitting diode display (310).

Full color light emitting diode display assembly

An integrated multicolor organic LED array formed by providing a negative layer and patterning a plurality of different color LED organic layers, one at a time, on the negative layer to form a plurality of different color LEDs in a plurality of areas of a selected array. A first color LED organic layer is patterned on the negative layer in first areas and to define additional areas for additional LEDs laterally separated from the first color LEDs and a final color LED organic layer is deposited in final areas and on previously patterned layers to form a plurality of final color LEDs. Transparent positive contacts are then formed on the final color LED layer in the first and final areas so as to form positive contacts to the first and the final color LEDs.

Integrated multicolor organic led array

A semiconductor wafer (40) is placed in a first pressure chamber (37) of a bonding apparatus (10 or 60). A major surface (46) of a submount (44) is placed on a submount support (30 or 62). The major surface (46) of the submount (44) seals the first pressure chamber (37). A pressure differential is generated between the first pressure chamber (37) and a second pressure chamber (47) The pressure differential bows a central portion of the submount (44) toward the semiconductor wafer (40). The central portion of the submount (44) contacts an adhesive coating over a central portion of the semiconductor wafer (40). The submount support (30 or 62) is displaced to decrease a curvature on the submount (44). The pressure differential is increased to an end-point to facilitate bond formation between the semiconductor wafer (40) and the submount (44).

Method for mounting a wafer to a submount

An apparatus (60) which handles fragile semiconductor wafers (21) adhesively mounted to a submount (22) using a high temperature wax is provided. The apparatus (60) includes a vacuum chuck (24) for holding a first surface of the wafer (21) and a solvent chamber (11, 11') for applying solvent to the back surface of the submount (22). The apparatus (60) includes an enclosure (29) for providing an inert gas environment around the solvent chamber (11, 11'), the wafer (21), and the vacuum chuck (24). The apparatus (60) further includes a means for remounting (30) the wafer (21) to a submount (22) using a low temperature wax after the high temperature wax is dissolved. The wafer (21) is then released from the vacuum chuck (24) and the first surface of the wafer (21) is mounted to an adhesive tape (34). Following the mounting, the low temperature wax is dissolved or melted to demount the wafer (21 ) from the submount (22), leaving the wafer (21) securely mounted on the adhesive tape (34) for sawing.

Apparatus and method for handling fragile semiconductor wafers

A wax (13) dissolved in solvent is placed on a semiconductor wafer (12) and made uniform. An assembly is formed by bonding the semiconductor wafer (12) to a submount (17) with a uniform wax layer (14). The submount (17) supports and allows handling of the semiconductor wafer (12) during wafer process steps. The assembly is heated in a vacuum to remove solvent and air trapped in the uniform wax layer (14) thereby minimizing air voids which can cause a non-uniform bond. The assembly is then annealed to reduce stress on the semiconductor wafer (12) induced by differing material thermal expansion rates of the semiconductor wafer (12), the uniform wax layer (14), and the submount (17).

Semiconductor wafer wax mounting and thinning process

A method for fabricating an angled diffraction grating (12) is provided. An optical medium (13) with fine lines and spaces that are defined in an etch mask is provided. Transferring the defined lines and spaces of the etch mask into the optical medium (13) at a desirable angle is achieved by an etching means, thereby resulting in an angled diffraction grating (12).

Growing community of inventors

Chandler, AZ, United States of America

Michael P Norman