Raytheon Company

Michael P Martinez

Joseph R Ellsworth

Craig H McCordic

Scott R Cheyne

Jeffrey Paquette

Brett A Miller

Michael T Borkowski

Kenneth P Walsh, Jr

Kassam K Bellahrossi

Erin K Nolan

Christopher J Yafrate

Thomas Lulsdorf

Derek P Rocca

Bryan J Cavener

Stephen J Pereira

Craig Richardson

Mark J Beaulieu

Michael R Trahan

A radar array assembly is provided, comprising a first chassis and a first vertical stiffener. The first chassis is configured to house a first set of array electronics and a second set of array electronics. The first vertical stiffener is disposed within and operably coupled to the first chassis to enable the first chassis to be resistant to buckling and to define a first cavity in which the first set of array electronics is disposed and a second cavity in which the second set of array electronics is disposed, wherein the first vertical stiffener is configured to be embedded within the first set of array electronics and the second set of array electronics, wherein the first vertical stiffener comprises a first integrated cooling manifold configured to cool both the first set of array electronics and the second set of array electronics.

Integrated structure, two radar modular assembly (RMA) stackable radar

A system and apparatus is provided for a modular radar system. The modular radar system can include a plurality of radar system modules that can be detachably coupled and can include a configurable number of radio-frequency (RF) transmit and receive assemblies. The RF transmit and receive assemblies can include radiating element(s) that emit electromagnetic radiation. The plurality of radar system modules can also include at least one processor coupled to control power of the electromagnetic radiation and/or at least one controller to control the RF transmit and receive assembly, the power unit and the digital receiver and exciter module, at least one digital receiver and exciter to convert RF to digital in receive mode, and digital to RF in transmit mode, and/or at least one RF beamformer to generate one or more RF beams.

Systems and methods for modular radar systems

A tuned mass absorber assembly comprises a mass structure, and a flexure system comprising first and second flexure sections (e.g., cross bar flexures) supported by, and extending in opposing directions from, the mass structure. The flexure system can comprise flexure section mounts situated at distal ends of the first and second flexure sections, respectively, and that are operable to mount the tuned mass absorber assembly to a structure subject to induced vibrations therein. A mass of the mass structure and a stiffness of the flexure system can be tuned to attenuate vibrations at a specific input frequency generated in response to induced vibrations of the structure. A system can comprise a vibration isolator attached to a chassis (e.g., of an airplane), and supporting a payload (sensors(s)) and isolating the payload from vibrations. A tuned mass absorber assembly can be mounted to the vibration isolator for attenuating vibrations at a specific input frequency that may affect the payload.

Tuned mass absorber assembly and system for attenuating frequency specific vibrational energy

In one aspect, a radar array assembly includes two or more vertical stiffeners each having bores with threads and a first radar module. The first radar module includes radar transmit and receive (T/R) modules and a chassis having channels configured to receive a coolant. The chassis includes shelves having ribs. The ribs have channels configured to receive the coolant and the ribs form slots to receive circuit cards disposed in parallel. The circuit cards include the T/R modules. The chassis also includes set screws attached to opposing sides of the chassis. The set screws have bores to accept fasteners to engage the threads on a corresponding one of the two or more vertical stiffeners. The first radar module is configured to operate as a stand-alone radar array.

Modular architecture for scalable phased array radars

A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.

Heat sink interface having three-dimensional tolerance compensation

A printed circuit board (PCB) assembly is provided. The PCB assembly is adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device. The PCB assembly has a top surface and a bottom surface and comprises a signal carrying layer and an insert of pyrolytic graphite (PG). The signal carrying layer, disposed between the top surface and the bottom surface, comprises a material that is both thermally conductive and electrically conductive (such as at least one of aluminum, copper, and silver and alloys thereof) and has at least a portion lying in a first plane. The insert of PG is disposed within at least a portion of the first plane of the signal carrying layer, is in thermal contact with the signal carrying layer, and is constructed and arranged to have its greatest electrical conductivity in the first plane. Optionally, a conductive via can be formed in portions of the signal carrying layer not occupied by the insert of PG, where the conductive via operably couples a first side of the signal carrying layer to a second side of the signal carrying layer.

High performance power device

Growing community of inventors

Worcester, MA, United States of America

Michael P Martinez