Apple Inc.

Michael P Coleman

Fletcher R Rothkopf

Mattia Pascolini

Tang Yew Tan

David A Pakula

Colin M Ely

Erik G De Jong

Jayesh Nath

Jason C Sauers

Carlo Di Nallo

Charles B Woodhull

Mario Martinis

Bryan Patrick Kiple

Richard Walter Heley

Rex Tyler Ehman

Zheyu Wang

Hoishun Li

Brian M Gable

Thomas Johannessen

Henry B Wettersten

Craig A Horton

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Components of an electronic device and methods for their assembly

A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.

Coupling structures for electronic device housings

Growing community of inventors

Cupertino, CA, United States of America

Michael P Coleman