Sundstrand Corporation

Ford Motor Company Limited

Other

Michael P Ciaccio

Allan Roy Gale

Timothy J Bland

Jerry E Amey

R Scott Downing

An electronic control module includes an EMI baffle in the form of openings formed in laterally spaced portions of the cold plate supporting the electronic circuits. Preferably, upper and lower plates of the cold plate define a limited access baffle chamber with openings that require rerouted travel of any leakage radiation emanated by terminals or conductors carried by couplers inserted into the cold plate openings or passing through the openings. Preferably, each coupler is inserted through openings having an inlet axis in the cold plate and the module packaging covers are secured to the cold plate between an inlet and an outlet opening in the cold plate. Accordingly, simple gaskets may be used to seal the covers against the cold plates and the couplers against the cold plate. Moreover, the cold plate coolant passage has inlets and outlets that remain exposed exteriorly of the covers to avoid exposure of the internal circuitry to leakage.

EMI baffle for electronic control

An electrical system comprises an inverter, a three-phase electric motor and a cable to transfer energy from the inverter to the motor. The cable further comprises a center conductor and two additional conductors disposed about the center conductor. Insulators physically and electrically separate the conductors from one another. Electromagnetic emissions from the cable are substantially prevented due to the construction of the cable.

Multiple-phase electrical system

An electrical device to be electrically mounted to a cooling mounting structure so that the electrical device is in intimate physical contact with the mounting structure for cooling the electrical device. The electrical device having a first pivot allowing contact for allowing the electrical device to be pivoted as it is mounted to the cooling mounting structure so that the electrical device is in intimate physical contact with the cooling mounting structure and for providing an electrical connection to the cooling mounting structure and the electrical device further having a second nonpivot allowing contact having a shape for providing electrical contact with the mounting structure when the electrical device is in intimate physical contact with the cooling mounting structure.

Pivotable electrical connection apparatus

A cooling rack is provided for cooperating with a chassis, the chassis having both electrical and fluid connectors, the fluid connectors being interconnected by a manifold for distributing cooling fluid to and from the rack, the rack having a cooling support including at least one electrical component cooling pad, a rack manifold for circulating cooling fluid to the cooling pad, a rack electrical connector, a rack inlet fluid connector in fluid communication with the rack manifold for receiving cooling fluid from the chassis to be circulated through the rack manifold for cooling the cooling pad, and a rack outlet fluid connector in fluid communication with the rack manifold for returning cooling fluid from the rack manifold to the chassis so that the cooling fluid can be recooled, wherein the rack electrical connectors, the rack inlet fluid connector, and the rack outlet fluid connector are arranged so that, when the cooling rack is attached to the chassis, the rack electrical connector, the rack inlet fluid connector, and the rack outlet fluid connector will mate generally in unison with the respective chassis electrical connector and chassis fluid connectors.

Cooling rack for electronic devices

A multi-layered cold plate is customized for cooling a plurality of electronic components to be arranged in thermal communication with the cold plate by dividing the cold plate into a plurality of hypothetical cooling zones, determining the cooling needed for the respective cooling zones for cooling the electronic components adjacent the zones, and tailoring a heat exchanger layer of the multi-layered cold plate with different heat exchanger structures in respective cooling zones to provide relatively high and relatively lower efficiency cooling where needed. A coolant flow, jet impingement heat exchange structure formed of alternately stacked orifice plates and spacer plates provides the high efficiency cooling. The heat exchanger layer is the only layer of the cold plate which must be customized for accommodating a particular arrangement of electronic components to be cooled.

Cold plate for cooling electronics

Leakage of fluid from a heat exchanger and fluid mixing in the case of a two fluid compact high intensity cooling heat exchanger are prevented by diffusion bonded areas of the heat exchanger formed using small locally raised borders which extend about the fluid passage or passages of the heat exchanger to form raised contact portions that experience locally high stresses during diffusion bonding thereby insuring material flow and complete bonding. The thickness of the locally raised borders is the same as or slightly greater than the tolerance of the rolled sheet material used to form the laminates of the heat exchanger whereby local deviations in thickness of the thin laminates will not result in non-bonded areas.

Growing community of inventors

Canton, MI, United States of America

Michael P Ciaccio