Intel Corporation

Michael P Brownell

Dan R McCutchan

Hong Xie

William A Samaras

Leonard O Turner

Glen Patrick Gordon

Frank Kolman

Paul T Phillips

Larry B Wheeler

James G Maveety

Gregory Turturro

Richard Michael Ramirez

Nagesh K Vodrahalli

Kevin J Haley

Jim Maveety

Bill Samaras

James G Maveery

A method of assembling a multi-chip device may include coupling solder balls only to selected ones of the conductive pads on an interposer with cache memory devices. The cache memory devices are then tested, and the interposer is coupled to a substrate with the solder balls for further assembly only if the test is passed.

Method of assembling a multi-chip device

The invention in one particular embodiment is a bracket including a base having an opening shaped to accommodate a socket for an integrated circuit device; and at least one containment member rigidly extending from the base to define a void shaped to accommodate the integrated circuit. In another embodiment, a method for mounting an integrated circuit device to a printed circuit board comprises affixing a bracket to the printed circuit board; mounting a socket to the printed circuit board; and coupling the integrated circuit to the socket, the integrated circuit being vertically and laterally constrained by the bracket.

Mounting bracket for integrated circuit device

In an embodiment of the present invention, an apparatus to eject a semiconductor package from a semiconductor package socket includes a package ejector coupled to a semiconductor package socket. The package ejector can include an ejector cam and be coupled to an upper surface of the semiconductor package socket.

Semiconductor package ejector

An electrical socket connection for coupling a conductive pin to a circuit board. The socket has several contact points that can be expanded to create an opening sufficiently sized to allow the conductive pin to pass through the contact points with minimal insertion force. After the pin is inserted, the contact points can be retracted to form electrical interconnects with the pin. The contacts are electrically coupled to the remaining circuitry via the socket. The present invention, therefore, provides a zero insertion force socket that has multiple contact points and does not require secondary movement of the pin or circuit package.

Fixed position ZIF (zero insertion force) socket system

Embodiments of the present invention can dissipate heat and include a top wall including a plurality of hollow fins, a bottom wall, and a plurality of side walls that define an inner cavity. A plurality of condenser regions can be located within the inner cavity, and each one of the plurality of condenser regions can be located within one of the plurality of hollow fins. The inner cavity also can include an evaporator region adjacent said bottom wall.

Heatpipesink having integrated heat pipe and heat sink

A tool which accurately controls the thickness of a thermal grease applied to an integrated circuit that is mounted to a printed circuit board. The tool includes a bracket that supports the printed circuit board and the integrated circuit. A thermal grease is applied to the top surface of the integrated circuit. A lid is attached to the bracket to capture the printed circuit board. The lid has a platen that is separated from the integrated circuit by a space which has a predetermined thickness. The space defines the thickness of the thermal grease. Any excess thermal grease is pushed out of the space by the lid so that a consistent thickness of thermal grease is applied for each integrated circuit assembly. The bracket, lid, integrated circuit and printed circuit board can be mounted to a motherboard as a single integrated circuit module. Alternatively, the lid can be detached from the base so that the grease covered integrated circuit can be removed from the tool for subsequently assembly.

Controlled bondline thickness attachment mechanism

An integrated circuit cartridge has been described. The cartridge includes a heat pipe lid that comes in thermal contact with at least one integrated circuit die. The integrated circuit die is mounted on a substrate that is held in a cavity of a pin chassis that has a grid array of pins for interconnection with a socket. The integrated circuit die can be mounted on a secondary substrate that is mounted to a primary substrate. The substrate has an edge connector to supply power to the integrated circuit die, freeing the grid array of pins to be used for signal interconnects. The substrate has a grid of connections soldered to the grid array of pins on the pin chassis. The pin chassis also supplies key structures that aid in alignment of the pins and a socket.

Integrated circuit cartridge

The invention in one embodiment is a zero insertion force socket including a base; a cover engaged with the base to reciprocate in first and second directions; and a lever pivotably mounted to the base to move the cover in the first direction when the lever is pivoted laterally from a first position to a second position. In another embodiment, the invention is a printed circuit board assembly including a printed circuit board; a zero insertion force socket surface mounted to the printed circuit board; and a processor coupled to the zero insertion force socket.

Zero insertion force socket and method for employing same to mount a

A land grid array (LGA) carrier includes an interposer having a first surface and a second surface opposite the first surface, with a plurality of locations on the first surface adapted to receive a plurality of semiconductor dice and passive components. The second surface has a plurality of conductive pads coupled thereto.

Multi-chip land grid array carrier

An integrated circuit package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is enclosed by a cover plate that is attached to the substrate. The cover plate is separated from the integrated circuit by a small space. The cover plate has a pair of ports which allow a thermal grease to be injected into the space between the integrated circuit and the cover plate. The package has a seal that extends around the integrated circuit between the cover plate and the substrate. The seal controls and confines the thermal grease to an area immediately adjacent to the integrated circuit.

Thermal grease insertion and retention

Printed circuit board mounting assembly and a method for mounting an

An apparatus for removing heat from the backside of a packaged flip chip. In one embodiment, the top side of an integrated circuit die is mechanically and electrically coupled to the top surface of a package substrate via a plurality of solder bump interconnections. A heatsink is supported above the backside surface of the die and the package substrate by standoffs. The height of the standoffs is selected to produce a gap between the heatsink and the backside of the die. The gap is filled with a highly conductive heat transfer medium, such as a thermal grease, to provide a heat path between the die and the heatsink. A spring clip flexibly attaches the heatsink to the package by providing a force to the heatsink to seat the standoffs against the top surface of the package substrate.

Apparatus for attaching a heat sink to the back side of a flip chip

A printed circuit board assembly that has a heatpipe. The assembly includes an integrated circuit package that is mounted to a printed circuit board. The heatpipe is attached to a plastic mold that is mounted to the printed circuit board. When assembled to the circuit board, the heatpipe is thermally coupled to the integrated circuit package. The plastic mold is lightweight and relatively inexpensive to produce. The mold also provides enough structural rigidity to prevent warping of the heatpipe.

Injection molded thermal interface system

An integrated circuit package which has a heat pipe that is incorporated into the body of the package. The package contains an integrated circuit which is mounted to a package substrate. The integrated circuit die is enclosed by a cover plate that is attached to the substrate. The heat pipe is attached to a nut that is screwed into the cover plate. The heat pipe has a bottom surface that is thermally coupled to the die to provide a direct thermal path between the integrated circuit and the heat pipe.

Growing community of inventors

Los Gatos, CA, United States of America

Michael P Brownell