Xerox Corporation

Michael Overton

Richard H Bruce

William F Gunning

Jean A Gastinel

A multi-level hierarchical bus architecture implemented with a multi-chip package and a modular shared-bus provides high bandwidth. All IC components are mounted on standardized multi-chip packages. Each multi-chip package includes bus interface chips for providing communication from the integrated circuits to a board bus. One multi-chip package contains additional bus interface circuitry for providing communication from the board bus to a backplane bus.

Growing community of inventors

Palo Alto, CA, United States of America

Michael Overton