Ultratech Stepper, Inc.

Ultratech, Inc.

Cornell University

Thin Film Electronics Asa

The State University of New York

Cornell Research Foundation Inc.

Medical University of South Carolina

Memorial Sloan Kettering Cancer Center

Sandia Corporation

Michael O Thompson

Somit Talwar

Yun Yu Wang

David A Markle

Andrew M Hawryluk

Shahyaan Desai

Hans Gude Gudesen

Per-Erik Nordal

Iqbal A Shareef

Boris Grek

Johan Carlsson

S Leigh Phoenix

Anil N Netrvali

Ulrich B Wiesner

Mark David Poliks

Richard Hiram Womack

Ivelin A Angelov

James N Turner

Igor Landau

Andrzej Krol

G&ouml;ran Gustafsson

Krishna Mandal

Steve Czarnecki

Senquan Zhou

C Ross Schmidtlein

Geirr Ivarsson Leistad

Christer Karlsson

Anil N Netravali

Göran Gustafsson

Kenneth S Grabowski

Per Hamberg

Neil R Sorensen

Rudolph G Buchheit, Jr

Byungki Jung

Kwan Wee Tan

Marc Murphy

R Bruce Van Dover

Staffan Björklid

Robert Bell

Timothy J Renk

Donna Cowell Senft

Hitesh Arora

Peter A Beaucage

A method providing direct access to porous three-dimensionally (3D) continuous polymer network structures and shapes by combining BCP-resol co-assembly with COlaser-induced transient heating. The COlaser source transiently heats the BCP-directed resol hybrid films to high temperatures at the beam position, inducing locally controlled resol thermopolymerization and BCP decomposition in ambient conditions. This enables shaping of BCP-directed porous resin structures with tunable 3D interconnected pores in a single process. Pore size can be varied from 10 nm to about 600 nm.

Porous resin structures

Provided is room temperature stable &#x3b4;-phase BiO. Ion conductive compositions comprise at least 95 wt % &#x3b4;-phase BiO, and, at 25&#xb0; C., the compositions are stable and have a conductivity of at least 10S/cm. Related methods, electrochemical cells, and devices are also disclosed.

Method of making room temperature stable &#x3b4;-phase bismuth(III) oxide

A method for fabricating a nanostructure utilizes a templated monocrystalline substrate. The templated monocrystalline substrate is energetically (i.e., preferably thermally) treated, with an optional precleaning and an optional amorphous material layer located thereupon, to form a template structured monocrystalline substrate that includes the monocrystalline substrate with a plurality of epitaxially aligned contiguous monocrystalline pillars extending therefrom. The monocrystalline substrate and the plurality of epitaxially aligned contiguous monocrystalline pillars may comprise the same or different monocrystalline materials. The method provides the nanostructure where when the monocrystalline substrate and the plurality of epitaxial aligned contiguous monocrystalline pillars comprise different monocrystalline materials having a bulk crystal structure mismatch of up to about 10 percent, lattice mismatch induced crystal structure defects may be avoided interposed between the monocrystalline substrate and the plurality of epitaxially aligned contiguous monocrystalline pillars, which may have an irregular sidewall shape.

Monocrystalline epitaxially aligned nanostructures and related methods

A system and method for imaging gamma- and x-ray, and charged particles sources employing a three dimensional array of scintillation elements arranged surrounding an emission source. According to a preferred embodiment, each element of the array comprises a scintillator element, a solid-state photon detector, and processing electronics to output an electronic signal. The elements may be efficiently packed in both the X-Y plane and stacked in the Z-axis, to provide depth of interaction information. The elements of the array are preferably hierarchically arranged with control electronics provided together for subarray modules (e.g., an n&#xd7;m&#xd7;1 module), and synchronization electronics provided at a larger scale. The modules preferably communicate with a control system through a shared addressable packet switched digital communication network with a control and imaging system, and receive control information from that system through the network.

Autonomous gamma, X-ray, and particle detector

A microelectromechanical structure (MEMS) device includes a secondary MEMS element displaceably coupled to a substrate. A primary MEMS element is displaceably coupled to the secondary MEMS element and has a resonant frequency substantially equal to the secondary MEMS element and has a much larger displacement than the secondary MEMS element.

Coupled MEMS structure for motion amplification

Fibrous micro-composite materials are formed from micro fibers. The fibrous micro-composite materials are utilized as the basis for a new class of MEMS. In addition to simple fiber composites and microlaminates, fibrous hollow and/or solid braids, can be used in structures where motion and restoring forces result from deflections involving torsion, plate bending and tensioned string or membrane motion. In one embodiment, fibrous elements are formed using high strength, micron and smaller scale fibers, such as carbon/graphite fibers, carbon nanotubes, fibrous single or multi-ply graphene sheets, or other materials having similar structural configurations. Cantilever beams and torsional elements are formed from the micro-composite materials in some embodiments.

Fibrous micro-composite material

Apparatus and method for performing laser thermal annealing (LTA) of a substrate using an annealing radiation beam that is not substantially absorbed in the substrate at room temperature. The method takes advantage of the fact that the absorption of long wavelength radiation (1 micron or greater) in some substrates, such as undoped silicon substrates, is a strong function of temperature. The method includes heating the substrate to a critical temperature where the absorption of long-wavelength annealing radiation is substantial, and then irradiating the substrate with the annealing radiation to generate a temperature capable of annealing the substrate.

Laser thermal annealing of lightly doped silicon substrates

A chuck for supporting a wafer and maintaining a constant background temperature across the wafer during laser thermal processing (LTP) is disclosed. The chuck includes a heat sink and a thermal mass in the form of a heater module. The heater module is in thermal communication with the heat sink, but is physically separated therefrom by a thermal insulator layer. The thermal insulator maintains a substantially constant power loss at least equal to the maximum power delivered by the laser, less that lost by radiation and convection. A top plate is arranged atop the heater module, supports the wafer to be processed, and provides a contamination barrier. The heater module is coupled to a power supply that is adapted to provide varying amounts of power to the heater module to maintain the heater module at the constant background temperature even when the wafer experiences a spatially and temporally varying heat load from an LTP laser beam. Thus, heat from the laser is transferred from the wafer to the heat sink via the heater module and the insulator layer. In the absence of any laser heating, heat is also transferred from the heater module to the wafer as needed to maintain the constant background temperature.

Heated chuck for laser thermal processing

Chuck methods and apparatus for supporting a semiconductor substrate and maintaining it at a substantially constant background temperature even when subject to a spatially and temporally varying thermal load. Chuck includes a thermal compensating heater module having a sealed chamber containing heater elements, a wick, and an alkali metal liquid/vapor. The chamber employs heat pipe principles to equalize temperature differences in the module. The spatially varying thermal load is quickly made uniform by thermal conductivity of the heater module. Heatsinking a constant amount of heat from the bottom of the heater module accommodates large temporal variations in the thermal heat load. Constant heat loss is preferably made to be at least as large as the maximum variation in the input heat load, less heat lost through radiation and convection, thus requiring a heat input through electrical heating elements. This allows for temperature control of the chuck, and hence the substrate.

Laser thermal processing chuck with a thermal compensating heater module

A heat shield () that facilitates thermally processing a substrate () with a radiation beam () is disclosed. The heat shield is in the form of a cooled plate adapted to allow the radiation beam to communicate with the substrate upper surface () over a radiation beam path (BP), either through an aperture or a transparent region. The heat shield has an operating position that forms a relatively small gap () between the lower surface () of the heat shield and the upper surface of the wafer. The gap is sized such that the formation of convection cells () is suppressed during substrate surface irradiation. If convection cells do form, they are kept out of the radiation beam path. This prevents the radiation beam from wandering from the desired radiation beam path, which in turn allows for uniform heating of the substrate during thermal processing.

Heat shield for thermal processing

Apparatus and methods for thermally processing a substrate with scanned laser radiation are disclosed. The apparatus includes a continuous radiation source and an optical system that forms an image on a substrate. The image is scanned relative to the substrate surface so that each point in the process region receives a pulse of radiation sufficient to thermally process the region.

Laser scanning apparatus and methods for thermal processing

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Ithaca, NY, United States of America

Michael O Thompson