Hewlett-packard Company

Michael O King

Marvin S Keshner

Thomas W Von Alten

Steven Mark Johnson

Burce J Jackson

An electromagnetic actuator has a U-shaped yoke with substantially parallel legs and a keeper which is pivotally mounted for angular movement about an axis located outside of the yoke to move between two angular positions bridging the yoke legs. The proximal end of the keeper adjacent the pivot has a side face which confronts the end of one pole leg forming a variable length gap called the proximal gap, and, the distal end of the keeper has an end face which confronts a side pole face of the other leg of the yoke forming a gap, called a distal gap, the length of which changes very little between and in the two angular positions of the keeper. The torque constant over the displacement range between the two angular positions of the keeper only slightly changes. The design permits keeper movement through a large angle while minimizing operational current requirements.

Dual gap electromagnetic actuator having a bypassing pole gap and a

Closer spacing of the disks in a disk stack of a disk drive is achieved by joining together the reinforcing plates, sometimes called swage plates, of pairs of load beams of the actuator arm structure to form a transducer suspension assembly of an integrated pair of load beams, each load beam having a distal end flexibly mounting a transducer The transducer of each integrated load beam pair are aligned with each other and face in opposite directions. A load beam extension at the load beam end opposite the distal end of each extends beyond the reinforcing plate. These load beam extensions in each transducer suspension assembly are spaced apart by the thickness of the two reinforcing plates and span the thickness of an actuator arm of the actuator arm structure. The load beam extensions are joined to the opposite faces of the actuator arm. The transducers fit between and confront the surfaces of adjacent axially spaced disks in the disk stack. Joining of the load beam extensions to the opposite faces of the actuator arm may be accomplished by bonding agents such as adhesives, swaging, or by welding, the latter where both the actuator arm and the load beams are of materials that may be welded together.

Disk drive transducer suspension assembly of reduced thickness

The invention is a method of packaging whole or large silicon wafers that provides support for the wafer, eliminates thermally or package-induced wafer strain, and allows selection of a mounting substrate material that provides optimal heat conduction.

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Boise, ID, United States of America

Michael O King