Microsoft Technology Licensing, LLC

Apple Inc.

Meta Platforms Technologies, LLC

Other

Michael Nikkhoo

Tzu-Yuan Lin

Erin Elizabeth Hurbi

Igor Markovsky

Dongli Zeng

Brian Toleno

John Christopher Collins

Vijayasekaran Boovaragavan

Amir Salehi

Brian Joseph Toleno

Shahar Ben-Menahem

Wyeman Chen

Michael Beerman

Michael Nathaniel Rosenblatt

Gloria Lin

Roy Joseph Riccomini

Ziv Wolkowicki

Doug Heirich

Maosheng Ye

Jahan C Minoo

Hong Peng Wang

Christopher Matthew Werner

Andrew Bart Hodge

Andrew Bert Hodge

Joseph Daniel Taylor

Shobhit Verma

Anthony P N Bidmead

Hunter Cantrell

Hammid Mohammadinia

Ravi Kiran Nalla

Nicholas George Merz

Douglas Lea Heirich

Dennis R Pyper

Andriy Pletenetskyy

Vivek Sahu

Marianne E Laford

Simon Hodgson

Hammid Mahammadinia

Vijayasekaran Booveragavan

Dong Woo Kim

Patrick Codd

Vijay Boovaragavan

Marianne Elizabeth La Ford

Renee Wu

Brian J Toleno

Michael Neil Beerman

Erin Hurbi

A polyimide-based heat pipe is described. In examples, the heat pipe may include a first substrate including raised features on a surface of the substrate. In examples, the first substrate is covered with a second substrate or cover. At least the second substrate comprises polyimide. An outer surface of the heat pipe, e.g., the second substrate, includes one or more antennas disposed thereon.

Heat pipe including an integrated antenna

A method and system to conduct thermal energy between two hinged portions of an electric device. In examples, the method employs a thermal hinge system configured to transfer or spread thermal energy, and optionally electrical energy, through a mechanical articulation or hinge in an electronic device. A thermal hinge may include a thermally conductive living hinge, complementary and/or mating thermal interface components, or a combination of both.

Systems and methods for controlling thermal energy between hinged portions of electronic devices

A flexible thermal conduit includes a first material extending along an axial length of the thermal conduit, the first material having a first thermal conductivity, a second material encasing at least a portion of the first material, the second material having a second thermal conductivity that is less than the first thermal conductivity, and a thermally conductive silicone molded over at least a portion of the first material and the second material such that the thermally conductive silicone forms the first end and the second end of the thermal conduit. The thermal conduit may be used in electronic device, such as a wearable device, to transmit heat from a heat source (e.g., a processor) to a thermal ground (e.g., a housing).

Thermal conduit for electronic device

An interposer equipped with a heat spreader and a multi-board system for an electronic device that includes an interposer equipped with a heat spreader between at least two boards. In examples, the interposer may include a heat spreader having an active portion and, optionally, a passive portion. In examples, the active portion may include a vapor chamber, heat pipe, or isothermal plate. In examples, the passive portion may thermally couple the active portion to a heat dissipation device such as a heat sink and/or an outer frame of the electronic device.

Stack-PCB architecture with embedded vapor chamber

A wearable device includes a housing having a cavity and a thermal interposer disposed within the cavity of the housing and thermally coupled to the housing to draw thermal energy from one or more electrical components of the wearable device and to transfer the thermal energy to the housing.

Thermal interposer for electronic device

Thermal hinge system

An electronic device includes an electronic component, a thermal ground, and a thermal interface material having a first side coupled to the electronic component and a second side coupled to the thermal ground, such that the thermal interface material draws thermal energy from the electronic component and transfers thermal energy to the thermal ground. The thermal interface material includes a body comprising thermally conductive silicone, the body disposed in thermal contact with the electrical component, and the thermally conductive silicone having a first thermal conductivity, and a plurality of thermally conductive fibers disposed within the body of the thermal interface material, the thermally conductive fibers having a second thermal conductivity greater than the first thermal conductivity.

Thermal interface material for electronic device

A multi-board system for an electronic device that includes an heat spreader between at least two boards. In examples, the multi-board system may include a stack-PCB architecture on one side of the heat spreader and one or more boards on an opposite side of the heat spreader from the stack-PCB. The heat spreader may comprise a vapor chamber and/or include a graphite layer or core to transfer heat along a length of the heat spreader.

Stack-PCB design and midplane architecture

Examples are disclosed that relate to sealing a heat pipe. One example provides a heat pipe including a heat pipe body having a sealed end at which opposing interior surfaces of the heat pipe body are joined, a sealant located in a least a portion of the sealed end of the heat pipe body between the opposing interior surface, the sealant having a higher oxygen transport rate than the heat pipe body, and a permanent seal forming an outer surface of the sealed end.

Sealing a heat pipe

A vapor-chamber that includes a porous microstructure sheet with varying surface energy across different regions to optimize utilization of a working fluid. Modulating the surface energy of the porous microstructure sheet can minimize the amount of the working fluid that becomes trapped in the condenser region(s) and maximize an aggregate thin-film evaporation area of the working fluid in the evaporator region(s). The condenser region of the vapor-chamber is treated so that the internal surfaces have low surface energy. For example, the treatment may cause the condenser region to become hydrophobic to minimize the amount of fluid that becomes trapped in the condenser. The evaporator region is treated so that the internal surfaces have high surface energy. For example, the treatment may cause the evaporator region to become hydrophilic to induce the formation of large numbers of robust (e.g., dry-out resistant) thin-film evaporation sites.

Two-phase thermodynamic system having a porous microstructure sheet with varying surface energy to optimize utilization of a working fluid

A vapor chamber includes an electromagnetic (EM) shielding layer. The vapor chamber is constructed from a structural base material that provides for a suitable size, strength, and/or weight for a specific application. The vapor chamber is treated at the region(s) to provide suitable EM shielding characteristics for the specific application. For example, an oxidation layer is removed from the region(s) to expose the structural base material while the vapor chamber is in an inert environment that prevents further oxidation. Then, while the vapor chamber remains within the same inert environment, a material having suitable electrical conductive properties is deposited onto the exposed structural base material to form an EM shielding layer at the region(s). When the vapor chamber is installed into an electronic device, the EM shielding layer may be electrically grounded so as to isolate one or more components within the electronic device from EM signal interference.

Vapor chamber having an electromagnetic shielding layer and methods of manufacturing the same

Disclosed is a fit system for improving users' comfort with wearable articles, such as head-worn articles. The fit system includes a lattice of collapsible beams that can be constructed of elastomer foam located at the interface between the wearable article and a part of the user's body. The collapsible beam construction provides a non-linear relationship between the amount of force or pressure applied on the body part and the amount of compression of the foam.

Fit system using collapsible beams for wearable articles

A formable structure comprises a first material having a first level of viscosity and a second material having a second level of viscosity, wherein the second material is formed to hold at least a portion of the first material in a particular position or a particular shape. The first material can be configured to function as a thermal interface between two or more hardware components. The second material can be configured to have a higher viscosity than the first material. In one illustrative example, the second material can include a light-activated resin that is configured to harden when exposed to one or more treatments. By the use of the first material and second material, the techniques disclosed herein are adaptable to gaps having a wide range of sizes, which is difficult to do with traditional thermal interface materials. The second material can also function as an EMI shield.

Formable interface and shielding structures

A pad shape for a support assembly is optimized to provide universal fitting characteristics to Head-Mounted Display (HMD) devices. The pad shape enables a display of a single HMD device to be reliably aligned within multiple users' fields-of-view notwithstanding significant variations of shape and size between these users' heads. Optimal positioning of the display within the multiple users' fields-of-view may be achieved by positionally constraining the HMD device against a portion of the head that varies relatively slightly as compared to other portions of the head. The contact pad includes a curved region having a shape defined by a high order polynomial that corresponds to an empirically determined best fit surface. Empirically determining one or both of the best fit surface or the high order polynomial may include aligning a plurality of 'forehead' point clouds that map the geometries of a sample set of users' foreheads.

Support assembly pad shape for providing universal fitting head-mounted display devices

A two-phase thermodynamic system includes a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid. The porous microstructure sheet may be disposed at a liquid-vapor boundary of the working fluid. The porous microstructure sheet has 'micro' pores through which the working fluid flows from a liquid flow path on one side of the porous microstructure sheet to a vapor flow path on the other side of the porous microstructure sheet. Individual pores induce the working fluid to form thin-film evaporation regions. The porous microstructure sheet may have a pore density so as to increase an aggregate thin-film evaporation area of the working fluid. In this way, the overall thermal resistance across all liquid-vapor interfaces (menisci) of the working fluid is substantially decreased over conventional vapor chamber.

Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid

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Saratoga, CA, United States of America

Michael Nikkhoo