Litton Systems, Inc.

Burndy, LLC

Advanced Interconnections Corporation

Integrated System Technologies, LLC

Framatome Connectors USA Inc.

Advanced Interconnection Corporation

Michael N Perugini

Erol D Saydam

Gary D Eastman

Raymond A Prew

Robert M Bradley

Alfred J Langon

Rocco J Noschese

Carmine Gugliotti

David H Romatzick, Jr

Michael P Driscoll

William R Keller

Yuetchin Hoi

Thomas I Crilly, Iii

Charles A Toye, Jr

Alfred J Langdon

An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals. The intercoupling component may include a cavity located between signal contacts to adjust the differential impedance between signal contacts.

High speed, high density interconnection device

Methods of manufacture of interconnection devices that include using a non-forming process to manufacture a plurality of compression contacts, each compression contact including a cantilevered beam portion that is tapered along its length, and disposing each of the plurality of contacts within a respective cavity in a substantially planar carrier housing lying in a plane defined by x and y axes, the housing having an upper surface and a lower surface, each cavity extending between the upper and lower surfaces of the housing substantially along a z axis, each contact being loosely retained within its respective cavity such that an entirety of the contact in a compressed state has at least some freedom of movement along the x and y axes.

Method of manufacturing an interconnection device

An interconnection device includes a carrier housing formed of non-conductive material and has at least one cavity extending through the housing. Within the cavity is disposed a non-formed compression contact that has a cantilevered beam portion that is tapered along its length. The may be tapered such that that deflection of the beam occurs across substantially the entire length of the beam when a compression force is applied to the contact. The contact may be installed in the housing such that it has some freedom of movement in the x, y, and z directions.

Interconnection device

An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.

An intercoupling component for receiving an array of contacts includes a non-conductive substrate having a plurality of holes disposed on its upper surface and arranged in a predetermined footprint corresponding to the array of contacts. Contacts are disposed within the holes and a cavities, which may be open to air or filled with some other dielectric material, are disposed in the substrate between adjacent contacts.

Disclosed is an electrical interconnect system using multiple grounding methods to reduce or prevent spurious signals from interfering with high density contacts carrying high speed transmissions. A first connector includes an insulative pillar partially surrounded by a plurality of signal contacts. A ground contact is at least partially located within the insulative pillar. A second connector includes a corresponding plurality of flexible signal contacts for mating with the signal contacts adjacent the insulative pillar. The second connector also includes a ground contact for receiving the ground contact of the first connector. The ground contacts provide a first method of providing a ground path to reduce spurious signals from entering the signal path. An electrically conducting shield is located outside the signal contacts when the first and the second connectors are mated. The first connector includes a member which provides a ground path between the first connector and the electrically conducting shield. Advantageously, the electrical interconnect system has two grounding methods which are particularly important in a high density electrical interconnect system where the contacts are closely spaced and susceptible to noise and other spurious signals.

High density electrical interconnect system having enhanced grounding and cross-talk reduction capability

An electrical cable connector is disclosed for connecting a plurality of electrical conductors to a printed circuit board. The cable connector includes a cable socket connector having a plurality of female insulation displacement contacts which can be mated with male signal-carrying pins contained in a pin shroud on a printed circuit board. The cable socket connector is comprised of a hood which retains two or more wafers. Each wafer contains a plurality of insulation displacement contacts. The cable socket connector may include a latch for securing the cable socket connector to the pin shroud and shielding to prevent extraneous signals from being transmitted into the circuits on the printed circuit board through the cable connector. The cable connector also includes an arrangement for keying the cable socket connector to the pin shroud to control the location of insertion of the cable socket connector into the pin shroud.

Electronic cable connector

An electrical connector for a printed circuit board having a housing and a combined electrical contact and housing mount assembly. The assembly has a first member and a second member. The first member passes through the housing. A ledge on the first member is located on a ledge of the housing. The second member is connected to the second member such that they can sandwich a portion of the printed circuit board therebetween. The bottom of the first member extends past a bottom portion of the housing to make electrical contact with a contact pad on the printed circuit board.

Electrical connector with combined electrical contact and housing mount

The tool has a frame and a positioner. The frame has top and bottom guide rails that are suitably sized and located to be slidingly received in guide channels of a printed circuit board receiving cage. A locking latch is provided on the frame to stationarily, but removably latch the frame to the receiving cage. The positioner is movably attached to the frame and has a working head receiving area. The working head receiving area is adapted to removably mount any one of a plurality of working heads to the positioner. The positioner is adapted to move an attached working head to a desired location for inserting and/or removing an electrical contact in an electrical connector of the cage, or inserting and/or removing an electrical connector in the cage.

Tool for on-site repairing and/or replacing of electrical connectors

A device for attaching a heat sink to a chip having an integrated circuit and a pin grid array socket. The device includes a leaf spring pre-assembled to two plastic clips, each of the plastic clips containing a portion which is adapted to extend below the socket, thereby releasably securing the heat sink to the chip and the socket.

Appliance for attaching heat sink to pin grid array and socket

A card edge connector having spring contacts that are partially movable by insertion of a circuit board into the connector. The contacts include two contacts that electrically contact each other when a circuit board is not connected to the connector. The two contacts are moved by insertion of a circuit board into the connector which results in disconnection of the electrical contact between the two contacts. This allows a signal contact to be contacted and grounded by a ground contact while the connector is not in use and, nonetheless allows independent ground and signal functions of the two contacts when a circuit board is connected to the connector.

Card edge connector with switching contacts

A fastening system for securing an article to a base uses a conventional drive fastener. A reaction surface on the article contacts the bearing surface on the underside of the fastener head causing the fastener head to tilt relative to the body of the fastener. The reaction surface also causes the body of the drive fastener to deform when it is fully driven into the article, and a portion of the material from the reaction surface is displaced into the aperture to increase the retention force of the fastener.

Growing community of inventors

Monroe, CT, United States of America

Michael N Perugini